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    Apparatus for indirect impingement cooling of integrated circuit chips
    1.
    发明授权
    Apparatus for indirect impingement cooling of integrated circuit chips 失效
    用于集成电路芯片的间接冲击冷却的装置

    公开(公告)号：US5294830A

    公开(公告)日：1994-03-15

    申请号：US703614

    申请日：1991-05-21

    申请人： Steven P. Young ,  John Acocella ,  Albert J. Fahey ,  Gaetano P. Messina ,  Seaho Song

    发明人： Steven P. Young ,  John Acocella ,  Albert J. Fahey ,  Gaetano P. Messina ,  Seaho Song

    IPC分类号： H01L23/433 ,  H01L23/473 ,  H01L23/02 ,  H01L25/04

    CPC分类号： H01L23/4735 ,  H01L23/4338 ,  H01L2224/16225 ,  H01L2924/15312

    摘要： An integrated circuit thermal conduction module comprises a substrate having a chip-carrying surface and at least one integrated circuit chip on the substrate. A deformable, liquid-impermeable, thermally conductive film or foil extends over an upper surface of the chip. A piston has a lower surface which urges and conforms the film against the chip upper surface and which contains at least one open channel permitting coolant passage and contact with the film for conveying heat from the chip without direct contact between the coolant and chip. Preferably, the piston has a central passageway extending along the longitudinal axis for channeling the coolant through the piston, and has a plurality of channels extending radially outwardly from the central passageway along the lower face for directing coolant beneath the piston.

    摘要翻译： 集成电路热传导模块包括具有芯片承载表面的衬底和在衬底上的至少一个集成电路芯片。 可变形的液体不可渗透的导热膜或箔在芯片的上表面上延伸。 活塞具有下表面，该下表面促使薄膜抵靠芯片上表面，并且其包含至少一个敞开的通道，允许冷却剂通过并与薄膜接触，用于从芯片传送热量，而不会直接接触冷却剂和芯片。 优选地，活塞具有沿着纵向轴线延伸的中心通道，用于将冷却剂引导通过活塞，并且具有沿着下表面从中心通道径向向外延伸的多个通道，用于将冷却剂引导到活塞下方。

    Blind hole cold plate cooling system
    4.
    发明授权
    Blind hole cold plate cooling system 失效
    盲孔冷板冷却系统

    公开(公告)号：US5239443A

    公开(公告)日：1993-08-24

    申请号：US872567

    申请日：1992-04-23

    申请人： Albert J. Fahey ,  Gaetano P. Messina ,  John B. Pavelka ,  Raed A. Sherif

    发明人： Albert J. Fahey ,  Gaetano P. Messina ,  John B. Pavelka ,  Raed A. Sherif

    IPC分类号： H01L23/473

    CPC分类号： H01L23/4735 ,  H01L2924/0002 ,  Y10S165/908

    摘要： Disclosed is a blind hole cold plate cooling system including:a fluid inlet manifold having at least one jet nozzle;a heat transfer plate having a first and second principal surface, the first principal surface having a complementary cavity for receiving the jet nozzle, the second principal surface being planar for contact with at least one heat generatinq device; andan annular gap defined by the outer periphery of jet nozzle and the surface of the complementary cavity.

    摘要翻译： 盲孔冷板冷却系统包括：具有至少一个喷嘴的流体入口歧管; 具有第一和第二主表面的传热板，所述第一主表面具有用于接收喷射喷嘴的互补空腔，所述第二主表面是平面的，用于与至少一个热发生装置接触; 以及由喷嘴的外围和互补腔的表面限定的环形间隙。