公开(公告)号：US12257611B2

公开(公告)日：2025-03-25

申请号：US17914108

申请日：2021-03-15

Applicant: Tokyo Electron Limited

Inventor： Satoshi Shimmura ,  Koji Takayanagi ,  Kenta Shibasaki ,  Hiroichi Inada

IPC: B08B13/00 ,  B05C11/08 ,  B05C21/00 ,  B08B9/08 ,  G03F7/16

Abstract: A cleaning jig of a disc shape used for cleaning an inside of a container while being held by a rotary holding device in a same manner as a substrate in a spin coating apparatus that supplies a processing liquid onto a substrate held by the rotary holding device disposed in the container and forms a film of the processing liquid on the substrate by rotating the substrate. A peripheral ceiling portion and a peripheral bottom portion are formed over an entire periphery of the cleaning jig, a discharge port is formed over the entire periphery between the peripheral ceiling portion and the peripheral bottom portion, a plurality of holes is formed in the peripheral bottom portion at intervals in a circumferential direction to communicate with the discharge port, and a lower surface of the peripheral ceiling portion is inclined toward an upper periphery.

公开(公告)号：US20220084844A1

公开(公告)日：2022-03-17

申请号：US17471457

申请日：2021-09-10

Applicant: Tokyo Electron Limited

Inventor： Satoshi Shimmura ,  Kohei Kawakami ,  Hiroichi Inada ,  Koji Takayanagi

IPC: H01L21/67 ,  H01L21/02

Abstract: A nozzle standby device configured to allow a nozzle to stand by therein includes a nozzle accommodation unit, having an inner circumferential surface formed to surround a leading end portion of the nozzle, provided with a drain opening facing a discharge opening of the nozzle; and a solvent discharge opening opened within the nozzle accommodation unit. The nozzle accommodation unit has a diameter reducing portion having a first and a second inner circumferential surfaces having different angles with respect to a center line of the nozzle accommodation unit such that an inner diameter of the diameter reducing portion becomes smaller toward the drain opening. An intersection point of two straight lines extending along two opposite portions of the first inner circumferential surface is located above the discharge opening of the nozzle when the leading end portion of the nozzle is placed in the diameter reducing portion.

公开(公告)号：US11062899B2

公开(公告)日：2021-07-13

申请号：US15876283

申请日：2018-01-22

Applicant: TOKYO ELECTRON LIMITED

Inventor： Takafumi Hasimoto ,  Masahide Tadokoro ,  Taku Nagakane ,  Koji Takayanagi

IPC: H01L21/02 ,  H01L21/67 ,  H01L21/687 ,  B08B3/08 ,  B08B3/04 ,  G03F7/40 ,  G03F7/16

Abstract: There is provided a coated film removing apparatus for removing, with a removal liquid, a peripheral portion of a coated film formed by supplying a coating liquid to a surface of a circular substrate, including: a rotary holding part configured to hold the substrate and rotate together with the substrate; a removal liquid nozzle configured to discharge the removal liquid on a peripheral portion of the surface of the substrate held by the rotary holding part so that the removal liquid is oriented toward a downstream side in a rotational direction of the substrate; and a control part configured to output a control signal so as to rotate the substrate at a rotation speed of 2,300 rpm or more when discharging the removal liquid.

公开(公告)号：US10974181B2

公开(公告)日：2021-04-13

申请号：US16580292

申请日：2019-09-24

Applicant: Tokyo Electron Limited

Inventor： Yuichi Yoshida ,  Ryouichirou Naitou ,  Arnaud Alain Jean Dauendorffer ,  Koji Takayanagi ,  Shinobu Miyazaki

IPC: B01D37/02 ,  H01L21/67 ,  B01D35/18

Abstract: In one embodiment, after a new filter unit is installed in a treatment liquid supply apparatus, there is performed, before a solvent-containing treatment liquid is passed through the filter unit, a step of soaking the filter unit with a solvent for pretreatment and then discharging therefrom the solvent. The solubility of a material, constituting a filter part of the filter unit, to the solvent is greater than the solubility of the material to the treatment liquid. This step makes it possible to remove a component, which may elute from the filter part into the treatment liquid to produce foreign matters (particles), before treatment liquid is passed through the filter unit.

