摘要:
A transparent electrically-conductive film of the present invention comprises a transparent film substrate, a hard coat layer formed on one side of the transparent film substrate, a SiOx layer with a thickness of 10 nm to 300 nm that is formed on the hard coat layer by a dry process, and a transparent electrically-conductive thin layer with a thickness of 20 nm to 35 nm that is formed on another side of the transparent film substrate. The transparent electrically-conductive film has good resistance to moisture and heat and high durability against pen-based input and can be prevented from cracking during a punching process and also prevented from waving or curling even in a high-temperature, high-humidity environment.
摘要:
A transparent electrically-conductive film of the present invention comprises a transparent film substrate, a hard coat layer formed on one side of the transparent film substrate, a SiOx layer with a thickness of 10 nm to 300 nm that is formed on the hard coat layer by a dry process, and a transparent electrically-conductive thin layer with a thickness of 20 nm to 35 nm that is formed on another side of the transparent film substrate. The transparent electrically-conductive film has good resistance to moisture and heat and high durability against pen-based input and can be prevented from cracking during a punching process and also prevented from waving or curling even in a high-temperature, high-humidity environment.
摘要:
An object of the invention is to provide a transparent conductive film having good processability and to provide a method for production thereof. The pressure-sensitive adhesive layer-carrying transparent conductive film of the invention comprises: an amorphous transparent conductive laminate comprising a transparent plastic film substrate and an amorphous transparent conductive thin film provided on one side of the transparent plastic film substrate; a pressure-sensitive adhesive layer; and a release film that is provided on another side of the transparent plastic film substrate with the pressure-sensitive adhesive layer interposed therebetween and comprises at least a film substrate, wherein the release film is thicker than the amorphous transparent conductive laminate, and a value obtained by subtracting the thermal shrinkage percentage of the release film in the MD direction from the thermal shrinkage percentage of the amorphous transparent conductive laminate in the MD direction is from −0.3% to 0.45%.
摘要:
A transparent conductive laminated body comprising: a transparent film substrate having a thickness of 2 to 200 μm, and a first transparent dielectric thin film, a second transparent dielectric thin film and a transparent conductive thin film that are formed on one side of the substrate in this order from the side of the substrate, wherein the first transparent dielectric thin film is formed by vacuum deposition, sputtering or ion plating and comprises a complex oxide containing 0 to 20 parts by weight of tin oxide and 10 to 40 parts by weight of cerium oxide relative to 100 parts by weight of indium oxide, and the relationship: n2
摘要:
A transparent conductive multilayer body of the present invention is characterized by having: a transparent film base; an SiOx film (x is no less than 1.5 and less than 2) which is provided on one surface of the above described film base in accordance with a dry process, and has a thickness of 1 nm to 30 nm and a relative index of refraction of 1.6 to 1.9; an SiO2 film which is provided on the above described SiOx film and has a thickness of 10 nm to 50 nm; and a transparent conductive thin film which is provided on the above described SiO2 film and has a thickness of 20 nm to 35 nm.
摘要:
A transparent conductive laminated body comprising: a transparent film substrate having a thickness of 2 to 200 μm, and a first transparent dielectric thin film, a second transparent dielectric thin film and a transparent conductive thin film that are formed on one side of the substrate in this order from the side of the substrate, wherein the first transparent dielectric thin film is formed by vacuum deposition, sputtering or ion plating and comprises a complex oxide containing 0 to 20 parts by weight of tin oxide and 10 to 40 parts by weight of cerium oxide relative to 100 parts by weight of indium oxide, and the relationship: n2
摘要:
The present invention provides a touch panel having: a first panel board having a first base layer and a first conductive thin film disposed on one side of the first base layer; and a second panel board having a second base layer and a second conductive thin film disposed on one side of the second base layer; wherein the first panel board and the second panel board are arranged thorough a spacer so that the first conductive thin film and the second conductive thin film face each other, wherein the distance between the first conductive thin film and the second conductive thin film is from 20 to 100 μm, wherein the touch panel has a pushing angle of 3.9° or less at a point distant from an electrode provided at an end portion of the first panel board by 1.5 mm.
摘要:
The present invention provides a touch panel having: a first panel board having a first base layer and a first conductive thin film disposed on one side of the first base layer; and a second panel board having a second base layer and a second conductive thin film disposed on one side of the second base layer; wherein the first panel board and the second panel board are arranged thorough a spacer so that the first conductive thin film and the second conductive thin film face each other, wherein the distance between the first conductive thin film and the second conductive thin film is from 20 to 100 μm, wherein the touch panel has a pushing angle of 3.9° or less at a point distant from an electrode provided at an end portion of the first panel board by 1.5 mm.
摘要:
A transparent conductive multilayer body of the invention comprises a transparent film substrate with a thickness of 2 to 120 μm; a first transparent dielectric thin film, a second transparent dielectric thin film and a transparent conductive thin film laminated in this order on one side of the transparent film substrate; and a transparent substrate bonded to the other side of the film substrate through a transparent pressure-sensitive adhesive layer, wherein the second dielectric thin film is made of an inorganic material or a mixture of an organic material and an inorganic material, and the conductive thin film contains a crystalline material in which the content of crystal particles whose maximum particle sizes are at most 300 nm is higher than 50% by area. Such a transparent conductive multilayer body fully satisfies the pen input bending durability for a touch panel.
摘要:
A transparent conductive laminated body comprising: a transparent film substrate having a thickness of 2 to 200 μm, and a first transparent dielectric thin film, a second transparent dielectric thin film and a transparent conductive thin film that are formed on one side of the substrate in this order from the side of the substrate, wherein the first transparent dielectric thin film is formed by vacuum deposition, sputtering or ion plating and comprises a complex oxide containing 0 to 20 parts by weight of tin oxide and 10 to 40 parts by weight of cerium oxide relative to 100 parts by weight of indium oxide, and the relationship: n2