公开(公告)号：US11452209B2

公开(公告)日：2022-09-20

申请号：US17134316

申请日：2020-12-26

Applicant: TDK CORPORATION

Inventor： Yuichiro Okuyama ,  Takeshi Oohashi ,  Hajime Kuwajima ,  Takashi Ohtsuka ,  Kazuhiro Yoshikawa ,  Kenichi Yoshida

IPC: H05K1/02 ,  H05K1/16 ,  H05K1/14

Abstract: Disclosed herein is an electronic component that includes a substrate and a plurality of conductive layers and a plurality of insulating layers which are alternately laminated on the substrate. The side surface of at least one of the plurality of insulating layers has a recessed part set back from a side surface of the substrate and a projecting part projecting from the recessed part.

公开(公告)号：US11114248B2

公开(公告)日：2021-09-07

申请号：US16354373

申请日：2019-03-15

Applicant: TDK Corporation

Inventor： Kazuhiro Yoshikawa ,  Daiki Ishii ,  Kenichi Yoshida

IPC: H01G4/33 ,  H01G4/012

Abstract: A thin film capacitor includes a capacitance portion in which a plurality of electrode layers and dielectric layers are alternately laminated, a cover layer, an insulating layer, a via hole in which one electrode layer different from an uppermost electrode layer among the plurality of electrode layers is exposed at a bottom surface thereof, and an opening which is provided inside the via hole and in which the one electrode layer is exposed at a bottom surface thereof, and in which the cover layer and the insulating layer are exposed at a side surface. The opening includes a first opening portion which passes through the insulating layer and a second opening portion which is provided below the first opening portion and passes through the cover layer, and when an inner diameter of the first opening portion is D1 and an inner diameter of the second opening portion is D2, D1>D2.

公开(公告)号：US11011315B2

公开(公告)日：2021-05-18

申请号：US16436559

申请日：2019-06-10

Applicant: TDK CORPORATION

Inventor： Michihiro Kumagae ,  Kazuhiro Yoshikawa ,  Shigeaki Tanaka ,  Hitoshi Saita

IPC: H01G4/33 ,  H01L23/498 ,  H01L49/02 ,  H05K1/11 ,  H05K1/16 ,  H05K3/46 ,  H05K1/09

Abstract: Disclosed herein is a thin film capacitor that includes a capacitive insulating film having first and second through holes, a first metal film provided on one surface of the capacitive insulating film, and a second metal film provided on the other surface of the capacitive insulating film. The first and second metal films are made of different metal materials from each other. The first metal film is divided into a first area positioned outside the first space and a second area positioned inside the first space. The second metal film is divided into a third area positioned outside the second space and a fourth area positioned inside the second space. The third area is connected to the second area through the first through hole. The fourth area is connected to the first area through the second through hole.

公开(公告)号：US10813220B2

公开(公告)日：2020-10-20

申请号：US15892722

申请日：2018-02-09

Applicant: TDK CORPORATION

Inventor： Mitsuhiro Tomikawa ,  Koichi Tsunoda ,  Kazuhiro Yoshikawa ,  Kenichi Yoshida

IPC: H05K1/18 ,  H05K3/30 ,  H05K3/38 ,  H05K3/46 ,  H05K3/00

Abstract: An electronic component embedded substrate includes: a substrate that includes an insulating layer and has a first principal surface and a second principal surface; an electronic component that is embedded in the substrate and has at least one first terminal, at least one second terminal, and a capacity part; at least one via conductor that are formed in the insulating layer and electrically connected to the second terminal; and an adhesion layer that is in contact with the second terminal on an end face of the second terminal which are close to the second principal surface. The electronic component is laminated with the insulating layer, and adhesion strength between the adhesion layer and the insulating layer is higher than that between the second terminal and the insulating layer.

公开(公告)号：US10340088B2

公开(公告)日：2019-07-02

申请号：US15899403

申请日：2018-02-20

Applicant: TDK CORPORATION

Inventor： Koichi Tsunoda ,  Mitsuhiro Tomikawa ,  Kazuhiro Yoshikawa ,  Kenichi Yoshida

IPC: H01G4/33 ,  H01G9/04 ,  H01G9/07 ,  H01G9/012 ,  H01G2/02 ,  H01G4/224 ,  H01G4/228

Abstract: In a thin-film capacitor, an electrode terminal layer is divided into a plurality of parts by a penetration portion, and includes a frame portion as one divided part. The frame portion is disposed along an outer edge of the electrode terminal layer when viewed from the bottom surface side of the electrode terminal layer, and the frame portion can hinder deformation of the electrode terminal layer stretching or warping in a thickness direction or an in-plane direction, whereby such deformation can be prevented. Accordingly, in the thin-film capacitor, the electrode terminal layer is not likely to be deformed and an improvement in strength thereof is achieved.

