利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

15 条记录 (耗时 0.03 秒)

    Arrangement of electronic semiconductor components on a carrier system for treating said semiconductor components with a liquid medium
    6.
    发明授权
    Arrangement of electronic semiconductor components on a carrier system for treating said semiconductor components with a liquid medium 有权
    用于用液体介质处理所述半导体部件的载体系统上的电子半导体部件的布置

    公开(公告)号：US07566378B2

    公开(公告)日：2009-07-28

    申请号：US11438906

    申请日：2006-05-23

    申请人： Stephan Bradl ,  Michael Melzl ,  Josef Schwaiger ,  Thilo Stache

    发明人： Stephan Bradl ,  Michael Melzl ,  Josef Schwaiger ,  Thilo Stache

    IPC分类号： H01L21/00 ,  C23C14/00 ,  C23C16/00

    CPC分类号： H01L21/67075 ,  H01L21/6704 ,  H01L21/6835

    摘要： The invention relates to an arrangement of electronic semiconductor components on a carrier system for treating the semiconductor components with a liquid medium. A semiconductor component is detachably mounted on the carrier system with the active side thereof in such a way that the arrangement comprises a gap at least in the edge region and partially between the semiconductor components and the carrier system. The aim of the invention is to provide a detachable arrangement of electronic semiconductor components on a mechanically stable carrier system for safely handling the semiconductor components during the production process, wherein the capillarity of the gap between the semiconductor components and the carrier system is reduced in a controlled manner, thus preventing the damaging effect of a liquid medium seeping into the gap. To this end, the surface of the carrier system is shaped in such a way that the gap is widened along the entire edge region thereof.

    摘要翻译： 本发明涉及一种用于用液体介质处理半导体部件的载体系统上的电子半导体部件的布置。 半导体部件可拆卸地安装在载体系统上，其主动侧具有至少在边缘区域中并且部分地在半导体部件和载体系统之间的间隙。 本发明的目的是提供在机械稳定的载体系统上的电子半导体部件的可拆卸布置，用于在生产过程中安全地处理半导体部件，其中半导体部件和载体系统之间的间隙的毛细管度在 从而防止液体介质渗透到间隙中的破坏作用。 为此，载体系统的表面成形为使得间隙沿其整个边缘区域变宽。

    Treatment of a substrate with a liquid medium
    7.
    发明授权
    Treatment of a substrate with a liquid medium 有权
    用液体介质处理基材

    公开(公告)号：US08759230B2

    公开(公告)日：2014-06-24

    申请号：US12331237

    申请日：2008-12-09

    申请人： Stephan Bradl ,  Michael Melzl ,  Josef Schwaiger ,  Thilo Stache

    发明人： Stephan Bradl ,  Michael Melzl ,  Josef Schwaiger ,  Thilo Stache

    IPC分类号： H01L21/302

    CPC分类号： H01L21/67075 ,  H01L21/6704 ,  H01L21/6835

    摘要： The invention relates to an arrangement of electronic semiconductor components on a carrier system for treating the semiconductor components with a liquid medium. A semiconductor component is detachably mounted on the carrier system with the active side thereof in such a way that the arrangement comprises a gap at least in the edge region and partially between the semiconductor components and the carrier system. The aim of the invention is to provide a detachable arrangement of electronic semiconductor components on a mechanically stable carrier system for safely handling the semiconductor components during the production process, wherein the capillarity of the gap between the semiconductor components and the carrier system is reduced in a controlled manner, thus preventing the damaging effect of a liquid medium seeping into the gap. To this end, the surface of the carrier system is shaped in such a way that the gap is widened along the entire edge region thereof.

    摘要翻译： 本发明涉及一种用于用液体介质处理半导体部件的载体系统上的电子半导体部件的布置。 半导体部件可拆卸地安装在载体系统上，其主动侧具有至少在边缘区域中并且部分地在半导体部件和载体系统之间的间隙。 本发明的目的是提供在机械稳定的载体系统上的电子半导体部件的可拆卸布置，用于在生产过程中安全地处理半导体部件，其中半导体部件和载体系统之间的间隙的毛细管度在 从而防止液体介质渗透到间隙中的破坏作用。 为此，载体系统的表面成形为使得间隙沿其整个边缘区域变宽。

    Treatment of a Substrate with a Liquid Medium
    8.
    发明申请
    Treatment of a Substrate with a Liquid Medium 有权
    用液体介质处理基材

    公开(公告)号：US20090093127A1

    公开(公告)日：2009-04-09

    申请号：US12331237

    申请日：2008-12-09

    申请人： Stephan Bradl ,  Michael Melzl ,  Josef Schwaiger ,  Thilo Stache

    发明人： Stephan Bradl ,  Michael Melzl ,  Josef Schwaiger ,  Thilo Stache

    IPC分类号： H01L21/306

    CPC分类号： H01L21/67075 ,  H01L21/6704 ,  H01L21/6835

    摘要： The invention relates to an arrangement of electronic semiconductor components on a carrier system for treating the semiconductor components with a liquid medium. A semiconductor component is detachably mounted on the carrier system with the active side thereof in such a way that the arrangement comprises a gap at least in the edge region and partially between the semiconductor components and the carrier system. The aim of the invention is to provide a detachable arrangement of electronic semiconductor components on a mechanically stable carrier system for safely handling the semiconductor components during the production process, wherein the capillarity of the gap between the semiconductor components and the carrier system is reduced in a controlled manner, thus preventing the damaging effect of a liquid medium seeping into the gap. To this end, the surface of the carrier system is shaped in such a way that the gap is widened along the entire edge region thereof.

    摘要翻译： 本发明涉及一种用于用液体介质处理半导体部件的载体系统上的电子半导体部件的布置。 半导体部件可拆卸地安装在载体系统上，其主动侧具有至少在边缘区域中并且部分地在半导体部件和载体系统之间的间隙。 本发明的目的是提供在机械稳定的载体系统上的电子半导体部件的可拆卸布置，用于在生产过程中安全地处理半导体部件，其中半导体部件和载体系统之间的间隙的毛细管度在 从而防止液体介质渗透到间隙中的破坏作用。 为此，载体系统的表面成形为使得间隙沿其整个边缘区域变宽。