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    Transparent electrically-conductive film
    1.
    发明授权
    Transparent electrically-conductive film 有权
    透明导电膜

    公开(公告)号：US08003200B2

    公开(公告)日：2011-08-23

    申请号：US11664583

    申请日：2005-09-27

    申请人： Tomotake Nashiki ,  Hideo Sugawara ,  Hidehiko Andou ,  Hidetoshi Yoshitake

    发明人： Tomotake Nashiki ,  Hideo Sugawara ,  Hidehiko Andou ,  Hidetoshi Yoshitake

    IPC分类号： B32B7/02

    CPC分类号： G02B1/116 ,  G02B1/105 ,  G02B1/14 ,  G02B1/18 ,  G02B27/0006 ,  G06F3/045 ,  Y10S428/917 ,  Y10T428/24942 ,  Y10T428/265 ,  Y10T428/31504

    摘要： A transparent electrically-conductive film of the present invention comprises a transparent film substrate, a hard coat layer formed on one side of the transparent film substrate, a SiOx layer with a thickness of 10 nm to 300 nm that is formed on the hard coat layer by a dry process, and a transparent electrically-conductive thin layer with a thickness of 20 nm to 35 nm that is formed on another side of the transparent film substrate. The transparent electrically-conductive film has good resistance to moisture and heat and high durability against pen-based input and can be prevented from cracking during a punching process and also prevented from waving or curling even in a high-temperature, high-humidity environment.

    摘要翻译： 本发明的透明导电膜包括透明膜基材，形成在透明膜基材一侧的硬涂层，形成在硬涂层上的厚度为10nm至300nm的SiOx层 通过干法形成的厚度为20nm〜35nm的透明导电性薄膜，形成在透明膜基板的另一侧。 透明导电膜具有良好的抗水分和耐热性，并且对于基于笔的输入具有高的耐久性，并且可以防止在冲压加工过程中的裂纹，并且即使在高温，高湿度的环境下也可防止波动或卷曲。

    Transparent Electrically-Conductive Film And Touch Panel
    2.
    发明申请
    Transparent Electrically-Conductive Film And Touch Panel 有权
    透明导电膜和触摸屏

    公开(公告)号：US20080096013A1

    公开(公告)日：2008-04-24

    申请号：US11664583

    申请日：2005-09-27

    申请人： Tomotake Nashiki ,  Hideo Sugawara ,  Hidehiko Andou ,  Hidetoshi Yoshitake

    发明人： Tomotake Nashiki ,  Hideo Sugawara ,  Hidehiko Andou ,  Hidetoshi Yoshitake

    IPC分类号： B32B27/08

    CPC分类号： G02B1/116 ,  G02B1/105 ,  G02B1/14 ,  G02B1/18 ,  G02B27/0006 ,  G06F3/045 ,  Y10S428/917 ,  Y10T428/24942 ,  Y10T428/265 ,  Y10T428/31504

    摘要： A transparent electrically-conductive film of the present invention comprises a transparent film substrate, a hard coat layer formed on one side of the transparent film substrate, a SiOx layer with a thickness of 10 nm to 300 nm that is formed on the hard coat layer by a dry process, and a transparent electrically-conductive thin layer with a thickness of 20 nm to 35 nm that is formed on another side of the transparent film substrate. The transparent electrically-conductive film has good resistance to moisture and heat and high durability against pen-based input and can be prevented from cracking during a punching process and also prevented from waving or curling even in a high-temperature, high-humidity environment.

