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公开(公告)号：US20240203972A1
公开(公告)日：2024-06-20
申请号：US18589812
申请日：2024-02-28
Applicant: TDK Corporation
Inventor： Kazuhiro YOSHIKAWA , Takeshi OOHASHI , Koichi TSUNODA , Mitsuhiro TOMIKAWA
CPC classification number: H01L27/01 , H01L21/702 , H01L24/05 , H01L24/03 , H01L2224/03462 , H01L2224/05012 , H01L2224/05015 , H01L2224/05016 , H01L2224/05582 , H01L2224/05638 , H01L2224/05655 , H01L2924/01014
Abstract: Disclosed herein is an electronic component that includes: a substrate; a capacitor on the substrate; a first insulating resin layer embedding therein the capacitor; an inductor provided on the first insulating resin layer and connected to the capacitor, the inductor including a conductor pattern; a second insulating resin layer embedding therein the inductor; a third insulating resin layer on the second insulating resin layer; a post conductor having a lower end and an upper end and penetrating the third insulating resin layer such that the lower end of the post conductor is connected to the inductor; and a terminal electrode on the third insulating resin layer and connected to the upper end of the post conductor. In a thickness direction of the substrate, the height of the post conductor is larger than a thickness of a conductor pattern constituting the inductor.
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公开(公告)号：US20230060995A1
公开(公告)日：2023-03-02
申请号：US17896744
申请日：2022-08-26
Applicant: TDK Corporation
Inventor： Kazuhiro YOSHIKAWA , Takeshi OOHASHI , Mitsuhiro TOMIKAWA , Koichi TSUNODA
Abstract: Disclosed herein is an electronic component that includes an element body having a structure in which a plurality of conductor layers are stacked in a first direction on a surface of a substrate with insulating layers interposed therebetween, and a plurality of terminal electrodes provided on a mounting surface of the element body. The mounting surface extends in the first direction and in a second direction perpendicular to the first direction. The element body includes an inductor constituted by the plurality of conductor layers and has a coil axis extending in a third direction perpendicular to both the first and second directions.
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公开(公告)号：US20190304701A1
公开(公告)日：2019-10-03
申请号：US16360405
申请日：2019-03-21
Applicant: TDK CORPORATION
Inventor： Daiki ISHII , Kazuhiro YOSHIKAWA , Koichi TSUNODA , Mitsuhiro TOMIKAWA , Junki NAKAMOTO , Kenichi YOSHIDA
Abstract: A thin-film capacitor satisfies a relationship of CTE1>CTE2>CTE3 regarding a linear expansion coefficient CTE1 of a base, a linear expansion coefficient CTE2 of a capacitance unit, and a linear expansion coefficient CTE3 of a barrier layer. The inventors have newly found that in a case in which such a relationship is satisfied, when a temperature falls from a deposition temperature, cracking occurring in the capacitance unit of the thin-film capacitor is prevented, and cracking occurring in the barrier layer is also prevented.
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公开(公告)号：US20180240599A1
公开(公告)日：2018-08-23
申请号：US15899403
申请日：2018-02-20
Applicant: TDK CORPORATION
Inventor： Koichi TSUNODA , Mitsuhiro TOMIKAWA , Kazuhiro YOSHIKAWA , Kenichi YOSHIDA
CPC classification number: H01G4/33 , H01G2/02 , H01G4/224 , H01G4/228 , H01G9/012 , H01G9/04 , H01G9/07 , H05K2201/0179 , H05K2201/0195
Abstract: In a thin-film capacitor, an electrode terminal layer is divided into a plurality of parts by a penetration portion, and includes a frame portion as one divided part. The frame portion is disposed along an outer edge of the electrode terminal layer when viewed from the bottom surface side of the electrode terminal layer, and the frame portion can hinder deformation of the electrode terminal layer stretching or warping in a thickness direction or an in-plane direction, whereby such deformation can be prevented. Accordingly, in the thin-film capacitor, the electrode terminal layer is not likely to be deformed and an improvement in strength thereof is achieved.
