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1.发明申请公开(公告)号：US20060252843A1
公开(公告)日：2006-11-09
申请号：US11485295
申请日：2006-07-13
申请人： Tohru Fujinawa , Masami Yusa , Satoyuki Nomura , Hiroshi Ono , Itsuo Watanabe , Motohiro Arifuku , Hoko Kanazawa
发明人： Tohru Fujinawa , Masami Yusa , Satoyuki Nomura , Hiroshi Ono , Itsuo Watanabe , Motohiro Arifuku , Hoko Kanazawa
CPC分类号： H05K3/323 , C08F283/006 , C08F290/067 , C08G18/4018 , C08G18/4238 , C08G18/4277 , C08G18/4854 , C08G18/6607 , C08G18/672 , C08G18/8175 , C08L51/08 , C08L75/04 , C09J4/06 , H01L24/29 , H01L2924/14 , H01L2924/15788 , H05K2201/0154 , C08G18/42 , C08L2666/02 , H01L2924/00
摘要： The present invention provides a wiring-connecting material comprising from 2 to 75 parts by weight of a polyurethane resin, from 30 to 60 parts by weight of a radical-polymerizable substance and from 0.1 to 30 parts by weight of a curing agent capable of generating a free radical upon heating, and a process for producing a wiring-connected board by using the wiring-connecting material. The wiring-connecting material of the present invention may preferably further contain a film-forming material and/or conductive particles.
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2.发明授权Adhesive for circuit connection, circuit connection method using the same, and circuit connected structure 失效电路连接用粘接剂，使用电路连接方法，电路连接结构公开(公告)号：US08029911B2
公开(公告)日：2011-10-04
申请号：US12847819
申请日：2010-07-30
申请人： Satoyuki Nomura , Tohru Fujinawa , Hiroshi Ono , Hoko Kanazawa , Masami Yusa
发明人： Satoyuki Nomura , Tohru Fujinawa , Hiroshi Ono , Hoko Kanazawa , Masami Yusa
CPC分类号： C09J7/10 , C08L61/00 , C09J2201/36 , C09J2201/602 , H01L24/83 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29387 , H01L2224/29388 , H01L2224/29393 , H01L2224/29439 , H01L2224/29444 , H01L2224/29469 , H01L2224/83851 , H01L2924/01012 , H01L2924/01019 , H01L2924/01079 , H01L2924/07811 , H01L2924/09701 , H01L2924/10253 , H05K3/323 , H05K3/361 , Y10T428/12014 , Y10T428/2817 , Y10T428/31504 , Y10T428/31554 , Y10T428/31573 , Y10T428/31609 , Y10T428/31855 , Y10T428/31909 , H01L2924/00014 , H01L2924/0665 , H01L2924/00
摘要： There are provided an adhesive for connecting a circuit to be interposed between substrates having circuit electrodes thereon opposed to each other and to electrically connect the circuit electrodes on the substrates opposed to each other to the pressurizing direction under pressure, wherein the adhesive contains a compound having an acid equivalent of 5 to 500 KOH mg/g, and an adhesive for connecting a circuit to be interposed between substrates having circuit electrodes opposed to each other and to electrically connect the electrodes on the substrate opposed to each other to the pressurizing direction under pressure, wherein the adhesive comprises a first adhesive layer and a second adhesive layer, and a glass transition temperature of the first adhesive layer after pressure connection is higher than the glass transition temperature of the second adhesive layer after pressure connection.