    摘要翻译： 本发明的透明导电膜包括透明膜基材，形成在透明膜基材一侧的硬涂层，厚度为10nm至300nm的SiO 2层 通过干法在硬涂层上形成的厚度为20nm〜35nm的透明导电薄膜，形成在透明膜基板的另一侧。 透明导电膜具有良好的抗水分和耐热性，并且对于基于笔的输入具有高的耐久性，并且可以防止在冲压加工过程中的裂纹，并且即使在高温，高湿度的环境下也可防止波动或卷曲。

    Process for producing transparent conductive laminate
    4.
    发明申请
    Process for producing transparent conductive laminate 有权
    制造透明导电层压板的方法

    公开(公告)号：US20050045471A1

    公开(公告)日：2005-03-03

    申请号：US10925930

    申请日：2004-08-26

    申请人： Tomonori Noguchi ,  Hidehiko Andou ,  Hidetoshi Yoshitake ,  Hideo Sugawara

    发明人： Tomonori Noguchi ,  Hidehiko Andou ,  Hidetoshi Yoshitake ,  Hideo Sugawara

    IPC分类号： G02F1/1333 ,  B32B15/08 ,  B32B17/10 ,  C23C14/00 ,  C23C14/08 ,  C23C14/32 ,  C23C14/34 ,  C23C14/58 ,  G02F1/13 ,  H05K1/03 ,  H05K3/00

    CPC分类号： C23C14/086 ,  C23C14/0042 ,  C23C14/5806

    摘要： A process for producing a transparent conductive laminate having a completely crystallized, transparent conductive layer on a substrate comprising an organic polymer molding is provided. The transparent conductive layer is excellent in transparency and wet heat confidence, is not excessively low in specific resistivity, and has no variation on optical properties such as retardation characteristic. The transparent conductive laminate is obtained by sputter-film forming a transparent conductive layer on a substrate comprising an organic polymer molding under conditions of a substrate temperature of 80-150° C. and a degree of vacuum of 8×10−3 Pa or lower to form an amorphous transparent conductive layer comprising an In.Sn composite oxide having an amount of Sn atom of 1-6 % by weight based on the total weight of In atom and Sn atom and having a film thickness of 15-30 nm, a Hall mobility of 15-28 cm2 V·S, and a carrier density of 2×1020/cm3 to 5×1020/cm3, and heat treating the layer at a temperature lower than 120° C., to convert it into a completely crystallized transparent conductive layer having a Hall mobility of 30-45 cm2/V·S and a carrier density of 2×1020/cm3 to 7×1020/cm3.

    摘要翻译： 提供了一种制造在包含有机聚合物成型体的基板上具有完全结晶的透明导电层的透明导电层压体的方法。 透明导电层的透明性和湿热置信度优异，电阻率不低，对延迟特性等光学特性没有变化。 在基板温度为80-150℃，真空度为8×10 -3 Pa以下的条件下，在包含有机聚合物成型体的基板上溅射成膜，形成透明导电性层叠体 形成非晶透明导电层，其包含相对于In原子和Sn原子的总重量为15〜30nm的Sn原子量为1-6重量％的In.Sn复合氧化物， 霍尔迁移率为15-28cm 2，载体密度为2×10 20 / cm 3至5×10 20 / cm 3，并在低于120℃的温度下对该层进行热处理 将其转化为具有30-45cm 2 / Vs的霍尔迁移率和2×10 20 / cm 3至7×10 20 / cm 3的载流子密度的完全结晶的透明导电层 。

    Process for producing transparent conductive laminate
    5.
    发明授权
    Process for producing transparent conductive laminate 有权
    制造透明导电层压板的方法

