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    Methods to form reduced form factor radio frequency system-in-package
    3.
    发明授权
    Methods to form reduced form factor radio frequency system-in-package 有权

    公开(公告)号：US10535637B2

    公开(公告)日：2020-01-14

    申请号：US16377477

    申请日：2019-04-08

    申请人： Skyworks Solutions, Inc.

    发明人： Darren Roger Frenette ,  George Khoury ,  Lori Ann DeOrio

    IPC分类号： H01L23/66 ,  H01L25/065 ,  H01L25/00 ,  H01L25/16 ,  H04B1/40

    摘要： Methods to form stacked circuit assemblies include mounting a first wireless device component to a first surface of a substrate and placing a second wireless device component over the first wireless device component such that the first wireless device component is disposed between the second wireless device component and the first surface of the substrate such that a first overhanging portion of the second wireless device component extends beyond a periphery of the first wireless device component. The first wireless device component is in communication with the second wireless device component and second wireless device component is in communication with the substrate.

    RADIO FREQUENCY SYSTEM-IN-PACKAGE INCLUDING A STACKED SYSTEM-ON-CHIP
    5.
    发明申请
    RADIO FREQUENCY SYSTEM-IN-PACKAGE INCLUDING A STACKED SYSTEM-ON-CHIP 审中-公开

    公开(公告)号：US20170302325A1

    公开(公告)日：2017-10-19

    申请号：US15489506

    申请日：2017-04-17

    申请人： Skyworks Solutions, Inc.

    发明人： Darren Roger Frenette ,  George Khoury ,  Lori Ann DeOrio

    IPC分类号： H04B1/40

    CPC分类号： H04B1/40

    摘要： A packaged module for use in a wireless communication device has a substrate supporting a crystal and a first die that includes at least a microprocessor and one or more of radio frequency transmitter circuitry and radio frequency receiver circuitry. The crystal is disposed between the first die and the substrate. An overmold encloses the crystal and the first die. The substrate also supports a second die that includes at least a power amplifier for amplifying a radio frequency input signal where the second die is disposed on an opposite side of the substrate from the first die and the crystal.

    CIRCUITS AND METHODS FOR ELIMINATING REFERENCE SPURS IN FRACTIONAL-N FREQUENCY SYNTHESIS
    6.
    发明申请
    CIRCUITS AND METHODS FOR ELIMINATING REFERENCE SPURS IN FRACTIONAL-N FREQUENCY SYNTHESIS 有权
    消除频率合成中参考情绪的电路和方法

    公开(公告)号：US20150349788A1

    公开(公告)日：2015-12-03

    申请号：US14718677

    申请日：2015-05-21

    申请人： Skyworks Solutions, Inc.

    发明人： Ardeshir Namdar-Mehdiabadi ,  Darren Roger Frenette ,  John William Mitchell Rogers

    IPC分类号： H03L7/093 ,  H03L7/087 ,  H03L7/099 ,  H03L7/197

    CPC分类号： H03L7/1974 ,  H03L7/087 ,  H03L7/0891 ,  H03L7/0895 ,  H03L7/0898 ,  H03L7/093 ,  H03L7/099 ,  H03L7/197 ,  H03L7/1976 ,  H03L7/1978 ,  H04L7/0016 ,  H04L7/0045 ,  H04W56/0035 ,  H04W88/02

    摘要： Disclosed are circuits and method for reducing or eliminating reference spurs in frequency synthesizers. In some implementations, a phase-locked loop (PLL) such as a Frac-N PLL of a frequency synthesizer can include a phase frequency detector (PFD) configured to receive a reference signal and a feedback signal. The PFD can be configured to generate a first signal representative of a phase difference between the reference signal and the feedback signal. The PLL can further include a compensation circuit configured to generate a compensation signal based on the first signal. The PLL can further includes a voltage-controlled oscillator (VCO) configured to generate an output signal based on the compensation signal. The compensation signal can include at least one feature for substantially eliminating one or more reference spurs associated with the PLL.

    摘要翻译： 公开了用于减少或消除频率合成器中的参考杂散的电路和方法。 在一些实现中，诸如频率合成器的Frac-N PLL的锁相环（PLL）可以包括被配置为接收参考信号和反馈信号的相位频率检测器（PFD）。 PFD可以被配置为产生表示参考信号和反馈信号之间的相位差的第一信号。 PLL还可以包括被配置为基于第一信号产生补偿信号的补偿电路。 PLL还可以包括被配置为基于补偿信号产生输出信号的压控振荡器（VCO）。 补偿信号可以包括用于基本上消除与PLL相关联的一个或多个参考杂波的至少一个特征。

    RADIO FREQUENCY MODULES
    8.
    发明申请
    RADIO FREQUENCY MODULES 有权

    公开(公告)号：US20210320081A1

    公开(公告)日：2021-10-14

    申请号：US17240661

    申请日：2021-04-26

    申请人： Skyworks Solutions, Inc.

    发明人： Gregory Edward Babcock ,  Lori Ann DeOrio ,  Darren Roger Frenette ,  George Khoury ,  Anthony James LoBianco ,  Hoang Mong Nguyen ,  Leslie Paul Wallis

    IPC分类号： H01L23/00 ,  H01L23/66 ,  H01L23/552 ,  H04B1/40 ,  H01L25/18

    摘要： Packaged modules for use in wireless devices are disclosed. A substrate supports integrated circuit die including at least a portion of a baseband system and a front end system, an oscillator assembly, and an antenna. The oscillator assembly includes an enclosure to enclose the oscillator and conductive pillars formed at least partially within a side of the enclosure to conduct signals between the top and bottom surfaces of the oscillator assembly. Components can be vertically integrated to save space and reduce trace length. Vertical integration provides an overhang volume that can include discrete components. Radio frequency shielding and ground planes within the substrate shield the front end system and antenna from radio frequency interference. Stacked filter assemblies include passive surface mount devices to filter radio frequency signals.