公开(公告)号：US20150367266A1

公开(公告)日：2015-12-24

申请号：US14841794

申请日：2015-09-01

Applicant: Tokyo Electron Limited

Inventor： Yuichi Yoshida ,  Ryouichirou Naitou ,  Toshinobu Furusho

IPC: B01D36/00 ,  B01D19/00

CPC classification number: B01D36/001 ,  B01D19/0036 ,  B01D37/046 ,  B01D2201/202 ,  B01D2201/204 ,  B01D2221/14 ,  C02F1/20 ,  C02F2103/346 ,  C02F2209/03 ,  F04B53/20 ,  G03C2001/7437

Abstract: Disclosed are an apparatus and a method for reducing a processing liquid consumed for removing bubbles from a new filter unit, and shortening a start-up time when the filter unit is attached in a processing liquid supply passage. The method includes: filling the processing liquid into a new filter unit, decompressing inside of the filter unit into a first pressure atmosphere in order to remove bubbles from the filter unit, boosting a pressure of the inside of the filter unit, flowing the processing liquid into the filter unit from a primary side of the filter unit, and supplying the processing liquid flowing from the filter unit to an object to be processed through a nozzle thereby performing a liquid processing and quickly removing the bubbles.

Abstract translation: 公开了一种用于减少从新的过滤器单元去除气泡所消耗的处理液体的装置和方法，并且当过滤器单元附接在处理液体供应通道中时，缩短了启动时间。 该方法包括：将处理液填充到新的过滤器单元中，将过滤器单元的内部减压到第一压力气氛中，以从过滤器单元去除气泡，提高过滤器单元内部的压力，使处理液体流动 从过滤器单元的初级侧进入过滤器单元，并且通过喷嘴将从过滤器单元流动的处理液体供给到待处理物体，从而进行液体处理并快速除去气泡。

公开(公告)号：US08678684B2

公开(公告)日：2014-03-25

申请号：US13760399

申请日：2013-02-06

Applicant: Tokyo Electron Limited

Inventor： Taro Yamamoto ,  Kousuke Yoshihara ,  Yuichi Yoshida

IPC: G03D5/00

CPC classification number: H01L21/027 ,  G03F7/3021 ,  H01L21/67051 ,  H01L21/6715

Abstract: A method of developing a substrate including rotating the substrate and supplying a developing liquid from a discharge port of a developer nozzle onto the surface of the substrate, while moving the developer nozzle, disposed above the substrate, from a central portion towards a peripheral portion of the substrate, and supplying a first rinse liquid from a discharge port of a first rinse nozzle onto the surface of the substrate, while moving the first rinse nozzle, disposed above the substrate, from the central portion towards the peripheral portion of the substrate. The supplying of the developing liquid and the first rinse liquid are performed concurrently, with the first rinse nozzle being maintained nearer to a center of the substrate than the developer nozzle.

Abstract translation: 一种显影衬底的方法，包括使衬底旋转并将显影液从显影剂喷嘴的排出口供应到衬底的表面上，同时将位于衬底上方的显影剂喷嘴从中心部分朝向衬底的周边部分移动 并且将第一冲洗液从第一冲洗喷嘴的排出口提供到基板的表面上，同时将设置在基板上方的第一冲洗喷嘴从中心部分朝向基板的周边部分移动。 同时进行显影液和第一漂洗液的供给，第一冲洗喷嘴比显影剂喷嘴更靠近基板的中心。

公开(公告)号：US10734251B2

公开(公告)日：2020-08-04

申请号：US14101669

申请日：2013-12-10

Applicant: TOKYO ELECTRON LIMITED

Inventor： Koji Takayanagi ,  Yukie Minekawa ,  Yuichi Yoshida ,  Kousuke Yoshihara ,  Yuichi Terashita ,  Toshinobu Furusho ,  Takashi Sasa

IPC: H01L21/00 ,  F04B49/06 ,  F04B43/00 ,  H01L21/67

Abstract: A filtration efficiency, which is similar to the filtration efficiency obtained when a plurality of filters are provided, can be obtained by one filter, and decrease in throughput can be prevented. Based on a control signal from a control unit 101, a resist liquid L is sucked into a pump 70 through a filter. A part of the resist liquid sucked in the pump is discharged from a discharge nozzle 7. The remaining resist liquid is returned to a supply conduit 51b on a primary side of the filter. A process is synthesized by adding a replenishment amount equal to the discharge amount to the return amount. The discharge of the synthesized process liquid and the filtration thereof by the filter are performed the number of times corresponding to a rate between the discharge amount and the return amount.