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Patent Agency Ranking
公开(公告)号：US20180235086A1
公开(公告)日：2018-08-16
申请号：US15892722
申请日：2018-02-09
Applicant: TDK CORPORATION
Inventor： Mitsuhiro TOMIKAWA , Koichi TSUNODA , Kazuhiro YOSHIKAWA , Kenichi YOSHIDA
Abstract: An electronic component embedded substrate includes: a substrate that includes an insulating layer and has a first principal surface and a second principal surface; an electronic component that is embedded in the substrate and has at least one first terminal, at least one second terminal, and a capacity part; at least one via conductor that are formed in the insulating layer and electrically connected to the second terminal; and an adhesion layer that is in contact with the second terminal on an end face of the second terminal which are close to the second principal surface. The electronic component is laminated with the insulating layer, and adhesion strength between the adhesion layer and the insulating layer is higher than that between the second terminal and the insulating layer.
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公开(公告)号：US20180233553A1
公开(公告)日：2018-08-16
申请号：US15891637
申请日：2018-02-08
Applicant: TDK CORPORATION
Inventor： Mitsuhiro TOMIKAWA , Koichi TSUNODA , Kazuhiro YOSHIKAWA , Kenichi YOSHIDA
Abstract: An electronic component embedded substrate includes: a substrate that includes an insulating layer and has a first principal surface and a second principal surface on the opposite side of the first principal surface; and an electronic component that is embedded in the substrate and has a plurality of first terminals provided close to the first principal surface, a plurality of second terminals provided close to the second principal surface, and a capacity part provided between the plurality of first terminals and the plurality of second terminals. The electronic component is configured such that at least a part of the second terminals is embedded in the insulating layer. An insulating member is provided between the neighboring second terminals to be in contact with both of the neighboring second terminals. The insulating member and the insulating layer are formed of materials whose thermal expansion coefficients are different from each other.
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公开(公告)号：US20200258690A1
公开(公告)日：2020-08-13
申请号：US16617106
申请日：2018-05-16
Applicant: TDK Corporation
Inventor： Koichi TSUNODA , Kazuhiro YOSHIKAWA , Mitsuhiro TOMIKAWA , Kenichi YOSHIDA
Abstract: A thin-film capacitor includes an insulating base member, and a capacitance portion that is laminated on the insulating base member has a plurality of internal electrode layers which are laminated on the insulating base member and are provided in a lamination direction and dielectric layers which are sandwiched between the internal electrode layers. A relative dielectric constant of the dielectric layers is 100 or higher.
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公开(公告)号：US20200043751A1
公开(公告)日：2020-02-06
申请号：US16499501
申请日：2018-03-16
Applicant: TDK CORPORATION
Inventor： Mitsuhiro TOMIKAWA , Kazuhiro YOSHIKAWA , Koichi TSUNODA , Kenichi YOSHIDA
Abstract: A first insulating layer, a conductor layer included on a first main surface, an electronic component included on the first main surface and a second insulating layer stacked on the first insulating layer are included, a stacking direction of the first insulating layer and the second insulating layer is the same as a stacking direction of a first electrode layer, a second electrode layer, and the dielectric layer in the electronic component, and a height position of a main surface of the electronic component on an opposite side from a side of the first main surface is different from a height position of a main surface of the conductor layer adjacent to the electronic component on an opposite side from a side of the first main surface in the stacking direction.
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公开(公告)号：US20200013554A1
公开(公告)日：2020-01-09
申请号：US16483516
申请日：2018-02-13
Applicant: TDK Corporation
Inventor： Koichi TSUNODA , Mitsuhiro TOMIKAWA , Kazuhiro YOSHIKAWA , Kenichi YOSHIDA
Abstract: In a thin-film capacitor, an electrode terminal layer and an electrode layer of a capacitor portion are connected to electrode terminals by via conductors that is formed to penetrate an insulating layer in a thickness direction thereof, and a short circuit wiring in the thickness direction is realized by the via conductors. In the thin-film capacitor, an increase in the number of terminals in the plurality of electrode terminals is achieved, a decrease in length of a circuit wiring is achieved, and thus a thin-film capacitor with low-ESL has been achieved.
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