摘要翻译： 提供了一种用于连接电路的粘合剂，该电路将介于具有彼此相对的电路电极的基板之间，并且将彼此相对的基板上的电路电极与加压方向电压连接，其中粘合剂包含具有 酸当量为5至500KOHmg / g，以及用于连接待彼此相对的电路电极的基板之间的电路的粘合剂，并将彼此相对的基板上的电极与压力方向压力连接 其中所述粘合剂包括第一粘合剂层和第二粘合剂层，并且压力连接之后的第一粘合剂层的玻璃化转变温度高于压力连接之后的第二粘合剂层的玻璃化转变温度。
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3.发明申请ADHESIVE FOR CIRCUIT CONNECTION, CIRCUIT CONNECTION METHOD USING THE SAME, AND CIRCUIT CONNECTED STRUCTURE 失效用于电路连接的电路，使用其的电路连接方法和电路连接结构公开(公告)号：US20100294551A1
公开(公告)日：2010-11-25
申请号：US12847819
申请日：2010-07-30
申请人： Satoyuki Nomura , Tohru Fujinawa , Hiroshi Ono , Hoko Kanazawa , Masami Yusa
发明人： Satoyuki Nomura , Tohru Fujinawa , Hiroshi Ono , Hoko Kanazawa , Masami Yusa
CPC分类号： C09J7/10 , C08L61/00 , C09J2201/36 , C09J2201/602 , H01L24/83 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29387 , H01L2224/29388 , H01L2224/29393 , H01L2224/29439 , H01L2224/29444 , H01L2224/29469 , H01L2224/83851 , H01L2924/01012 , H01L2924/01019 , H01L2924/01079 , H01L2924/07811 , H01L2924/09701 , H01L2924/10253 , H05K3/323 , H05K3/361 , Y10T428/12014 , Y10T428/2817 , Y10T428/31504 , Y10T428/31554 , Y10T428/31573 , Y10T428/31609 , Y10T428/31855 , Y10T428/31909 , H01L2924/00014 , H01L2924/0665 , H01L2924/00
摘要： There are provided an adhesive for connecting a circuit to be interposed between substrates having circuit electrodes thereon opposed to each other and to electrically connect the circuit electrodes on the substrates opposed to each other to the pressurizing direction under pressure, wherein the adhesive contains a compound having an acid equivalent of 5 to 500 KOH mg/g, and an adhesive for connecting a circuit to be interposed between substrates having circuit electrodes opposed to each other and to electrically connect the electrodes on the substrate opposed to each other to the pressurizing direction under pressure, wherein the adhesive comprises a first adhesive layer and a second adhesive layer, and a glass transition temperature of the first adhesive layer after pressure connection is higher than the glass transition temperature of the second adhesive layer after pressure connection.
摘要翻译： 提供了一种用于连接电路的粘合剂，该电路将介于具有彼此相对的电路电极的基板之间，并且将彼此相对的基板上的电路电极与加压方向电压连接，其中粘合剂包含具有 酸当量为5至500KOHmg / g，以及用于连接待彼此相对的电路电极的基板之间的电路的粘合剂，并将彼此相对的基板上的电极与压力方向压力连接 其中所述粘合剂包括第一粘合剂层和第二粘合剂层，并且压力连接之后的第一粘合剂层的玻璃化转变温度高于压力连接之后的第二粘合剂层的玻璃化转变温度。
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4.发明授权Wiring-connecting material and process for producing circuit board with the same 失效接线材料及其制造方法与电路板相同公开(公告)号：US06762249B1
公开(公告)日：2004-07-13
申请号：US10069053
申请日：2002-07-08
申请人： Tohru Fujinawa , Masami Yusa , Satoyuki Nomura , Hiroshi Ono , Itsuo Watanabe , Motohiro Arifuku , Hoko Kanazawa
发明人： Tohru Fujinawa , Masami Yusa , Satoyuki Nomura , Hiroshi Ono , Itsuo Watanabe , Motohiro Arifuku , Hoko Kanazawa
IPC分类号： C08G1862
CPC分类号： H05K3/323 , C08F283/006 , C08F290/067 , C08G18/4018 , C08G18/4238 , C08G18/4277 , C08G18/4854 , C08G18/6607 , C08G18/672 , C08G18/8175 , C08L51/08 , C08L75/04 , C09J4/06 , H01L24/29 , H01L2924/14 , H01L2924/15788 , H05K2201/0154 , C08G18/42 , C08L2666/02 , H01L2924/00
摘要： The present invention provides a wiring-connecting material comprising from 2 to 75 parts by weight of a polyurethane resin, from 30 to 60 parts by weight of a radical-polymerizable substance and from 0.1 to 30 parts by weight of a curing agent capable of generating a free radical upon heating, and a process for producing a wiring-connected board by using the wiring-connecting material. The wiring-connecting material of the present invention may preferably further contain a film-forming material and/or conductive particles.