公开(公告)号：US20210039131A1

公开(公告)日：2021-02-11

申请号：US16986412

申请日：2020-08-06

Applicant: Tokyo Electron Limited

Inventor： Satoshi Shimmura ,  Yuji Sakai ,  Kenta Shibasaki ,  Koji Takayanagi ,  Kenji Yada ,  Hiroichi Inada ,  Shinichi Seki ,  Kento Ogata

IPC: B05C11/10 ,  B05C11/08 ,  B05C13/02 ,  B05B14/30

Abstract: A substrate processing apparatus includes a cover member placed to surround a substrate held by a rotary holder; a collecting member placed in an exhaust path formed between the cover member and the rotary holder; and a solvent supply placed above the collecting member and configured to supply a solvent to the collecting member. The solvent supply includes an inner storage space surrounding the substrate; an outer storage space surrounding the inner storage space; and a partition wall extending along a circumferential direction to partition the inner storage space and the outer storage space. Multiple communication holes are extended to penetrate the partition wall such that the solvent introduced into the outer storage space flows to the inner storage space. Multiple dripping holes are extended to penetrate a bottom wall of the inner storage space such that the solvent within the inner storage space drops toward the collecting member.

公开(公告)号：US20130239887A1

公开(公告)日：2013-09-19

申请号：US13841880

申请日：2013-03-15

Applicant: TOKYO ELECTRON LIMITED

Inventor： Kousuke Yoshihara ,  Tomohiro Iseki ,  Koji Takayanagi

IPC: H01L21/02

CPC classification number: H01L21/02104 ,  B05D1/005 ,  G03F7/162 ,  H01L21/02282 ,  H01L21/6715

Abstract: In a coating step, a substrate is rotated at a high speed, and in that state a resist solution is discharged from a first nozzle to a central portion of the substrate to apply the resist solution over the substrate. Subsequently, in a flattening step, the rotation of the substrate is decelerated and the substrate is rotated at a low speed to flatten the resist solution on the substrate. In this event, the discharge of the resist solution by the first nozzle in the coating step is performed until a middle of the flattening step, and when the discharge of the resist solution is finished in the flattening step, the first nozzle is moved to move a discharge position of the resist solution from the central portion of the substrate. According to the present invention, the resist solution can be applied uniformly within the substrate.

Abstract translation: 在涂布步骤中，基板高速旋转，并且在该状态下，将抗蚀剂溶液从第一喷嘴排出到基板的中心部分，以将抗蚀剂溶液涂覆在基板上。 随后，在平坦化步骤中，基板的旋转减速，并且基板以低速旋转以使基板上的抗蚀剂溶液平坦化。 在这种情况下，在涂布步骤中，通过第一喷嘴对抗蚀剂溶液的排出进行到平坦化阶段的中间，并且当在平坦化步骤中完成抗蚀剂溶液的排出时，第一喷嘴移动 抗蚀剂溶液从衬底的中心部分的放电位置。 根据本发明，能够将抗蚀剂溶液均匀地涂布在基板内。

公开(公告)号：US11868057B2

公开(公告)日：2024-01-09

申请号：US17485698

申请日：2021-09-27

Applicant: Tokyo Electron Limited

Inventor： Kenta Shibasaki ,  Hiroichi Inada ,  Satoshi Shimmura ,  Koji Takayanagi ,  Kenji Yada ,  Shinichi Seki ,  Akihiro Teramoto

