公开(公告)号：USD909603S1

公开(公告)日：2021-02-02

申请号：US29665837

申请日：2018-10-08

Applicant: TOKYO ELECTRON LIMITED

Designer： Toru Tokimatu ,  Akihiro Teramoto

公开(公告)号：US11868057B2

公开(公告)日：2024-01-09

申请号：US17485698

申请日：2021-09-27

Applicant: Tokyo Electron Limited

Inventor： Kenta Shibasaki ,  Hiroichi Inada ,  Satoshi Shimmura ,  Koji Takayanagi ,  Kenji Yada ,  Shinichi Seki ,  Akihiro Teramoto

IPC: B08B3/08 ,  B05C11/02 ,  G03F7/00 ,  G03F7/16 ,  B05C1/02

CPC classification number: G03F7/70925 ,  B05C1/02 ,  B08B3/08 ,  G03F7/162

Abstract: A solution treatment apparatus applies a coating solution onto a substrate. The apparatus includes a holder holding and rotating the substrate; a coating solution supplier supplying the coating solution to the substrate on the holder; and an inner cup surrounding the holder from a lateral side and having a peripheral edge side upper surface inclining down outward in a radial direction from an apex part located below a peripheral edge side of the substrate on the holder. The inner cup has discharge ports formed along a circumferential direction at the apex part; and the discharge ports are formed to discharge a cleaning solution and make the cleaning solution flow down along the peripheral edge side upper surface of the inner cup, thereby cleaning the peripheral edge side upper surface, and to discharge the cleaning solution outward in the radial direction and obliquely upward.

公开(公告)号：US11476143B2

公开(公告)日：2022-10-18

申请号：US17089814

申请日：2020-11-05

Applicant: Tokyo Electron Limited

Inventor： Akihiro Teramoto ,  Tatsuhiko Tsujihashi ,  Kousei Ide

IPC: H01L21/677

Abstract: A substrate processing apparatus configured to process a substrate includes a substrate receptacle placing unit configured to place thereon a substrate receptacle accommodating therein the substrate to be processed; and a storage zone provided adjacent to the substrate receptacle placing unit to store therein the substrate receptacle. The storage zone includes multiple storages which are vertically arranged in multiple levels and configured to place and store thereon the multiple substrate receptacles horizontally. The substrate receptacle is transferred between a first storage of the multiple storages at an uppermost position and a ceiling travelling vehicle configured to be moved above the substrate processing apparatus. A second storage of the multiple storages under the first storage is configured to place and store the substrate receptacle thereon such that a direction of the substrate receptacle on the second storage is different from a direction of the substrate receptacle on the first storage.

公开(公告)号：US20180240695A1

公开(公告)日：2018-08-23

申请号：US15901954

申请日：2018-02-22

Applicant: Tokyo Electron Limited

Inventor： Tokutarou Hayashi ,  Hiroki Harada ,  Akihiro Teramoto ,  Tooru Tokimatu ,  Masahiro Abe ,  Kazutoshi Ishimaru

IPC: H01L21/677 ,  G03F7/16 ,  G03F7/20 ,  B65G43/08 ,  H01L21/687 ,  H01L21/67

CPC classification number: H01L21/67706 ,  B65G43/08 ,  G03F7/162 ,  G03F7/70733 ,  H01L21/67051 ,  H01L21/67259 ,  H01L21/67742 ,  H01L21/681 ,  H01L21/68707

Abstract: A device includes a substrate holding unit 25 configured to hold a substrate and be movable in a transversal direction to transfer the substrate from one module to another module; a first detecting unit 3 configured to detect a position of the substrate on the substrate holding unit 25 before the substrate holding unit 25 transfers the substrate into the another module after receiving the substrate from the one module; second detecting units 55 and 56 configured to detect a position deviation between a position of the substrate holding unit 25, which is located at a temporary position set to transfer the substrate into the another module, and the temporary position; and a position determining unit 10 configured to determine a transfer position where the substrate is transferred into the another module based on the position of the substrate on the substrate holding unit 25 and the position deviation.

公开(公告)号：US12174549B2

公开(公告)日：2024-12-24

申请号：US18213785

申请日：2023-06-23

Applicant: Tokyo Electron Limited

Inventor： Yuichiro Kunugimoto ,  Shota Ueyama ,  Akihiro Teramoto ,  Yuta Nishiyama ,  Shinichi Hatakeyama

IPC: G01F9/00 ,  B08B3/02 ,  B08B13/00 ,  G01G21/22 ,  G03F7/00 ,  G03F7/16

Abstract: A substrate processing system includes: a measuring unit provided detachably with respect to a placement portion of a placement stage; a measuring jig for measuring a processing liquid; a liquid processing unit including a supplier which supplies the processing liquid to the measuring jig; a transfer mechanism for transferring the measuring jig between the measuring unit and the liquid processing unit; and a controller. The controller executes: a process of transferring the measuring jig in the measuring unit from the measuring unit to the liquid processing unit; a process of ejecting the processing liquid from the supplier to the measuring jig; a third process of transferring the measuring jig from the liquid processing unit to the measuring unit; and a fourth process of calculating an ejection amount of the processing liquid based on a measurement value in the measuring unit.