    公开(公告)号：US07763151B2

    公开(公告)日：2010-07-27

    申请号：US10925930

    申请日：2004-08-26

    申请人： Tomonori Noguchi ,  Hidehiko Andou ,  Hidetoshi Yoshitake ,  Hideo Sugawara

    发明人： Tomonori Noguchi ,  Hidehiko Andou ,  Hidetoshi Yoshitake ,  Hideo Sugawara

    IPC分类号： C23C14/34

    CPC分类号： C23C14/086 ,  C23C14/0042 ,  C23C14/5806

    摘要： A process for producing a transparent conductive laminate having a completely crystallized, transparent conductive layer on a substrate comprising an organic polymer molding is provided. The transparent conductive layer is excellent in transparency and wet heat confidence, is not excessively low in specific resistivity, and has no variation on optical properties such as retardation characteristic. The transparent conductive laminate is obtained by sputter-film forming a transparent conductive layer on a substrate comprising an organic polymer molding under conditions of a substrate temperature of 80-150° C. and a degree of vacuum of 8×10−3 Pa or lower to form an amorphous transparent conductive layer comprising an In.Sn composite oxide having an amount of Sn atom of 1-6 % by weight based on the total weight of In atom and Sn atom and having a film thickness of 15-30 nm, a Hall mobility of 15-28 cm2 V·S, and a carrier density of 2×1020/cm3 to 5×1020/cm3, and heat treating the layer at a temperature lower than 120° C., to convert it into a completely crystallized transparent conductive layer having a Hall mobility of 30-45 cm2/V·S and a carrier density of 2×1020/cm3 to 7×1020/cm3.

    摘要翻译： 提供了一种制造在包含有机聚合物成型体的基板上具有完全结晶的透明导电层的透明导电层压体的方法。 透明导电层的透明性和湿热置信度优异，电阻率不低，对延迟特性等光学特性没有变化。 在基板温度为80-150℃，真空度为8×10 -3 Pa以下的条件下，在包含有机聚合物成型体的基板上溅射成膜，形成透明导电性层叠体 形成非晶透明导电层，其包含相对于In原子和Sn原子的总重量为15〜30nm的Sn原子量为1-6重量％的In.Sn复合氧化物， 霍尔迁移率为15-28 cm2 V·S，载流子密度为2×1020 / cm3至5×1020 / cm3，并在低于120℃的温度下对该层进行热处理，将其转化为完全结晶 透明导电层的霍尔迁移率为30-45cm2 / V·S，载流子密度为2×1020 / cm3〜7×1020 / cm3。

    TRANSPARENT CONDUCTIVE LAMINATE AND TOUCH PANEL
    7.
    发明申请
    TRANSPARENT CONDUCTIVE LAMINATE AND TOUCH PANEL 有权
    透明导电层压板和触控面板

    公开(公告)号：US20140078422A1

    公开(公告)日：2014-03-20

    申请号：US14116044

    申请日：2012-05-01

    申请人： Mari Tanabe ,  Hidehiko Andou ,  Hideo Sugawara

    发明人： Mari Tanabe ,  Hidehiko Andou ,  Hideo Sugawara

    IPC分类号： G06F3/041 ,  G02F1/1333

    CPC分类号： G02F1/13338 ,  B32B7/02 ,  B32B7/12 ,  B32B2307/202 ,  B32B2457/202 ,  B32B2457/208 ,  G06F3/041 ,  G06F2203/04103 ,  Y10T428/24355 ,  Y10T428/31554 ,  Y10T428/31565

    摘要： A transparent conductive laminate includes a coating film including a first transparent resin film and a coating layer or layers provided on one or both sides of the first transparent resin film; a transparent conductive film including a second transparent resin film and a transparent conductive layer provided on one side of the second transparent resin film; and a pressure-sensitive adhesive layer interposed between the coating film and the transparent conductive film, wherein the coating layer of the coating film is laminated with the pressure-sensitive adhesive layer to a side of the transparent conductive film where the transparent conductive layer is not provided, the pressure-sensitive adhesive layer has a storage elastic modulus of 80,000 Pa or less at 120° C., and the adhesive strength between the pressure-sensitive adhesive layer and the coating layer is from 5 N/25 mm to 20 N/25 mm.

