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公开(公告)号：US11142672B2
公开(公告)日：2021-10-12
申请号：US16369406
申请日：2019-03-29
Applicant: tesa SE
Inventor： Klaus Keite-Telgenbüscher , Christian Schuh , Bernd Lühmann , Thilo Dollase , Minyoung Bai , Thorsten Krawinkel
IPC: C09J125/08 , C09J7/38 , C09J153/00 , C09J153/02 , C08L63/00 , B82Y30/00 , B82Y40/00 , H01L51/52
Abstract: Pressure-sensitive adhesive compound comprising at least two components forming one phase each, from which an IPN with at least two phases is produced by a cross-linking build-up reaction, the first phase having at least a softening point temperature of less than 23° C., and the second phase, after the build up reaction, having a softening temperature of greater than 23° C., the two phases having a morphology of a cross-linked nanoparticle network after the build-up reaction.
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2.发明申请公开(公告)号：US20140322526A1
公开(公告)日：2014-10-30
申请号：US14353179
申请日：2012-10-19
Applicant: tesa SE
Inventor： Thilo Dollase , Thorsten Krawinkel , Minyoung Bai
IPC: C09J153/02 , C09J135/02 , C09J7/02
CPC classification number: C09J153/02 , B32B17/064 , C03C27/10 , C08L35/02 , C08L53/00 , C08L93/00 , C08L2205/03 , C09J7/22 , C09J7/38 , C09J135/02 , C09J153/00 , C09J193/00 , C09J193/04 , H01L2924/0002 , Y10T428/266 , Y10T428/2891 , H01L2924/00
Abstract: The invention relates to an adhesive substance, in particular for encapsulating an electronic assembly against permeates, said substance comprising: (a) at least one copolymer containing at least isobutene or butene as comonomer types and at least one comonomer type which, when regarded as a hypothetical homopolymer, has a softening temperature greater than 40° C.; (b) at least one type of an at least partially hydrogenated adhesive resin; (c) at least one acrylate- or methacrylate-based type of reactive resin with a softening temperature less than 40° C., preferably less than 20° C.; and (d) at least one type of photoinitiator for initiating radical curing.
Abstract translation: 本发明涉及一种粘合剂物质，特别是用于将电子组件封装在渗透物上，所述物质包括：（a）至少一种至少含有异丁烯或丁烯作为共聚单体类型的共聚物和至少一种共聚单体类型，当被认为是 假定的均聚物，其软化温度大于40℃。 （b）至少一种类型的至少部分氢化的粘合剂树脂; （c）至少一种丙烯酸酯或甲基丙烯酸酯类型的反应性树脂，其软化温度低于40℃，优选小于20℃。 和（d）至少一种用于引发自由基固化的光引发剂。
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公开(公告)号：US09714366B2
公开(公告)日：2017-07-25
申请号：US13719277
申请日：2012-12-19
Applicant: tesa SE
Inventor： Bernd Lühmann , Klaus Keite-Telgenbüscher , Minyoung Bai , Thilo Dollase
CPC classification number: C09J7/0239 , C09J7/22 , C09J7/30 , C09J7/405 , C09J2400/163 , G01D7/005 , Y10T156/10 , Y10T428/1443 , Y10T428/24997 , Y10T428/31678
Abstract: In the case of a liner for the protection of adhesives, the protective effect is to be enhanced in respect of permeates originating from the environment and also permeates included during winding or stacking and other processing steps. This enhancement is accomplished through provision of a liner which comprises at least one adhesive release layer and at least one layer of a getter material capable of sorbing at least one permeable substance.
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公开(公告)号：US20150099081A1
公开(公告)日：2015-04-09
申请号：US14382130
申请日：2013-02-07
Applicant: tesa SE
Inventor： Minyoung Bai , Thilo Dollase , Jan Ellinger , Judith Grünauer
CPC classification number: B32B37/12 , B32B38/10 , C09J5/00 , C09J7/10 , C09J7/403 , C09J2201/622 , C09J2203/326 , C09J2423/005 , C09J2423/105 , H01L51/5253 , H01L2924/0002 , Y10T428/1443 , Y10T428/1452 , Y10T428/1476 , H01L2924/00
Abstract: An adhesive strip, with improved barrier effect, encapsulates electronic arrangements against permeates, whereby the composite system comprises at least (a) an adhesive strip containing at least one pressure-sensitive adhesive substance for direct application on a substrate; and (b) at least one release liner which lies directly upon the pressure-sensitive adhesive substance, wherein the surface of the release liner, that faces the pressure-sensitive adhesive substance, has a surface roughness of less that 100 nm, measured as an arithmetic mean Sa as per ISO/FDIS 25178-2:2011 of the amounts of at least 10,000 height values of the profile of a partial surface of at least 200 μm×200 μm. A method produces a release liner with a smooth surface for equipping barrier adhesive strips by removing the liner in order to encapsulate electronic arrangements with the adhesive strip.