公开(公告)号：US11211278B2

公开(公告)日：2021-12-28

申请号：US16655330

申请日：2019-10-17

Applicant: TOKYO ELECTRON LIMITED

Inventor： Akihiro Teramoto ,  Suguru Enokida ,  Masashi Tsuchiyama ,  Keisuke Sasaki

IPC: H01L21/677

Abstract: There is provided a substrate processing apparatus for processing a substrate, including: a storage part provided on an uppermost portion of the substrate processing apparatus and on which a substrate accommodation container for accommodating the substrate is placed; and a first transfer device configured to directly or indirectly deliver the substrate accommodation container between the storage part and a loading/unloading part, wherein the loading/unloading part is configured to place the substrate accommodation container thereon in the substrate processing apparatus and to load and unload the substrate into and from a processing part of the substrate processing apparatus, and the first transfer device is configured to deliver the substrate accommodation container with respect to an overhead hoist transport that moves above the substrate processing apparatus.

公开(公告)号：US11726409B2

公开(公告)日：2023-08-15

申请号：US17522050

申请日：2021-11-09

Applicant: Tokyo Electron Limited

Inventor： Yuichiro Kunugimoto ,  Shota Ueyama ,  Akihiro Teramoto ,  Yuta Nishiyama ,  Shinichi Hatakeyama

IPC: G01G21/22 ,  G03F7/00 ,  B08B13/00 ,  G01F9/00 ,  G03F7/16 ,  B08B3/02

CPC classification number: G03F7/70491 ,  B08B3/02 ,  B08B13/00 ,  G01F9/003 ,  G01G21/22 ,  G03F7/16

Abstract: A substrate processing system includes: a measuring unit provided detachably with respect to a placement portion of a placement stage; a measuring jig for measuring a processing liquid; a liquid processing unit including a supplier which supplies the processing liquid to the measuring jig; a transfer mechanism for transferring the measuring jig between the measuring unit and the liquid processing unit; and a controller. The controller executes: a process of transferring the measuring jig in the measuring unit from the measuring unit to the liquid processing unit; a process of ejecting the processing liquid from the supplier to the measuring jig; a third process of transferring the measuring jig from the liquid processing unit to the measuring unit; and a fourth process of calculating an ejection amount of the processing liquid based on a measurement value in the measuring unit.

公开(公告)号：US09136150B2

公开(公告)日：2015-09-15

申请号：US13759471

申请日：2013-02-05

Applicant: Tokyo Electron Limited

Inventor： Tokutarou Hayashi ,  Yuichi Douki ,  Hirotoshi Mori ,  Akihiro Teramoto

IPC: G06F7/00 ,  G05B19/18 ,  B63B27/00 ,  B65H1/00 ,  H01L21/677 ,  H01L21/673 ,  H01L21/67

CPC classification number: H01L21/677 ,  H01L21/67178 ,  H01L21/67184 ,  H01L21/67259 ,  H01L21/67288 ,  H01L21/673 ,  H01L21/67742

Abstract: There is provided a technique which can prevent poor processing of successive substrates in the event of a failure of a module or a transport mechanism for transporting a substrate between modules. A substrate processing apparatus includes: a plurality of modules from which a substrate holder of a substrate transport mechanism receives a substrate; a sensor section for detecting a displacement of the holding position of a substrate, held by the substrate holder, from a reference position preset in the substrate holder; and a storage section for storing the displacement, detected when the substrate holder receives a substrate from each of the modules, in a chronological manner for each module. A failure of one of the modules or the substrate transport mechanism is estimated based on the chronological data on the displacement for each module, stored in the storage section. This enables an early detection of a failure or abnormality.

Abstract translation: 提供了一种技术，其可以防止在模块故障或用于在模块之间传送基板的输送机构的情况下连续的基板的加工不良。 基板处理装置包括：多个模块，基板传送机构的基板保持器从该多个模块接收基板; 传感器部分，用于检测由衬底保持器保持的衬底的保持位置从预设在衬底保持器中的参考位置的位移; 以及存储部，用于存储当基板保持器从每个模块接收到基板时检测到的位移，用于每个模块的按时间顺序排列。 基于存储在存储部中的每个模块的位移的时间顺序数据来估计模块或基板传送机构中的一个的故障。 这使得能够及早发现故障或异常。

公开(公告)号：USD922609S1

公开(公告)日：2021-06-15

申请号：US29665836

申请日：2018-10-08

Applicant: TOKYO ELECTRON LIMITED

Designer： Toru Tokimatu ,  Akihiro Teramoto

公开(公告)号：US20210134636A1

公开(公告)日：2021-05-06

申请号：US17089814

申请日：2020-11-05

Applicant: Tokyo Electron Limited

Inventor： Akihiro Teramoto ,  Tatsuhiko Tsujihashi ,  Kousei Ide

IPC: H01L21/677

Abstract: A substrate processing apparatus configured to process a substrate includes a substrate receptacle placing unit configured to place thereon a substrate receptacle accommodating therein the substrate to be processed; and a storage zone provided adjacent to the substrate receptacle placing unit to store therein the substrate receptacle. The storage zone includes multiple storages which are vertically arranged in multiple levels and configured to place and store thereon the multiple substrate receptacles horizontally. The substrate receptacle is transferred between a first storage of the multiple storages at an uppermost position and a ceiling travelling vehicle configured to be moved above the substrate processing apparatus. A second storage of the multiple storages under the first storage is configured to place and store the substrate receptacle thereon such that a direction of the substrate receptacle on the second storage is different from a direction of the substrate receptacle on the first storage.