公开(公告)号：US20170033037A1

公开(公告)日：2017-02-02

申请号：US15293883

申请日：2016-10-14

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chi-Ching Ho ,  Ying-Chou Tsai ,  Sheng-Che Huang

IPC: H01L23/498 ,  H01L21/48

CPC classification number: H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49866 ,  H01L24/16 ,  H01L24/81 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/81193 ,  H05K3/064 ,  H05K3/205 ,  H05K3/3436 ,  H05K3/4007 ,  H05K3/4038 ,  H05K3/4682 ,  H05K2201/0376 ,  Y02P70/613 ,  Y10T29/49158

Abstract: A packaging substrate is disclosed, which includes: a dielectric layer; a circuit layer embedded in and exposed from a surface of the dielectric layer, wherein the circuit layer has a plurality of conductive pads; and a plurality of conductive bumps formed on the conductive pads and protruding above the surface of the dielectric layer. As such, when an electronic element is disposed on the conductive pads through a plurality of conductive elements, the conductive elements can come into contact with both top and side surfaces of the conductive bumps so as to increase the contact area between the conductive elements and the conductive pads, thereby strengthening the bonding between the conductive elements and the conductive pads and preventing delamination of the conductive elements from the conductive pads.

Abstract translation: 公开了一种封装基板，包括：介电层; 电介质层，其中所述电路层嵌入并暴露于所述电介质层的表面，其中所述电路层具有多个导电焊盘; 以及形成在所述导电焊盘上并突出在所述电介质层的表面上方的多个导电凸块。 这样，当通过多个导电元件将电子元件设置在导电焊盘上时，导电元件可以与导电凸块的顶表面和侧表面接触，从而增加导电元件与导电元件之间的接触面积 导电焊盘，从而加强导电元件和导电焊盘之间的接合，并防止导电元件与导电焊盘分层。

公开(公告)号：US20170047230A1

公开(公告)日：2017-02-16

申请号：US15293858

申请日：2016-10-14

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chi-Ching Ho ,  Ying-Chou Tsai ,  Sheng-Che Huang

IPC: H01L21/48 ,  H01L23/00 ,  H05K3/46 ,  H05K3/06 ,  H05K3/34 ,  H01L21/683 ,  H01L23/498 ,  H05K3/40

CPC classification number: H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49866 ,  H01L24/16 ,  H01L24/81 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/81193 ,  H05K3/064 ,  H05K3/205 ,  H05K3/3436 ,  H05K3/4007 ,  H05K3/4038 ,  H05K3/4682 ,  H05K2201/0376 ,  Y02P70/613 ,  Y10T29/49158

Abstract: A packaging substrate is disclosed, which includes: a dielectric layer; a circuit layer embedded in and exposed from a surface of the dielectric layer, wherein the circuit layer has a plurality of conductive pads; and a plurality of conductive bumps formed on the conductive pads and protruding above the surface of the dielectric layer. As such, when an electronic element is disposed on the conductive pads through a plurality of conductive elements, the conductive elements can come into contact with both top and side surfaces of the conductive bumps so as to increase the contact area between the conductive elements and the conductive pads, thereby strengthening the bonding between the conductive elements and the conductive pads and preventing delamination of the conductive elements from the conductive pads.

Abstract translation: 公开了一种封装基板，包括：介电层; 电介质层，其中所述电路层嵌入并暴露于所述电介质层的表面，其中所述电路层具有多个导电焊盘; 以及形成在所述导电焊盘上并突出在所述电介质层的表面上方的多个导电凸块。 这样，当通过多个导电元件将电子元件设置在导电焊盘上时，导电元件可以与导电凸块的顶表面和侧表面接触，从而增加导电元件与导电元件之间的接触面积 导电焊盘，从而加强导电元件和导电焊盘之间的接合，并防止导电元件与导电焊盘分层。

公开(公告)号：US20150144384A1

公开(公告)日：2015-05-28

申请号：US14104514

申请日：2013-12-12

Applicant: Siliconware Precision Industries Co., Ltd

Inventor： Chi-Ching Ho ,  Ying Chou Tsai ,  Sheng-Che Huang

IPC: H05K1/11 ,  H05K3/10 ,  H05K1/09

CPC classification number: H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49866 ,  H01L24/16 ,  H01L24/81 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/81193 ,  H05K3/064 ,  H05K3/205 ,  H05K3/3436 ,  H05K3/4007 ,  H05K3/4038 ,  H05K3/4682 ,  H05K2201/0376 ,  Y02P70/613 ,  Y10T29/49158

Abstract: A packaging substrate is disclosed, which includes: a dielectric layer; a circuit layer embedded in and exposed from a surface of the dielectric layer, wherein the circuit layer has a plurality of conductive pads; and a plurality of conductive bumps formed on the conductive pads and protruding above the surface of the dielectric layer. As such, when an electronic element is disposed on the conductive pads through a plurality of conductive elements, the conductive elements can come into contact with both top and side surfaces of the conductive bumps so as to increase the contact area between the conductive elements and the conductive pads, thereby strengthening the bonding between the conductive elements and the conductive pads and preventing delamination of the conductive elements from the conductive pads.

Abstract translation: 公开了一种封装基板，包括：介电层; 电介质层，其中所述电路层嵌入并暴露于所述电介质层的表面，其中所述电路层具有多个导电焊盘; 以及形成在所述导电焊盘上并突出在所述电介质层的表面上方的多个导电凸块。 这样，当通过多个导电元件将电子元件设置在导电焊盘上时，导电元件可以与导电凸块的顶表面和侧表面接触，从而增加导电元件与导电元件之间的接触面积 导电焊盘，从而加强导电元件和导电焊盘之间的接合，并防止导电元件与导电焊盘分层。

公开(公告)号：US09899235B2

公开(公告)日：2018-02-20

申请号：US15293858

申请日：2016-10-14

Applicant: Siliconware Precision Industries Co., Ltd.

Inventor： Chi-Ching Ho ,  Ying-Chou Tsai ,  Sheng-Che Huang

IPC: H01L21/48 ,  H01L23/00 ,  H05K3/20 ,  H05K3/34 ,  H05K3/40 ,  H01L23/498 ,  H01L21/683 ,  H05K3/06 ,  H05K3/46

CPC classification number: H01L21/4853 ,  H01L21/4857 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/49811 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/49866 ,  H01L24/16 ,  H01L24/81 ,  H01L2221/68345 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/81193 ,  H05K3/064 ,  H05K3/205 ,  H05K3/3436 ,  H05K3/4007 ,  H05K3/4038 ,  H05K3/4682 ,  H05K2201/0376 ,  Y02P70/613 ,  Y10T29/49158

Abstract: A packaging substrate is disclosed, which includes: a dielectric layer; a circuit layer embedded in and exposed from a surface of the dielectric layer, wherein the circuit layer has a plurality of conductive pads; and a plurality of conductive bumps formed on the conductive pads and protruding above the surface of the dielectric layer. As such, when an electronic element is disposed on the conductive pads through a plurality of conductive elements, the conductive elements can come into contact with both top and side surfaces of the conductive bumps so as to increase the contact area between the conductive elements and the conductive pads, thereby strengthening the bonding between the conductive elements and the conductive pads and preventing delamination of the conductive elements from the conductive pads.