摘要:
A device for forming a reduced chamber space, which is a process box or a process hood, containing an apparatus, which positions at least two multilayer bodies each including a surface to be processed, wherein the apparatus is designed such that the multilayer bodies are opposite to each other, wherein the surfaces to be processed are facing away from each other such that the multilayer bodies can be processed as a multilayer body arrangement in a processing system. In addition, a method for positioning the two multilayer bodies comprising a surface to be processed, with the two multilayer bodies disposed in such a device such that multilayer bodies are opposite each other, wherein the surfaces to be processed are facing away from each other, such that the multilayer bodies are processable as a multilayer body arrangement in a processing system.
摘要:
The invention relates to a multilayer body arrangement, which comprises at least two multilayer bodies each having at least one surface to be processed as well as at least one device for positioning the multilayer bodies, wherein the device is configured such that the respective surfaces to be processed are opposite each other and thus form a quasi-closed processing space disposed between the surfaces, in which the processing occurs. It further relates to a system for processing multilayer bodies with such a multilayer body arrangement, as well as a method for processing multilayer bodies, wherein the multilayer bodies are disposed such that the respective surfaces to be processed are opposite each other and thus form a quasi-closed processing space disposed between the surfaces, in which the processing occurs.
摘要:
The invention relates to a multilayer body arrangement, which comprises at least two multilayer bodies each having at least one surface to be processed as well as at least one device for positioning the multilayer bodies, wherein the device is configured such that the respective surfaces to be processed are opposite each other and thus form a quasi-closed processing space disposed between the surfaces, in which the processing occurs. It further relates to a system for processing multilayer bodies with such a multilayer body arrangement, as well as a method for processing multilayer bodies, wherein the multilayer bodies are disposed such that the respective surfaces to be processed are opposite each other and thus form a quasi-closed processing space disposed between the surfaces, in which the processing occurs.
摘要:
A device for forming a reduced chamber space, which is a process box or a process hood, containing an apparatus, which positions at least two multilayer bodies each including a surface to be processed, wherein the apparatus is designed such that the multilayer bodies are opposite to each other, wherein the surfaces to be processed are facing away from each other such that the multilayer bodies can be processed as a multilayer body arrangement in a processing system. In addition, a method for positioning the two multilayer bodies comprising a surface to be processed, with the two multilayer bodies disposed in such a device such that multilayer bodies are opposite each other, wherein the surfaces to be processed are facing away from each other, such that the multilayer bodies are processable as a multilayer body arrangement in a processing system.
摘要:
The present invention provides for treating a surface of a semiconductor material. The method comprises exposing the surface of the semiconductor material to a halogen etchant in a hydrogen environment at an elevated temperature. The method controls the surface roughness of the semiconductor material. The method also has the unexpected benefit of reducing dislocations in the semiconductor material.