WRITE HEAD HAVING BEVELED NON-MAGNETIC WRITE GAP SEED LAYER
    2.
    发明申请
    WRITE HEAD HAVING BEVELED NON-MAGNETIC WRITE GAP SEED LAYER 有权
    具有非磁性写入间隙层的写头

    公开(公告)号:US20150371668A1

    公开(公告)日:2015-12-24

    申请号:US14839268

    申请日:2015-08-28

    Abstract: An apparatus has a main pole layer of magnetic material, a second layer of magnetic material, a first gap layer of non-magnetic material between the main pole layer and the second layer of magnetic material, and a second gap layer of non-magnetic material disposed between the main pole layer and the second layer of magnetic material. The second gap layer of non-magnetic material can be directly adjacent to the second layer of magnetic material. In accordance with one embodiment, this allows the gap to serve as a non-magnetic seed for the second layer of magnetic material. A method of manufacturing such a device is also described.

    Abstract translation: 一种装置具有磁性材料的主极层,第二层磁性材料,主磁极层和第二磁性材料层之间的非磁性材料的第一间隙层和非磁性材料的第二间隙层 设置在主极层和第二磁性材料层之间。 非磁性材料的第二间隙层可以直接邻近第二层磁性材料。 根据一个实施例,这允许间隙用作第二层磁性材料的非磁性种子。 还描述了制造这种装置的方法。

    THIN FILMS HAVING LARGE TEMPERATURE COEFFICIENT OF RESISTANCE AND METHODS OF FABRICATING SAME
    5.
    发明申请
    THIN FILMS HAVING LARGE TEMPERATURE COEFFICIENT OF RESISTANCE AND METHODS OF FABRICATING SAME 有权
    具有较大温度系数的薄膜及其制造方法

    公开(公告)号:US20140146856A1

    公开(公告)日:2014-05-29

    申请号:US13687445

    申请日:2012-11-28

    Abstract: An apparatus comprises a head transducer and a resistive temperature sensor provided on the head transducer. The resistive temperature sensor comprises a first layer comprising a conductive material and having a temperature coefficient of resistance (TCR) and a second layer comprising at least one of a specular layer and a seed layer. A method is disclosed to fabricate such sensor with a laminated thin film structure to achieve a large TCR. The thicknesses of various layers in the laminated thin film are in the range of few to a few tens of nanometers. The combinations of the deliberately optimized multilayer thin film structures and the fabrication of such films at the elevated temperatures are disclosed to obtain the large TCR.

    Abstract translation: 一种装置包括头部换能器和设置在头部换能器上的电阻式温度传感器。 电阻温度传感器包括包含导电材料并具有温度系数电阻(TCR)的第一层和包括镜面层和晶种层中的至少一个的第二层。 公开了一种制造具有层压薄膜结构的这种传感器以实现大TCR的方法。 层压薄膜中各层的厚度在几十纳米的范围内。 公开了故意优化的多层薄膜结构和在升高的温度下制备这种薄膜的组合以获得大的TCR。

    RECORDING HEAD INCLUDING A NEAR FIELD TRANSDUCER
    6.
    发明申请
    RECORDING HEAD INCLUDING A NEAR FIELD TRANSDUCER 有权
    记录头包括一个近场传感器

    公开(公告)号:US20140050058A1

    公开(公告)日:2014-02-20

    申请号:US14062675

    申请日:2013-10-24

    Abstract: An apparatus including a near field transducer positioned adjacent to an air bearing surface, the near field transducer including an electrically conductive nitride; a first magnetic pole; and a heat sink, a diffusion barrier layer, or both positioned between the first magnetic pole and the near field transducer, wherein the heat sink, the diffusion barrier or both include rhodium (Rh) or an alloy thereof; ruthenium (Ru) or an alloy thereof titanium (Ti) or an alloy thereof tantalum (Ta) or an alloy thereof tungsten (W) or an alloy thereof borides; nitrides; transition metal oxides; or palladium (Pd) or an alloy thereof.

    Abstract translation: 一种包括邻近空气轴承表面定位的近场换能器的装置,所述近场换能器包括导电氮化物; 第一个磁极; 以及位于第一磁极和近场换能器之间的散热器,扩散阻挡层或两者,其中散热器,扩散阻挡层或二者均包括铑(Rh)或其合金; 钌(Ru)或其合金钛(Ti)或其合金钽(Ta)或其合金钨(W)或其合金硼化物; 氮化物 过渡金属氧化物; 或钯(Pd)或其合金。

    Electrically conductive solder non-wettable bond pads in head gimbal assemblies

    公开(公告)号:US10706880B1

    公开(公告)日:2020-07-07

    申请号:US16372898

    申请日:2019-04-02

    Abstract: A magnetic recording head is provided including a body with a trailing surface, a plurality of bond pads in a row, each of which is spaced by a gap from an adjacent bond pad along a width of the trailing surface. Each bond pad includes a base layer having a top surface, a coating layer covering at least a portion of the top surface of the base layer, two side edges spaced from each other across a width of the bond pad, wherein a width of the gap between adjacent bond pads is defined by one side edge of each of two adjacent bond pads, a top edge extending between the two side edges, and at least one solder dam comprising a nonwettable, electrically conductive material positioned adjacent to the top edge of at least one of the bond pads.

Patent Agency Ranking