公开(公告)号：US11276531B2

公开(公告)日：2022-03-15

申请号：US16617106

申请日：2018-05-16

Applicant: TDK Corporation

Inventor： Koichi Tsunoda ,  Kazuhiro Yoshikawa ,  Mitsuhiro Tomikawa ,  Kenichi Yoshida

IPC: H01G4/33 ,  H01G4/01 ,  H01G4/232

Abstract: A thin-film capacitor includes an insulating base member, and a capacitance portion that is laminated on the insulating base member has a plurality of internal electrode layers which are laminated on the insulating base member and are provided in a lamination direction and dielectric layers which are sandwiched between the internal electrode layers. A relative dielectric constant of the dielectric layers is 100 or higher.

公开(公告)号：US10483345B2

公开(公告)日：2019-11-19

申请号：US15891637

申请日：2018-02-08

Applicant: TDK CORPORATION

Inventor： Mitsuhiro Tomikawa ,  Koichi Tsunoda ,  Kazuhiro Yoshikawa ,  Kenichi Yoshida

IPC: H01G4/33 ,  H01G4/228 ,  H01L49/02 ,  H01G4/30

Abstract: An electronic component embedded substrate includes: a substrate that includes an insulating layer and has a first principal surface and a second principal surface on the opposite side of the first principal surface; and an electronic component that is embedded in the substrate and has a plurality of first terminals provided close to the first principal surface, a plurality of second terminals provided close to the second principal surface, and a capacity part provided between the plurality of first terminals and the plurality of second terminals. The electronic component is configured such that at least a part of the second terminals is embedded in the insulating layer. An insulating member is provided between the neighboring second terminals to be in contact with both of the neighboring second terminals. The insulating member and the insulating layer are formed of materials whose thermal expansion coefficients are different from each other.

公开(公告)号：US11942278B2

公开(公告)日：2024-03-26

申请号：US17506003

申请日：2021-10-20

Applicant: TDK Corporation

Inventor： Michihiro Kumagae ,  Kazuhiro Yoshikawa ,  Kenichi Yoshida ,  Junki Nakamoto ,  Norihiko Matsuzaka

IPC: H01G4/30 ,  H01G4/012 ,  H01G4/33 ,  H01G4/008 ,  H01G4/12 ,  H01G4/232

CPC classification number: H01G4/306 ,  H01G4/012 ,  H01G4/33 ,  H01G4/008 ,  H01G4/1218 ,  H01G4/1227 ,  H01G4/1245 ,  H01G4/2325

Abstract: Provided is a thin film capacitor comprising a capacitance portion in which at least one dielectric layer is sandwiched between a pair of electrode layers included in a plurality of electrode layers, wherein the capacitance portion has an opening which extends in a lamination direction in which the plurality of electrode layers and the dielectric layer are laminated and through which one electrode layer of the plurality of electrode layers is exposed, the one electrode layer has an exposed portion exposed at a bottom surface of the opening, the exposed portion is in contact with a wiring layer connecting the one electrode layer and an electrode terminal, and a thickness of the exposed portion of the one electrode layer is smaller than a thickness of other portions of the one electrode layer and is 50% or more of the thickness of the other portions of the one electrode layer.

公开(公告)号：US10699844B1

公开(公告)日：2020-06-30

申请号：US16735386

申请日：2020-01-06

Applicant: TDK CORPORATION

Inventor： Hitoshi Saita ,  Kazuhiro Yoshikawa ,  Yuuki Aburakawa ,  Tatsuo Namikawa ,  Akiyasu Iioka ,  Kenichi Yoshida

IPC: H01G4/33 ,  H05K1/02 ,  H01G4/012 ,  H05K1/16 ,  H01L23/58 ,  H01L23/498

Abstract: Disclosed herein is a thin film capacitor that includes a lower electrode layer, an upper electrode layer, and a dielectric layer positioned between the lower electrode layer and the upper electrode layer. The upper electrode layer has a first capacitive electrode part opposed to the lower electrode layer through the dielectric layer without being connected to the lower electrode layer and a fiducial mark part penetrating the dielectric layer to be connected to the lower electrode layer.

公开(公告)号：US11676767B2

公开(公告)日：2023-06-13

申请号：US17165339

申请日：2021-02-02

Applicant: TDK CORPORATION

Inventor： Yuuki Aburakawa ,  Tatsuo Namikawa ,  Akiyasu Iioka ,  Hitoshi Saita ,  Kazuhiro Yoshikawa

IPC: H01G4/33 ,  H01G4/008 ,  H01G4/30 ,  H01L23/498 ,  H01L23/64 ,  H01G4/12

CPC classification number: H01G4/33 ,  H01G4/008 ,  H01G4/306 ,  H01L23/49822 ,  H01L23/642 ,  H01G4/1227 ,  H01G4/1245 ,  H01G4/1254

Abstract: Disclosed herein a thin film capacitor that includes a lower electrode layer, an upper electrode layer, and a dielectric layer disposed between the lower electrode layer and the upper electrode layer. The dielectric layer has a through hole. An inner wall surface of the through hole has a first tapered surface and a second tapered surface surrounded by the first tapered surface. The first and second tapered surfaces are not covered with the upper electrode layer and have respective first and second taper angles with respect to a surface of the lower electrode layer. The second taper angle is smaller than the first taper angle.