Abstract translation: 具有改善的屏障作用的粘合剂条将电子装置封装在渗透物上，由此复合体系至少包括（a）含有至少一种直接施加在基底上的压敏粘合剂物质的粘合剂条; 和（b）直接位于压敏粘合剂物质上的至少一个剥离衬垫，其中剥离衬垫的面向压敏粘合剂物质的表面的表面粗糙度小于100nm，测量为 根据ISO / FDIS 25178-2：2011的至少200μm×200μm的局部表面轮廓的至少10,000个高度值的算术平均值Sa。 一种方法产生具有光滑表面的剥离衬垫，用于通过移除衬垫来装备阻挡粘合剂条，以便封装具有粘合剂条的电子装置。
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公开(公告)号：US10308845B2
公开(公告)日：2019-06-04
申请号：US15138414
申请日：2016-04-26
Applicant: TESA SE
Inventor： Christian Schuh , Klaus Keite-Telgenbüscher , Chris Gäbert , Minyoung Bai
IPC: C09J163/00 , C09J7/38 , C09J163/04 , C08L33/06 , C08L75/04
Abstract: An adhesive tape containing an adhesive comprising at least one polymer optionally a tackifier resin at least one reactive resin, the adhesive comprising at least 104 parts of the at least one reactive resin per 100 parts of polymer and tackifier resin at least one initiator and/or curing agent and/or accelerator where the adhesive is a pressure sensitive adhesive, the at least one polymer being present as continuous polymer phase in the uncured state of the pressure sensitive adhesive.
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Patent Agency Ranking
6.发明申请公开(公告)号：US20140315016A1
公开(公告)日：2014-10-23
申请号：US14351800
申请日：2012-10-19
Applicant: tesa SE
Inventor： Thilo Dollase , Thorsten Krawinkel , Minyoung Bai
IPC: H01L23/29 , C09J7/02 , C09J153/00
CPC classification number: H01L23/293 , B32B17/06 , B32B17/064 , C03C27/10 , C08L53/00 , C08L63/00 , C08L93/00 , C08L93/04 , C09J7/00 , C09J7/387 , C09J153/00 , C09J163/00 , C09J193/00 , C09J193/04 , C09J2203/326 , C09J2453/00 , C09K3/10 , H01L31/0481 , H01L51/52 , H01L51/5246 , H01L2251/5338 , H01L2924/0002 , Y02E10/50 , Y10T428/269 , Y10T428/287 , H01L2924/00
Abstract: An adhesive and method for encapsulating an electronic arrangement with respect to permeants, wherein the adhesive and method have (a) at least one copolymer comprising at least isobutylene or butylene as comonomer kind and at least one comonomer kind which, considered as hypothetical homopolymer, has a softening temperature of greater than 40° C., (b) at least one kind of an at least partly hydrogenated tackifier resin, (c) at least one kind of a reactive resin based on cyclic ethers having a softening temperature of less than 40° C., preferably less than 20° C., and (d) at least one kind of a photoinitiator for initiating cationic curing
Abstract translation: 一种用于相对于渗透剂封装电子装置的粘合剂和方法，其中所述粘合剂和方法具有（a）至少一种共聚物，其至少包含异丁烯或丁烯作为共聚单体类型和至少一种被认为是假定均聚物的共聚单体类型 软化温度大于40℃，（b）至少一种至少部分氢化的增粘树脂，（c）至少一种基于软化温度低于40℃的环醚的反应性树脂 ℃，优选小于20℃，和（d）至少一种用于引发阳离子固化的光引发剂
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公开(公告)号：US20130183471A1
公开(公告)日：2013-07-18
申请号：US13719277
申请日：2012-12-19
Applicant: tesa SE
Inventor： Bernd Lühmann , Klaus Keite-Telgenbüscher , Minyoung Bai , Thilo Dollase
CPC classification number: C09J7/0239 , C09J7/22 , C09J7/30 , C09J7/405 , C09J2400/163 , G01D7/005 , Y10T156/10 , Y10T428/1443 , Y10T428/24997 , Y10T428/31678
Abstract: In the case of a liner for the protection of adhesives, the protective effect is to be enhanced in respect of permeates originating from the environment and also permeates included during winding or stacking and other processing steps. This enhancement is accomplished through provision of a liner which comprises at least one adhesive release layer and at least one layer of a getter material capable of sorbing at least one permeable substance.