IPC: B08B3/08 ,  B05C11/02 ,  G03F7/00 ,  G03F7/16 ,  B05C1/02

CPC classification number: G03F7/70925 ,  B05C1/02 ,  B08B3/08 ,  G03F7/162

Abstract: A solution treatment apparatus applies a coating solution onto a substrate. The apparatus includes a holder holding and rotating the substrate; a coating solution supplier supplying the coating solution to the substrate on the holder; and an inner cup surrounding the holder from a lateral side and having a peripheral edge side upper surface inclining down outward in a radial direction from an apex part located below a peripheral edge side of the substrate on the holder. The inner cup has discharge ports formed along a circumferential direction at the apex part; and the discharge ports are formed to discharge a cleaning solution and make the cleaning solution flow down along the peripheral edge side upper surface of the inner cup, thereby cleaning the peripheral edge side upper surface, and to discharge the cleaning solution outward in the radial direction and obliquely upward.

公开(公告)号：US10268116B2

公开(公告)日：2019-04-23

申请号：US15816088

申请日：2017-11-17

Applicant: Tokyo Electron Limited

Inventor： Kousuke Yoshihara ,  Koji Takayanagi ,  Toshinobu Furusho ,  Takashi Sasa ,  Daisuke Ishimaru

IPC: G03F7/16 ,  H01L21/67

Abstract: A processing liquid supplying apparatus performs an ejecting step in which a processing liquid suctioned into a pump passes through a filter device and is ejected from an ejecting part without returning the processing liquid back to the pump; a returning step in which the processing liquid suctioned into the pump is returned to a processing liquid source side of a mixing section; and a replenishing step in which the processing liquid returned to the processing liquid source side is suctioned into the pump together with the processing liquid replenished from the processing liquid source. The processing liquid passes through the filter device in at least one of the returning step and the replenishing step. The amount of the processing liquid returned to the processing liquid source side in the returning step is larger than the amount of the processing liquid ejected from the ejecting part in the ejecting step.

公开(公告)号：US10256122B2

公开(公告)日：2019-04-09

申请号：US15971320

申请日：2018-05-04

Applicant: TOKYO ELECTRON LIMITED

Inventor： Masato Mizuta ,  Koji Takayanagi

IPC: F27B5/02 ,  H01L21/67 ,  H01L21/687 ,  F27B17/00

Abstract: A substrate heating device includes: heating modules each having a processing vessel within which a heating plate is disposed, an gas inlet port for introducing a purge gas into a processing atmosphere, and an exhaust port for exhausting the processing atmosphere; individual exhaust paths each connected to the exhaust port of the heating modules; a common exhaust path connected to downstream ends of the individual exhaust paths of the heating modules; a branch path branched from the individual exhaust paths and opened to the outside of the processing vessel; and an exhaust flow rate adjusting unit configured to adjust a flow rate ratio of an exhaust flow rate of a gas exhausted from the exhaust port into the common exhaust path and an introduction flow rate of a gas introduced from the outside of the processing vessel into the common exhaust path through the branch path.

公开(公告)号：US09846363B2

公开(公告)日：2017-12-19

申请号：US14528290

申请日：2014-10-30

Applicant: TOKYO ELECTRON LIMITED

Inventor： Kousuke Yoshihara ,  Koji Takayanagi ,  Toshinobu Furusho ,  Takashi Sasa ,  Daisuke Ishimaru

IPC: G03F7/16 ,  H01L21/67

CPC classification number: G03F7/16 ,  H01L21/67017

Abstract: A processing liquid supplying apparatus performs an ejecting step in which a processing liquid suctioned into a pump passes through a filter device and is ejected from an ejecting part without returning the processing liquid back to the pump; a returning step in which the processing liquid suctioned into the pump is returned to a processing liquid source side of a mixing section; and a replenishing step in which the processing liquid returned to the processing liquid source side is suctioned into the pump together with the processing liquid replenished from the processing liquid source. The processing liquid passes through the filter device in at least one of the returning step and the replenishing step. The amount of the processing liquid returned to the processing liquid source side in the returning step is larger than the amount of the processing liquid ejected from the ejecting part in the ejecting step.