Semiconductor device with improved robustness
    5.
    发明授权
    Semiconductor device with improved robustness 有权
    半导体器件具有改进的鲁棒性

    公开(公告)号:US08884360B2

    公开(公告)日:2014-11-11

    申请号:US13404161

    申请日:2012-02-24

    IPC分类号: H01L29/78

    摘要: A semiconductor device includes a first contact in low Ohmic contact with a source region of the device and a first portion of a body region of the device formed in an active area of the device, and a second contact in low Ohmic contact with a second portion of the body region formed in a peripheral area of the device. The minimum width of the second contact at a first surface of the device is larger than the minimum width of the first contact at the first surface so that maximum current density during commutating the semiconductor device is reduced and thus the risk of device damage during hard commutating is also reduced.

    摘要翻译: 半导体器件包括与器件的源极区域的低欧姆接触的第一接触和形成在器件的有源区域中的器件的体区的第一部分,以及与第二部分的低欧姆接触的第二接触 形成在装置的周边区域中的身体区域。 器件第一表面处的第二触点的最小宽度大于第一表面处的第一接触的最小宽度,使得在半导体器件的整流期间的最大电流密度降低,并且因此在硬整流期间器件损坏的风险 也减少了。

    Semiconductor Device With Improved Robustness
    6.
    发明申请
    Semiconductor Device With Improved Robustness 有权
    具有提高鲁棒性的半导体器件

    公开(公告)号:US20130221427A1

    公开(公告)日:2013-08-29

    申请号:US13404161

    申请日:2012-02-24

    IPC分类号: H01L29/78 H01L21/04

    摘要: A semiconductor device includes a first contact in low Ohmic contact with a source region of the device and a first portion of a body region of the device formed in an active area of the device, and a second contact in low Ohmic contact with a second portion of the body region formed in a peripheral area of the device. The minimum width of the second contact at a first surface of the device is larger than the minimum width of the first contact at the first surface so that maximum current density during commutating the semiconductor device is reduced and thus the risk of device damage during hard commutating is also reduced.

    摘要翻译: 半导体器件包括与器件的源极区域的低欧姆接触的第一接触和形成在器件的有源区域中的器件的体区的第一部分,以及与第二部分的低欧姆接触的第二接触 形成在装置的周边区域中的身体区域。 器件第一表面处的第二触点的最小宽度大于第一表面处的第一接触的最小宽度,使得在半导体器件的整流期间的最大电流密度降低,并且因此在硬整流期间器件损坏的风险 也减少了。