Abstract translation: 在用于保护粘合剂的衬垫的情况下，在来自环境的渗透物以及卷绕或堆叠和其它加工步骤期间包括的渗透物方面，保护效果将得到提高。 这种增强是通过提供衬垫来实现的，所述衬垫包括至少一个粘合剂剥离层和至少一层能够吸附至少一种可渗透物质的吸气剂材料层。
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公开(公告)号：US09543549B2
公开(公告)日：2017-01-10
申请号：US14411585
申请日：2013-05-27
Applicant: TESA SE
Inventor： Minyoung Bai , Jan Ellinger , Judith Grünauer , Klaus Keite-Telgenbüscher , Anika Petersen
IPC: H01L21/00 , H01L51/56 , C09J7/00 , C09J7/02 , C09J11/04 , H01L51/00 , H01L51/52 , C09J153/00 , C09J153/02 , C09J157/02 , C09J163/00 , C09J177/06
CPC classification number: H01L51/56 , C09J7/00 , C09J7/10 , C09J7/20 , C09J7/35 , C09J7/38 , C09J11/04 , C09J153/005 , C09J153/02 , C09J157/02 , C09J163/00 , C09J177/06 , C09J2201/606 , C09J2203/326 , C09J2205/102 , C09J2400/22 , C09J2453/00 , C09J2463/00 , C09J2477/00 , H01L51/0096 , H01L51/5246 , H01L51/5253 , H01L51/5259 , H01L2924/16195 , Y02E10/549
Abstract: The invention relates to a method for protecting an electronic arrangement which is disposed on a substrate and comprises organic constituents, where a cover is applied to the electronic arrangement in such a way that the electronic arrangement is at least partly covered by the cover, the cover being bonded at least over a partial area to the substrate and/or to the electronic arrangement, the adhesive bond being produced by means of at least one layer of an adhesive in an adhesive tape, characterized in that the adhesive comprises a getter material which is capable of at least one permeable substance, the getter material being present in the adhesive in a proportion of not more than 2 wt %, based on the adhesive with the getter material.
Abstract translation: 本发明涉及一种用于保护电子装置的方法，该电子装置设置在基板上并且包括有机成分，其中盖子以这样的方式施加到电子装置，使得电子装置至少部分被盖盖住，盖子 至少在部分区域上粘合到基底和/或电子装置上，粘合剂粘合通过粘合带中的至少一层粘合剂产生，其特征在于，所述粘合剂包括吸气剂材料，其为 能够至少一种可渗透物质，基于与吸气剂材料的粘合剂，吸气剂材料以不超过2重量％的比例存在于粘合剂中。
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公开(公告)号：US11866614B2
公开(公告)日：2024-01-09
申请号：US17471642
申请日：2021-09-10
Applicant: tesa SE
Inventor： Klaus Keite-Telgenbuscher , Christian Schuh , Bernd Luhmann , Thilo Dollase , Minyoung Bai , Thorsten Krawinkel
IPC: C09J125/08 , C09J153/00 , C09J153/02 , C09J7/38 , C08L63/00 , B82Y30/00 , B82Y40/00 , H10K50/844
CPC classification number: C09J125/08 , C08L63/00 , C09J7/387 , C09J153/00 , C09J153/025 , B82Y30/00 , B82Y40/00 , C08L2205/04 , C09J2301/122 , C09J2301/124 , C09J2301/302 , C09J2301/312 , C09J2425/00 , C09J2453/00 , H10K50/844 , Y10T428/269 , Y10T428/287 , C09J153/025 , C08L63/00
Abstract: A structural adhesive bond formed with a pressure-sensitive adhesive that comprises at least two components forming one phase each, from which an interpenetrating network with at least two phases is produced by a cross-linking build-up reaction, the first phase and second phase having at least a softening point temperature of less than 23° C. and greater than 23° C., respectively, the two phases having a morphology of a cross-linked nanoparticle network after the build-up reaction.
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公开(公告)号：US10386209B2
公开(公告)日：2019-08-20
申请号：US15626664
申请日：2017-06-19
Applicant: tesa SE
Inventor： Bernd Lühmann , Klaus Keite-Telgenbüscher , Minyoung Bai , Thilo Dollase
Abstract: Release liners and methods protect one or more adhesives, wherein the release liners and/or methods comprise at least one abhesive release layer and at least one layer of a getter material capable of sorbing at least one permeable substance, wherein the getter material is at least one substance selected from the group consisting of lithium, beryllium, boron, sodium, magnesium, potassium, calcium, manganese, iron, nickel, zinc, gallium, germanium, cadmium, indium, caesium, barium, boron oxide, calcium oxide, chromium oxide, manganese oxide, iron oxide, copper oxide, silver oxide, indium oxide, barium oxide, lead oxide and mixtures of two or more of the above substances.
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