摘要:
In an evaluation device a plurality of evaluation cells, a signal wiring for applying a voltage to the evaluation cells, and an output terminal pad for a signal taking out wiring for measuring outputs from the evaluation cells through a signal taking out wiring are provided on an insulating substrate. Thus, the in-plane distribution of electric characteristics can be easily measured. Further, the electric characteristics related to the particle diameter of the crystal of a poly-crystal silicon film are evaluated so that the in-plane unevenness of the particle diameter of the crystal of the poly-crystal silicon film can be managed.
摘要:
A semiconductor thin film according to an embodiment of the present invention includes: a polycrystallized semiconductor thin film formed by applying laser light to an amorphous semiconductor thin film; and crystal grains arranged into a lattice shape with a size that is about ½ of an oscillation wavelength of the laser light.
摘要:
It is an object to obtain a display device which has a thin film transistor using a semiconductor film, and in which initial failures are reduced, and a high-resolution display due to miniaturization of the thin film transistor is enabled. In a thin film transistor, a gate electrode 6 is formed above a polycrystalline semiconductor film 4 via a gate insulating film 5. A taper angle θ2 of a section of a pattern end portion of the polycrystalline semiconductor film 4 in a region where the polycrystalline semiconductor film 4 and the gate electrode 6 intersect with each other is smaller than a taper angle θ1 of the other region.
摘要:
A semiconductor device including: a thin film transistor substrate; and a driving circuit, wherein the thin film transistor substrate includes: a thin film transistor includes: a gate electrode; a gate insulating film that is formed on the insulating substrate and the gate electrode; a semiconductor layer that is formed on the gate insulating film; a channel protecting film; and a source electrode and a drain electrode that are formed to connect with the semiconductor layer; and a wiring converting unit that directly and electrically connects a first wiring layer and a second wiring layer through a first contact hole formed in the gate insulating film in the driving circuit, wherein the first wiring layer is formed at the same layer as the gate electrode on the insulating substrate; and wherein the second wiring layer is formed at the same layer as the source electrode and the drain electrode.
摘要:
A back-channel-etch type TFT includes a gate electrode, an SiN film that is formed on the gate electrode, and an SiO film that is formed and patterned on the SiN film. The TFT further includes an polycrystalline semiconductor film that is formed and patterned on the SiO film in contact with the SiO film in such a way that all pattern ends of the polycrystalline semiconductor film are located in close proximity to pattern ends of the SiO film.