公开(公告)号：US20200168487A1

公开(公告)日：2020-05-28

申请号：US16776893

申请日：2020-01-30

Applicant: Tokyo Electron Limited

Inventor： Takaya Kikai ,  Yuichi Yoshida ,  Yuzo Ohishi

IPC: H01L21/67 ,  B05C11/10 ,  H01L21/02 ,  H01L21/677 ,  B05C11/08 ,  H01L21/687 ,  H01L21/027 ,  H01L21/311

Abstract: Disclosed is a substrate processing apparatus including: a processing chamber that accommodates a substrate; a light source that radiates energy rays for a processing to the substrate in the processing chamber; a rotation driving unit that rotates at least one of the substrate and the light source around an axis intersecting with the substrate in the processing chamber; an opening/closing mechanism that switches between an open state and a closed state; and a controller configured to control the opening/closing mechanism to switch between the open state and the closed state, to increase a light emission amount of the light source in synchronization with the switch of the open state to the closed state by the opening/closing mechanism, and to decrease the light emission amount of the light source in synchronization with the switch of the closed state to the open state by the opening/closing mechanism.

公开(公告)号：US20180218929A1

公开(公告)日：2018-08-02

申请号：US15879561

申请日：2018-01-25

Applicant: Tokyo Electron Limited

Inventor： Takaya Kikai ,  Yuichi Yoshida ,  Yuzo Ohishi

IPC: H01L21/67 ,  H01L21/687 ,  H01L21/677 ,  H01L21/02 ,  B05C11/10 ,  B05C11/08

CPC classification number: H01L21/67115 ,  B05C11/08 ,  B05C11/1002 ,  H01L21/0231 ,  H01L21/0271 ,  H01L21/31138 ,  H01L21/67063 ,  H01L21/6715 ,  H01L21/67253 ,  H01L21/67739 ,  H01L21/68742 ,  H01L21/68757

Abstract: Disclosed is a substrate processing apparatus including: a processing chamber that accommodates a substrate; a light source that radiates energy rays for a processing to the substrate in the processing chamber; a rotation driving unit that rotates at least one of the substrate and the light source around an axis intersecting with the substrate in the processing chamber; an opening/closing mechanism that switches between an open state and a closed state; and a controller configured to control the opening/closing mechanism to switch between the open state and the closed state, to increase a light emission amount of the light source in synchronization with the switch of the open state to the closed state by the opening/closing mechanism, and to decrease the light emission amount of the light source in synchronization with the switch of the closed state to the open state by the opening/closing mechanism.

公开(公告)号：US20140097147A1

公开(公告)日：2014-04-10

申请号：US14034774

申请日：2013-09-24

Applicant: Tokyo Electron Limited

Inventor： Yuichi Yoshida ,  Ryouichirou Naitou ,  Toshinobu Furusho

IPC: B01D19/00

CPC classification number: B01D36/001 ,  B01D19/0036 ,  B01D37/046 ,  B01D2201/202 ,  B01D2201/204 ,  B01D2221/14 ,  C02F1/20 ,  C02F2103/346 ,  C02F2209/03 ,  F04B53/20 ,  G03C2001/7437

Abstract: Disclosed are an apparatus and a method for reducing a processing liquid consumed for removing bubbles from a new filter unit, and shortening a start-up time when the filter unit is attached in a processing liquid supply passage. The method includes: filling the processing liquid into a new filter unit, decompressing inside of the filter unit into a first pressure atmosphere in order to remove bubbles from the filter unit, boosting a pressure of the inside of the filter unit, flowing the processing liquid into the filter unit from a primary side of the filter unit, and supplying the processing liquid flowing from the filter unit to an object to be processed through a nozzle thereby performing a liquid processing and quickly removing the bubbles.

Abstract translation: 公开了一种用于减少从新的过滤器单元去除气泡所消耗的处理液体的装置和方法，并且当过滤器单元附接在处理液体供应通道中时，缩短了启动时间。 该方法包括：将处理液填充到新的过滤器单元中，将过滤器单元的内部减压到第一压力气氛中，以从过滤器单元去除气泡，提高过滤器单元内部的压力，使处理液体流动 从过滤器单元的初级侧进入过滤器单元，并且通过喷嘴将从过滤器单元流动的处理液体供给到待处理物体，从而进行液体处理并快速除去气泡。

公开(公告)号：US20130189852A1

公开(公告)日：2013-07-25

申请号：US13746476

申请日：2013-01-22

Applicant: Tokyo Electron Limited

Inventor： Kousuke Yoshihara ,  Yuichi Yoshida ,  Soichiro Okada

IPC: H01L21/67 ,  H01L21/02

CPC classification number: H01L21/67 ,  G03F7/162 ,  H01L21/02107 ,  H01L21/67017 ,  H01L21/6715

Abstract: A solvent such as PGMEA is coated on a wafer in advance to easily spread resist liquid onto the wafer on a spin chuck. Before coating, the solvent supplied from a solvent supply source is stored in a distill tank first, the solvent is heated by a heating unit to be evaporated, and the evaporated solvent is cooled by a cooler, thereby performing the purification of the solvent by distillation. Therefore, particles among the solvent are removed. The purified solvent is stored in a storage tank first, and then supplied to a solvent nozzle above the spin chuck from a solvent supplying line. And then, the solvent is coated on the wafer by ejecting the solvent from the solvent nozzle to the wafer. Further, the distill tank is cleaned periodically to suppress the increase of the concentration of the particles in the solvent.