摘要翻译： 本发明提供一种配线连接材料，其包含2至75重量份的聚氨酯树脂，30至60重量份的可自由基聚合的物质和0.1至30重量份的能产生 加热时的自由基，以及使用配线连接材料制造配线连接板的工序。 本发明的配线连接材料优选还可以含有成膜材料和/或导电性粒子。
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5.发明申请Adhesive for circuit connection, circuit connection method using the same, and circuit connected structure 审中-公开电路连接用粘接剂，使用电路连接方法，电路连接结构公开(公告)号：US20070166549A1
公开(公告)日：2007-07-19
申请号：US11723644
申请日：2007-03-21
申请人： Satoyuki Nomura , Tohru Fujinawa , Hiroshi Ono , Hoko Kanazawa , Masami Yusa
发明人： Satoyuki Nomura , Tohru Fujinawa , Hiroshi Ono , Hoko Kanazawa , Masami Yusa
CPC分类号： C09J7/10 , C08L61/00 , C09J2201/36 , C09J2201/602 , H01L24/83 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29387 , H01L2224/29388 , H01L2224/29393 , H01L2224/29439 , H01L2224/29444 , H01L2224/29469 , H01L2224/83851 , H01L2924/01012 , H01L2924/01019 , H01L2924/01079 , H01L2924/07811 , H01L2924/09701 , H01L2924/10253 , H05K3/323 , H05K3/361 , Y10T428/12014 , Y10T428/2817 , Y10T428/31504 , Y10T428/31554 , Y10T428/31573 , Y10T428/31609 , Y10T428/31855 , Y10T428/31909 , H01L2924/00014 , H01L2924/0665 , H01L2924/00
摘要： There are provided an adhesive for connecting a circuit to be interposed between substrates having circuit electrodes thereon opposed to each other and to electrically connect the circuit electrodes on the substrates opposed to each other to the pressurizing direction under pressure, wherein the adhesive contains a compound having an acid equivalent of 5 to 500 KOH mg/g, and an adhesive for connecting a circuit to be interposed between substrates having circuit electrodes opposed to each other and to electrically connect the electrodes on the substrate opposed to each other to the pressurizing direction under pressure, wherein the adhesive comprises a first adhesive layer and a second adhesive layer, and a glass transition temperature of the first adhesive layer after pressure connection is higher than the glass transition temperature of the second adhesive layer after pressure connection.
摘要翻译： 提供了一种用于连接电路的粘合剂，该电路将介于具有彼此相对的电路电极的基板之间，并且将彼此相对的基板上的电路电极与加压方向电压连接，其中粘合剂包含具有 酸当量为5至500KOHmg / g，以及用于连接待彼此相对的电路电极的基板之间的电路的粘合剂，并将彼此相对的基板上的电极与压力方向压力连接 其中所述粘合剂包括第一粘合剂层和第二粘合剂层，并且压力连接之后的第一粘合剂层的玻璃化转变温度高于压力连接之后的第二粘合剂层的玻璃化转变温度。
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6.发明授权Adhesive for circuit connection, circuit connection method using the same, and circuit connection structure 失效用于电路连接的粘合剂，使用其的电路连接方法以及电路连接结构公开(公告)号：US07208105B2
公开(公告)日：2007-04-24
申请号：US10258548
申请日：2001-04-25
申请人： Satoyuki Nomura , Tohru Fujinawa , Hiroshi Ono , Hoko Kanazawa , Masami Yusa
发明人： Satoyuki Nomura , Tohru Fujinawa , Hiroshi Ono , Hoko Kanazawa , Masami Yusa
CPC分类号： C09J7/10 , C08L61/00 , C09J2201/36 , C09J2201/602 , H01L24/83 , H01L2224/2929 , H01L2224/29339 , H01L2224/29344 , H01L2224/29347 , H01L2224/29355 , H01L2224/29387 , H01L2224/29388 , H01L2224/29393 , H01L2224/29439 , H01L2224/29444 , H01L2224/29469 , H01L2224/83851 , H01L2924/01012 , H01L2924/01019 , H01L2924/01079 , H01L2924/07811 , H01L2924/09701 , H01L2924/10253 , H05K3/323 , H05K3/361 , Y10T428/12014 , Y10T428/2817 , Y10T428/31504 , Y10T428/31554 , Y10T428/31573 , Y10T428/31609 , Y10T428/31855 , Y10T428/31909 , H01L2924/00014 , H01L2924/0665 , H01L2924/00
摘要： There are provided an adhesive for connecting a circuit to be interposed between substrates having circuit electrodes thereon opposed to each other and to electrically connect the circuit electrodes on the substrates opposed to each other to the pressurizing direction under pressure, wherein the adhesive contains a compound having an acid equivalent of 5 to 500 KOH mg/g, and an adhesive for connecting a circuit to be interposed between substrates having circuit electrodes opposed to each other and to electrically connect the electrodes on the substrate opposed to each other to the pressurizing direction under pressure, wherein the adhesive comprises a first adhesive layer and a second adhesive layer, and a glass transition temperature of the first adhesive layer after pressure connection is higher than the glass transition temperature of the second adhesive layer after pressure connection.
