公开(公告)号：US09721902B2

公开(公告)日：2017-08-01

申请号：US14836301

申请日：2015-08-26

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Wei Jiang ,  Yiwei Ma ,  Jinpei Ju ,  Hongmei Hu ,  Qin Gong

IPC: H03F1/30 ,  H03F3/19 ,  H01L23/552 ,  H01L23/057 ,  H01L23/36 ,  H01L23/66 ,  H01L23/00

CPC classification number: H01L23/552 ,  H01L23/057 ,  H01L23/36 ,  H01L23/66 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2223/6611 ,  H01L2223/6644 ,  H01L2224/291 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48195 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/1421 ,  H01L2924/15153 ,  H01L2924/16152 ,  H01L2924/16153 ,  H01L2924/16251 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/00012 ,  H01L2924/014 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: The present disclosure relates to a radio frequency (RF) unit of a base station, and more particularly, to a method of manufacturing an RF power amplifier module, an RF power amplifier module, an RF module, and a base station. The RF power amplifier module includes at least a power device, a power circuit board, a heat-dissipation substrate, and input/output ports. A power device die of the power device and the power circuit board are mounted on the heat-dissipation substrate. The power device die is connected to the power circuit board through packaging lead wires. In one exemplary embodiment, a heat-dissipation effect and manufacturing efficiency of the RF power amplifier module are improved and a cost of the RF power amplifier module is reduced.

公开(公告)号：US11929550B2

公开(公告)日：2024-03-12

申请号：US17273833

申请日：2019-08-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Yiwei Ma ,  Rongbiao Su ,  Yuanwei Wang

IPC: H01Q1/24 ,  H01Q1/38 ,  H01R13/24 ,  H01R13/405 ,  H01R13/502

CPC classification number: H01Q1/38 ,  H01R13/24 ,  H01R13/405 ,  H01R13/502

Abstract: A radio frequency (RF) connector includes an insulating portion configured in a cylindrical shape; an outer conducting portion configured in a cylindrical shape and disposed to surround an outer circumferential surface of the insulating portion; and an inner conducting portion disposed inside the insulating portion in a hollow shape and having both ends protruding from the insulating portion, the insulating portion electrically separating the outer conducting portion from the inner conducting portion.