    摘要翻译： 透明导电性层叠体包括：第一透明树脂膜和设置在第一透明树脂膜的一面或两面的被覆层的涂膜， 透明导电膜，其包括设置在所述第二透明树脂膜一侧的第二透明树脂膜和透明导电层; 以及插入在所述涂膜和所述透明导电膜之间的压敏粘合剂层，其中所述涂膜的涂层与所述粘合剂层层叠到所述透明导电膜不是透明导电层的一侧 只要压敏粘合剂层在120℃下的储能弹性模量为80,000Pa以下，并且粘合剂层和涂层之间的粘合强度为5N / 25mm〜20N / 25毫米。

    Method of manufacturing transparent conductive film
    8.
    发明授权
    Method of manufacturing transparent conductive film 有权
    透明导电膜的制造方法

    公开(公告)号：US08568603B2

    公开(公告)日：2013-10-29

    申请号：US13593858

    申请日：2012-08-24

    申请人： Mari Tanabe ,  Hidehiko Andou ,  Hideo Sugawara

    发明人： Mari Tanabe ,  Hidehiko Andou ,  Hideo Sugawara

    IPC分类号： C30B33/00

    CPC分类号： H01B13/0036 ,  G06F3/041 ,  G06F2203/04103

    摘要： A method of manufacturing a transparent conductive film has the steps of: preparing a laminated body in which a transparent conductive layer that is not patterned is formed on a flexible transparent base, removing a part of the transparent conductive layer to form the pattern forming part having the transparent conductive layer on the flexible transparent base and the pattern opening part not having the transparent conductive layer on the flexible transparent base, and heating the laminated body in which the transparent conductive layer is patterned. The absolute value of the difference H1-H2 of the dimensional change rate H1 of the pattern forming part and the dimensional change rate H2 of the pattern opening part in the heat treatment step is preferably less than 0.03%.

    摘要翻译： 制造透明导电膜的方法具有以下步骤：制备其中在柔性透明基底上形成未图案化的透明导电层的层压体，去除透明导电层的一部分以形成具有 柔性透明基底上的透明导电层和柔性透明基底上不具有透明导电层的图案开口部分，并对其中透明导电层进行图案化的叠层体进行加热。 图案形成部的尺寸变化率H1与热处理工序中的图案开口部的尺寸变化率H2的差H1-H2的绝对值优选小于0.03％。

    METHOD OF MANUFACTURING TRANSPARENT CONDUCTIVE FILM
    9.
    发明申请
    METHOD OF MANUFACTURING TRANSPARENT CONDUCTIVE FILM 有权
    制造透明导电膜的方法

    公开(公告)号：US20130048597A1

    公开(公告)日：2013-02-28

    申请号：US13593858

    申请日：2012-08-24

    申请人： Mari Tanabe ,  Hidehiko Andou ,  Hideo Sugawara

    发明人： Mari Tanabe ,  Hidehiko Andou ,  Hideo Sugawara

    IPC分类号： H01B13/00

    CPC分类号： H01B13/0036 ,  G06F3/041 ,  G06F2203/04103

    摘要： A method of manufacturing a transparent conductive film has the steps of: preparing a laminated body in which a transparent conductive layer that is not patterned is formed on a flexible transparent base, removing a part of the transparent conductive layer to form the pattern forming part having the transparent conductive layer on the flexible transparent base and the pattern opening part not having the transparent conductive layer on the flexible transparent base, and heating the laminated body in which the transparent conductive layer is patterned. The absolute value of the difference H1-H2 of the dimensional change rate H1 of the pattern forming part and the dimensional change rate H2 of the pattern opening part in the heat treatment step is preferably less than 0.03%.

    摘要翻译： 制造透明导电膜的方法具有以下步骤：制备其中在柔性透明基底上形成未图案化的透明导电层的层压体，去除透明导电层的一部分以形成具有 柔性透明基底上的透明导电层和柔性透明基底上不具有透明导电层的图案开口部分，并对其中透明导电层进行图案化的叠层体进行加热。 图案形成部的尺寸变化率H1与热处理工序中的图案开口部的尺寸变化率H2的差H1-H2的绝对值优选小于0.03％。