公开(公告)号：US20210354426A1

公开(公告)日：2021-11-18

申请号：US16876560

申请日：2020-05-18

Applicant: TDK CORPORATION

Inventor： Takashi YAMADA ,  Atsushi SATO ,  Makoto ORIKASA

IPC: B32B15/01 ,  B32B7/025

Abstract: A noise suppression sheet comprises a pair of metal magnetic layers and a non-magnetic metal layer interposed between the pair of metal magnetic layers, and can achieve high magnetic shield characteristics on both surfaces.

公开(公告)号：US20130130059A1

公开(公告)日：2013-05-23

申请号：US13677509

申请日：2012-11-15

Applicant: TDK CORPORATION

Inventor： Kenichi YOSHIDA ,  Yuhei HORIKAWA ,  Makoto ORIKASA ,  Hideyuki SEIKE

IPC: H01B1/02 ,  C22C5/04

CPC classification number: H01B1/026 ,  C22C5/04 ,  C23C18/1651 ,  C23C18/34 ,  C23C18/44 ,  C23C18/54 ,  H01B1/02 ,  Y10T428/12701 ,  Y10T428/12722 ,  Y10T428/12778 ,  Y10T428/12861 ,  Y10T428/12889 ,  Y10T428/12903

Abstract: A coating is provided to a conductor, and has a layered structure of a palladium layer. The palladium layer has a crystal plane whose orientation rate is 65% or more.

Abstract translation: 向导体提供涂层，并且具有钯层的层状结构。 钯层具有取向率为65％以上的晶面。

公开(公告)号：US20210360839A1

公开(公告)日：2021-11-18

申请号：US16876583

申请日：2020-05-18

Applicant: TDK CORPORATION

Inventor： Takashi YAMADA ,  Atsushi SATO ,  Makoto ORIKASA ,  Hideharu MORO

IPC: H05K9/00

Abstract: A noise suppression sheet comprises at least one composite layer, the composite layer including: an insulating resin layer; a non-magnetic metal layer formed on the insulating resin layer; and a metal magnetic layer formed on the non-magnetic metal layer, and the composite layer has a through hole. When the noise suppression sheet comprises a plurality of composite layers, the through holes are misaligned in adjacent composite layers in the laminating direction.

公开(公告)号：US20210265256A1

公开(公告)日：2021-08-26

申请号：US17314187

申请日：2021-05-07

Applicant: TDK CORPORATION

Inventor： Takashi DAITOKU ,  Susumu TANIGUCHI ,  Akiko SEKI ,  Atsushi SATO ,  Yuhei HORIKAWA ,  Makoto ORIKASA ,  Hisayuki ABE

IPC: H01L23/498 ,  H01L33/62 ,  H05K1/09 ,  H01L21/48 ,  H05K3/40 ,  G06F3/044

Abstract: An electroconductive substrate, including: a base material; a foundation layer disposed on the base material; a trench formation layer disposed on the foundation layer, and an electroconductive pattern layer including metal plating. A trench including a bottom surface to which the foundation layer is exposed, is formed. The trench is filled with the electroconductive pattern layer. The foundation layer includes a mixed region which is formed from a surface of the foundation layer on the electroconductive pattern layer side towards the inside thereof, and contains metal particles which contain a metal configuring the electroconductive pattern layer, and enter the foundation layer.

公开(公告)号：US20190043736A1

公开(公告)日：2019-02-07

申请号：US16038711

申请日：2018-07-18

Applicant: TDK CORPORATION

Inventor： Takashi DAITOKU ,  Susumu TANIGUCHI ,  Akiko SEKI ,  Atsushi SATO ,  Yuhei HORIKAWA ,  Makoto ORIKASA ,  Hisayuki ABE

IPC: H01L21/48 ,  H01L33/62 ,  H01L25/075

Abstract: A method of producing an electroconductive substrate including a base material, and an electroconductive pattern disposed on one main surface side of the base material includes: a step of forming a trench including a bottom surface to which a foundation layer is exposed, and a lateral surface which includes a surface of a trench formation layer, according to an imprint method; and a step of forming an electroconductive pattern layer by growing metal plating from the foundation layer which is exposed to the bottom surface of the trench.

公开(公告)号：US20180114759A1

公开(公告)日：2018-04-26

申请号：US15791888

申请日：2017-10-24

Applicant: TDK Corporation

Inventor： Makoto ORIKASA ,  Yuhei HORIKAWA ,  Hisayuki ABE ,  Yoshihiro KANBAYASHI

IPC: H01L23/552 ,  H01L23/31 ,  H01L21/56 ,  H01L21/3205

CPC classification number: H01L23/552 ,  H01L21/288 ,  H01L21/32051 ,  H01L21/565 ,  H01L23/3121 ,  H01L24/32 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48106 ,  H01L2224/48227 ,  H01L2224/48472 ,  H01L2224/73265 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2224/29099 ,  H01L2924/00

Abstract: Disclosed herein is an electronic component module that includes, an electronic component, a mold resin that seals the electronic component, a conductive film that covers the mold resin, and a protective film that covers the conductive film. The protective film includes a protective layer and a low reflective layer, and the low reflective layer is free from contacting the conductive film.