Abstract translation: 预先将诸如PGMEA的溶剂涂覆在晶片上，以便在旋转卡盘上容易地将抗蚀剂液体涂覆到晶片上。 涂布前，从溶剂供应源供应的溶剂首先储存在蒸馏罐中，通过加热单元加热溶剂进行蒸发，并将蒸发的溶剂用冷却器冷却，从而通过蒸馏进行溶剂的纯化 。 因此，除去溶剂中的颗粒。 将纯化的溶剂首先储存在储罐中，然后从溶剂供给管线供给到旋转卡盘上方的溶剂喷嘴。 然后，通过将溶剂从溶剂喷嘴喷射到晶片，将溶剂涂覆在晶片上。 此外，定期清洁蒸馏罐以抑制溶剂中颗粒浓度的增加。

公开(公告)号：US09293320B2

公开(公告)日：2016-03-22

申请号：US13865311

申请日：2013-04-18

Applicant: Tokyo Electron Limited

Inventor： Yuichi Yoshida ,  Kousuke Yoshihara

IPC: H01L21/02 ,  H01L21/67 ,  G03F7/16 ,  G03F7/30 ,  G03F7/32

CPC classification number: G03F7/70975 ,  G03F7/162 ,  G03F7/3021 ,  G03F7/325 ,  H01L21/02052 ,  H01L21/02104 ,  H01L21/67017 ,  H01L21/67051 ,  H01L21/6715

Abstract: A liquid treatment method includes: supplying a first organic solvent to a substrate with the substrate being held horizontally by a substrate holder; and thereafter supplying a second organic solvent to a substrate held by the substrate holder, the second solvent having a higher cleanliness than the first solvent.

Abstract translation: 液体处理方法包括：将基板由基板保持器水平保持的基板供给第一有机溶剂; 然后将第二有机溶剂供给到由所述基板保持件保持的基板上，所述第二溶剂具有比所述第一溶剂更高的清洁度。

公开(公告)号：US09162163B2

公开(公告)日：2015-10-20

申请号：US14034774

申请日：2013-09-24

Applicant: Tokyo Electron Limited

Inventor： Yuichi Yoshida ,  Ryouichirou Naitou ,  Toshinobu Furusho

IPC: B01D19/00 ,  B01D36/00 ,  C02F1/20 ,  C02F103/34 ,  B01D37/04

CPC classification number: B01D36/001 ,  B01D19/0036 ,  B01D37/046 ,  B01D2201/202 ,  B01D2201/204 ,  B01D2221/14 ,  C02F1/20 ,  C02F2103/346 ,  C02F2209/03 ,  F04B53/20 ,  G03C2001/7437

Abstract: Disclosed are an apparatus and a method for reducing a processing liquid consumed for removing bubbles from a new filter unit, and shortening a start-up time when the filter unit is attached in a processing liquid supply passage. The method includes: filling the processing liquid into a new filter unit, decompressing inside of the filter unit into a first pressure atmosphere in order to remove bubbles from the filter unit, boosting a pressure of the inside of the filter unit, flowing the processing liquid into the filter unit from a primary side of the filter unit, and supplying the processing liquid flowing from the filter unit to an object to be processed through a nozzle thereby performing a liquid processing and quickly removing the bubbles.

Abstract translation: 公开了一种用于减少从新的过滤器单元去除气泡所消耗的处理液体的装置和方法，并且当过滤器单元附接在处理液体供应通道中时，缩短了启动时间。 该方法包括：将处理液填充到新的过滤器单元中，将过滤器单元的内部减压到第一压力气氛中，以从过滤器单元去除气泡，提高过滤器单元内部的压力，使处理液体流动 从过滤器单元的初级侧进入过滤器单元，并且通过喷嘴将从过滤器单元流动的处理液体供给到待处理物体，从而进行液体处理并快速除去气泡。

公开(公告)号：US11141758B2

公开(公告)日：2021-10-12

申请号：US15997788

申请日：2018-06-05

Applicant: Tokyo Electron Limited

Inventor： Kentaro Yoshihara ,  Yuichi Yoshida ,  Naoki Shibata ,  Kousuke Yoshihara

IPC: B05D3/10 ,  B05D3/06 ,  B05D1/00 ,  B05C5/00 ,  H01L51/00 ,  H01L21/027 ,  H01L21/3105

Abstract: A film forming method for forming a coating film by applying a coating solution onto a substrate having projections and recesses formed on a surface thereof by a predetermined pattern, includes: applying the coating solution onto the surface of the substrate to form a thick film having a depth of projections and recesses on a surface of the film of a predetermined value or less and having a film thickness larger than a target film thickness of the coating film; and removing the surface of the thick film to form the coating film having the target film thickness.