中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

10 records (took 0.029 seconds)

    HEAT-ACTIVATED, GLUEABLE SURFACE ELEMENTS
    1.
    发明申请
    HEAT-ACTIVATED, GLUEABLE SURFACE ELEMENTS 审中-公开

    公开(公告)号：US20170145260A1

    公开(公告)日：2017-05-25

    申请号：US15417820

    申请日：2017-01-27

    Applicant: tesa SE

    Inventor： Hans Karl Engeldinger ,  Judith Grünauer ,  Klaus Keite-Telgenbüscher

    IPC: C09J5/06 ,  C09J11/04

    CPC classification number: C09J5/06 ,  C09J11/04 ,  Y10T156/10

    Abstract: A method comprising bonding an element to one or more bonding substrates by inductive heating using a magnetic field whose frequency is situated in a frequency range from 100 Hz to 200 kHz. The element comprises at least one electrically conducting layer having an electrical conductivity of more than 40 MS/m for 300K and at least one heat-activatable adhesive layer coated onto at least one side of the electrically conducting layer, and the heat-activatable adhesive layer comprises at least one thermally conductive filler. The material of the thermally conductive filler has a thermal conductivity of at least 0.5 W/(m*K) and is electrically nonconducting such that the element provides, in a direction perpendicular to the areal extent of the element, an electrical breakdown resistance, as determined in accordance with VDE 0100.

    COMPOSITE SYSTEM FOR ENCAPSULATING ELECTRONIC ARRANGEMENTS
    3.
    发明申请
    COMPOSITE SYSTEM FOR ENCAPSULATING ELECTRONIC ARRANGEMENTS 审中-公开
    用于封装电子装置的复合系统

    公开(公告)号：US20150099081A1

    公开(公告)日：2015-04-09

    申请号：US14382130

    申请日：2013-02-07

    Applicant: tesa SE

    Inventor： Minyoung Bai ,  Thilo Dollase ,  Jan Ellinger ,  Judith Grünauer

    IPC: C09J7/02 ,  B32B38/10 ,  B32B37/12 ,  C09J5/00

    CPC classification number: B32B37/12 ,  B32B38/10 ,  C09J5/00 ,  C09J7/10 ,  C09J7/403 ,  C09J2201/622 ,  C09J2203/326 ,  C09J2423/005 ,  C09J2423/105 ,  H01L51/5253 ,  H01L2924/0002 ,  Y10T428/1443 ,  Y10T428/1452 ,  Y10T428/1476 ,  H01L2924/00

    Abstract: An adhesive strip, with improved barrier effect, encapsulates electronic arrangements against permeates, whereby the composite system comprises at least (a) an adhesive strip containing at least one pressure-sensitive adhesive substance for direct application on a substrate; and (b) at least one release liner which lies directly upon the pressure-sensitive adhesive substance, wherein the surface of the release liner, that faces the pressure-sensitive adhesive substance, has a surface roughness of less that 100 nm, measured as an arithmetic mean Sa as per ISO/FDIS 25178-2:2011 of the amounts of at least 10,000 height values of the profile of a partial surface of at least 200 μm×200 μm. A method produces a release liner with a smooth surface for equipping barrier adhesive strips by removing the liner in order to encapsulate electronic arrangements with the adhesive strip.

    Abstract translation: 具有改善的屏障作用的粘合剂条将电子装置封装在渗透物上，由此复合体系至少包括（a）含有至少一种直接施加在基底上的压敏粘合剂物质的粘合剂条; 和（b）直接位于压敏粘合剂物质上的至少一个剥离衬垫，其中剥离衬垫的面向压敏粘合剂物质的表面的表面粗糙度小于100nm，测量为 根据ISO / FDIS 25178-2：2011的至少200μm×200μm的局部表面轮廓的至少10,000个高度值的算术平均值Sa。 一种方法产生具有光滑表面的剥离衬垫，用于通过移除衬垫来装备阻挡粘合剂条，以便封装具有粘合剂条的电子装置。

    TEMPERATURE-STABLE CROSS-LINKABLE ADHESIVE COMPOUND WITH HARD AND SOFT BLOCKS
    7.
    发明申请
    TEMPERATURE-STABLE CROSS-LINKABLE ADHESIVE COMPOUND WITH HARD AND SOFT BLOCKS 有权
    具有硬和软块的温度稳定的可交联粘合剂

    公开(公告)号：US20150064462A1

    公开(公告)日：2015-03-05

    申请号：US14389529

    申请日：2013-03-25

    Applicant: tesa SE

    Inventor： Klaus Keite-Telgenbüsher ,  Jan Ellinger ,  Judith Grünauer ,  Thorsten Krawinkel

    IPC: C09J153/00 ,  B05D3/02 ,  C09J7/02

    CPC classification number: C09J153/00 ,  B05D3/0218 ,  B05D3/0254 ,  C08K5/0025 ,  C08K5/0091 ,  C09J7/387 ,  C09J11/06 ,  C09J153/025 ,  C09J2453/00 ,  Y10T428/2857

    Abstract: Temperature-stable adhesive compound, comprising (i) block copolymers having a construction A-B-A, (A-B)n, (A-B)nX, or (A-B-A)nX, where X is the radical of a coupling reagent, n is an integer between 2 and 10, A is a polymer block of a vinylaromatic, and B is a polymer block of an alkene or diene, at least some of the A blocks being sulfonated, and optionally diblock copolymers of the form A-B, and (ii) at least one tackifier resin, and (iii) at least one metal complex with a substitutable complexing agent.

    Abstract translation: 温度稳定的粘合剂化合物，其包含（i）具有结构ABA，（AB）n，（AB）nX或（ABA）nX的嵌段共聚物，其中X是偶联试剂的基团，n是2和 10，A是乙烯基芳族化合物的聚合物嵌段，B是烯烃或二烯的聚合物嵌段，至少一些A嵌段被磺化，和任选的AB型的二嵌段共聚物，和（ii）至少一种增粘剂 树脂，和（iii）至少一种具有可取代的络合剂的金属络合物。

Patent Agency Ranking