摘要翻译： 提供了一种用于连接电路的粘合剂，该电路将介于具有彼此相对的电路电极的基板之间，并且将彼此相对的基板上的电路电极与加压方向电压连接，其中粘合剂包含具有 酸当量为5至500KOHmg / g，以及用于连接待彼此相对的电路电极的基板之间的电路的粘合剂，并将彼此相对的基板上的电极与压力方向压力连接 其中所述粘合剂包括第一粘合剂层和第二粘合剂层，并且压力连接之后的第一粘合剂层的玻璃化转变温度高于压力连接之后的第二粘合剂层的玻璃化转变温度。
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7.发明申请WIRING-CONNECTING MATERIAL AND WIRING-CONNECTED BOARD PRODUCTION PROCESS USING THE SAME 审中-公开使用相同的接线连接材料和接线连接板生产工艺公开(公告)号：US20100265685A1
公开(公告)日：2010-10-21
申请号：US12824709
申请日：2010-06-28
申请人： Tohru Fujinawa , Masami Yusa , Satoyuki Nomura , Hiroshi Ono , Itsuo Watanabe , Motohiro Arifuku , Hoko Kanazawa
发明人： Tohru Fujinawa , Masami Yusa , Satoyuki Nomura , Hiroshi Ono , Itsuo Watanabe , Motohiro Arifuku , Hoko Kanazawa
CPC分类号： H05K3/323 , C08F283/006 , C08F290/067 , C08G18/4018 , C08G18/4238 , C08G18/4277 , C08G18/4854 , C08G18/6607 , C08G18/672 , C08G18/8175 , C08L51/08 , C08L75/04 , C09J4/06 , H01L24/29 , H01L2924/14 , H01L2924/15788 , H05K2201/0154 , C08G18/42 , C08L2666/02 , H01L2924/00
摘要： The present invention provides a wiring-connecting material comprising from 2 to 75 parts by weight of a polyurethane resin, from 30 to 60 parts by weight of a radical-polymerizable substance and from 0.1 to 30 parts by weight of a curing agent capable of generating a free radical upon heating, and a process for producing a wiring-connected board by using the wiring-connecting material. The wiring-connecting material of the present invention may preferably further contain a film-forming material and/or conductive particles.
摘要翻译： 本发明提供一种配线连接材料，其包含2至75重量份的聚氨酯树脂，30至60重量份的可自由基聚合的物质和0.1至30重量份的能产生 加热时的自由基，以及使用配线连接材料制造配线连接板的工序。 本发明的配线连接材料优选还可以含有成膜材料和/或导电性粒子。
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8.发明授权公开(公告)号：US07141645B2
公开(公告)日：2006-11-28
申请号：US10846507
申请日：2004-05-17
申请人： Tohru Fujinawa , Masami Yusa , Satoyuki Nomura , Hiroshi Ono , Itsuo Watanabe , Motohiro Arifuku , Hoko Kanazawa
发明人： Tohru Fujinawa , Masami Yusa , Satoyuki Nomura , Hiroshi Ono , Itsuo Watanabe , Motohiro Arifuku , Hoko Kanazawa
IPC分类号： C08F283/04
CPC分类号： H05K3/323 , C08F283/006 , C08F290/067 , C08G18/4018 , C08G18/4238 , C08G18/4277 , C08G18/4854 , C08G18/6607 , C08G18/672 , C08G18/8175 , C08L51/08 , C08L75/04 , C09J4/06 , H01L24/29 , H01L2924/14 , H01L2924/15788 , H05K2201/0154 , C08G18/42 , C08L2666/02 , H01L2924/00
摘要： The present invention provides a wiring-connecting material comprising from 2 to 75 parts by weight of a polyurethane resin, from 30 to 60 parts by weight of a radical-polymerizable substance and from 0.1 to 30 parts by weight of a curing agent capable of generating a free radical upon heating, and a process for producing a wiring-connected board by using the wiring-connecting material. The wiring-connecting material of the present invention may preferably further contain a film-forming material and/or conductive particles.
摘要翻译： 本发明提供一种配线连接材料，其包含2至75重量份的聚氨酯树脂，30至60重量份的可自由基聚合的物质和0.1至30重量份的能产生 加热时的自由基，以及使用配线连接材料制造配线连接板的工序。 本发明的配线连接材料优选还可以含有成膜材料和/或导电性粒子。
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