Apparatus and method for treating substrate

    公开(公告)号:US12205833B2

    公开(公告)日:2025-01-21

    申请号:US18202396

    申请日:2023-05-26

    Abstract: The inventive concept provides an apparatus and method for removing a film formed on a substrate. A method for treating the substrate includes a primary solvent dispensing step of dispensing an organic solvent onto the substrate to remove a photoresist film on the substrate and an ozone dispensing step of dispensing a liquid containing ozone onto the substrate to remove organic residue on the substrate, after the primary solvent dispensing step.

    Apparatus and method for processing substrate

    公开(公告)号:US11520245B2

    公开(公告)日:2022-12-06

    申请号:US17404240

    申请日:2021-08-17

    Abstract: A substrate processing apparatus and method for effectively removing an organic material such as a photoresist without using sulfuric acid are provided. The substrate processing apparatus includes a support module, in which a substrate is inverted and seated, and an ultraviolet light source is installed, wherein the substrate is arranged so that one surface of the substrate faces the support module, and the ultraviolet light source irradiates ultraviolet rays to one surface of the substrate; a nozzle installed in the support module; and a fluid supply module for supplying a fluid to one surface of the substrate through the nozzle.

    Apparatus and method for treating substrate

    公开(公告)号:US09975151B2

    公开(公告)日:2018-05-22

    申请号:US14749010

    申请日:2015-06-24

    Abstract: Embodiments of the inventive concepts provide an apparatus and a method for treating a substrate. The apparatus includes a substrate support unit supporting the substrate, and a liquid supply unit supplying a treatment solution to the substrate supported by the substrate support unit. The liquid supply unit includes a nozzle discharging the treatment solution to the substrate, a liquid supply line supplying the treatment solution to the nozzle, a mixing member installed on the liquid supply line, a mixing space formed within the mixing member, and a gas supply line connected to the mixing member to supply a gas into the mixing space. The mixing member includes a body within which the mixing space is formed, and an inflow port combined with the body such that the gas supplied through the inflow port is mixed with the treatment solution in the mixing space to form nano-sized bubbles.

    Substrate treating apparatus and substrate treating method
    7.
    发明授权
    Substrate treating apparatus and substrate treating method 有权
    基板处理装置及基板处理方法

    公开(公告)号:US09275852B2

    公开(公告)日:2016-03-01

    申请号:US13905754

    申请日:2013-05-30

    Abstract: Provided is an apparatus for treating a substrate using a supercritical fluid. The substrate treating apparatus includes a housing, a support member disposed within the housing to support the substrate, a supercritical fluid supply unit in which the supercritical fluid is stored, a supply tube connecting the supercritical fluid supply unit to the housing to adjust an amount of supercritical fluid supplied from the supercritical fluid supply unit into the housing, and a vent tube branched from the supply tube to discharge the supercritical fluid remaining in the supply tube. A switching valve opening or closing the vent tube is disposed in the vent tube.

    Abstract translation: 提供了一种使用超临界流体处理基板的装置。 基板处理装置包括壳体,设置在壳体内以支撑基板的支撑构件,超临界流体供应单元,超临界流体被储存在该超临界流体供应单元中,供应管将超临界流体供应单元连接到壳体以调节 从超临界流体供给单元供给到壳体中的超临​​界流体和从供给管分支以排出残留在供给管中的超临界流体的通气管。 打开或关闭排气管的切换阀设置在排气管中。

    Apparatus for treating substrate
    8.
    发明授权

    公开(公告)号:US09922850B2

    公开(公告)日:2018-03-20

    申请号:US14744563

    申请日:2015-06-19

    CPC classification number: H01L21/67051

    Abstract: Disclosed is a substrate treating apparatus which includes a treating container having a treating space therein and including a plurality of collecting vessels surrounding the treating space and provided such that inlets for inputting a fluid in the treating space are vertically stacked on each other, a support unit supporting a substrate in the treating space, a solution supply unit supplying a treating solution to the substrate supported by the support unit, and elevation units respectively joined with the collecting vessels and lifting up and down the collecting vessels. Each of the elevation units includes a base having a ring shape and joined with a corresponding collecting vessel, an elevation load joined with the base, and a driver lifting up and down the elevation load.

    APPARATUS AND METHOD FOR DRYING SUBSTRATE
    9.
    发明申请
    APPARATUS AND METHOD FOR DRYING SUBSTRATE 有权
    干燥基材的装置和方法

    公开(公告)号:US20130318812A1

    公开(公告)日:2013-12-05

    申请号:US13905676

    申请日:2013-05-30

    CPC classification number: F26B21/12 F26B5/005 H01L21/67017 H01L21/67034

    Abstract: Provided is an apparatus and method for drying a substrate. The apparatus includes a housing, a substrate support member, a fluid supply member, and a discharge member. The housing provides a space in which a drying process is performed. The substrate support member is provided in the housing to support the substrate. The fluid supply member includes a supply line for supplying a process fluid of a supercritical state to the housing. The discharge member includes a discharge line for discharging the process fluid from the housing. Here, the supply line includes a first supply line provided to supply the process fluid to the housing at a first supply flow rate, and a second supply line provided to supply the process fluid to the housing at a second supply flow rate.

    Abstract translation: 提供了一种用于干燥基板的装置和方法。 该装置包括壳体,基板支撑构件,流体供应构件和排出构件。 壳体提供进行干燥处理的空间。 衬底支撑构件设置在壳体中以支撑衬底。 流体供给构件包括用于将超临界状态的处理流体供给到壳体的供给管线。 排出构件包括用于从壳体排出工艺流体的排出管线。 这里,供应管线包括用于以第一供应流量将工艺流体供应到壳体的第一供应管线和设置成以第二供应流量将工艺流体供应到壳体的第二供应管线。

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