公开(公告)号：US20200211951A1

公开(公告)日：2020-07-02

申请号：US16811018

申请日：2020-03-06

Applicant: TDK CORPORATION

Inventor： Takashi DAITOKU ,  Susumu TANIGUCHI ,  Akiko SEKI ,  Atsushi SATO ,  Yuhei HORIKAWA ,  Makoto ORIKASA ,  Hisayuki ABE

IPC: H01L23/498 ,  H01L33/62 ,  H05K1/09 ,  H01L21/48 ,  H05K3/40 ,  G06F3/044

Abstract: An electroconductive substrate, including: a base material; a foundation layer disposed on the base material; a trench formation layer disposed on the foundation layer, and an electroconductive pattern layer including metal plating. A trench including a bottom surface to which the foundation layer is exposed, is formed. The trench is filled with the electroconductive pattern layer. The foundation layer includes a mixed region which is formed from a surface of the foundation layer on the electroconductive pattern layer side towards the inside thereof, and contains metal particles which contain a metal configuring the electroconductive pattern layer, and enter the foundation layer.

公开(公告)号：US20190035719A1

公开(公告)日：2019-01-31

申请号：US16038491

申请日：2018-07-18

Applicant: TDK CORPORATION

Inventor： Takashi DAITOKU ,  Susumu TANIGUCHI ,  Akiko SEKI ,  Atsushi SATO ,  Yuhei HORIKAWA ,  Makoto ORIKASA ,  Hisayuki ABE

IPC: H01L23/498 ,  H01L33/62 ,  H05K1/09 ,  H05K3/40 ,  H01L21/48

Abstract: An electroconductive substrate, including: a base material; a foundation layer disposed on the base material; a trench formation layer disposed on the foundation layer, and an electroconductive pattern layer including metal plating. A trench including a bottom surface to which the foundation layer is exposed, is formed. The trench is filled with the electroconductive pattern layer. The foundation layer includes a mixed region which is formed from a surface of the foundation layer on the electroconductive pattern layer side towards the inside thereof, and contains metal particles which contain a metal configuring the electroconductive pattern layer, and enter the foundation layer.

公开(公告)号：US20190032219A1

公开(公告)日：2019-01-31

申请号：US16046359

申请日：2018-07-26

Applicant: TDK CORPORATION

Inventor： Makoto ORIKASA ,  Yuhei HORIKAWA ,  Yoshihiro KANBAYASHI ,  Hisayuki ABE

IPC: C23C18/16 ,  C23C18/32 ,  C23C18/38 ,  B32B27/08 ,  B32B27/36 ,  B32B27/18 ,  B32B15/09 ,  B32B15/20 ,  B32B3/30 ,  H01L23/52 ,  H01L27/15

Abstract: A sheet material includes a resin layer containing a binder and catalyst particles, an electroless plating film on the side of one main surface of the resin layer and including first electroless plating films and a second electroless plating film, and a base material on the side of the other main surface of the resin layer.

公开(公告)号：US20150255401A1

公开(公告)日：2015-09-10

申请号：US14591427

申请日：2015-01-07

Applicant: TDK CORPORATION

Inventor： Miyuki YANAGIDA ,  Makoto ORIKASA ,  Susumu TANIGUCHI ,  Hisayuki ABE

IPC: H01L23/552 ,  H01L23/31

CPC classification number: H01L23/552 ,  H01L23/3114 ,  H01L23/562 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2225/06537 ,  H01L2924/181 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/00012

Abstract: An electronic component module according to the present invention is provided with an electronic component, a sealing resin that seals the electronic component, and a metal film that covers a surface of the sealing resin. The sealing resin contains filler of oxide particles. Part of the filler in the sealing resin is exposed to the surface of the sealing resin. At least the part of the filler exposed to the surface of the sealing resin includes a crack that extends from an exposed surface of the filler into an inner portion. The crack is filled with at least one metal that constitutes the metal film.

Abstract translation: 根据本发明的电子部件模块设置有电子部件，密封电子部件的密封树脂和覆盖密封树脂的表面的金属膜。 密封树脂含有氧化物颗粒的填料。 密封树脂中的填料的一部分暴露于密封树脂的表面。 暴露于密封树脂表面的填料的至少一部分包括从填料的暴露表面延伸到内部的裂纹。 该裂纹填充有构成金属膜的至少一种金属。