公开(公告)号：US20180224817A1

公开(公告)日：2018-08-09

申请号：US15427279

申请日：2017-02-08

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Lian-Hua Shih ,  Chia-Chi Chang ,  Li-Ting Lin ,  Ching-Hsing Hsieh ,  Feng-Chi Chung ,  Meng-Chih Chang ,  Ming-Tung Wang ,  Chiu-Ping Chang ,  Yung-Yu Yang

IPC: G05B19/048 ,  G06F17/30 ,  G05B17/02

CPC classification number: G05B23/024

Abstract: A method of monitoring a processing system for processing a substrate is provided. The method includes the following steps: acquiring data from the processing system for a plurality of parameters, the data including a plurality of data values; grouping the parameters into a plurality of sub-groups, each of the sub-groups including a plurality of correlated parameters; constructing a principle components analysis (PCA) model from the data values for the correlated parameters in a first one of the sub-groups, including normalizing the data values in the first one of the sub-groups with a first weighting factor and a second weighting factor, wherein the first weighting factor is different from the second weighting factor; and determining a statistical quantity using the PCA model.

公开(公告)号：US11821847B2

公开(公告)日：2023-11-21

申请号：US17380578

申请日：2021-07-20

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Cheng-Hsien Chen ,  Chia-Feng Hsiao ,  Chung-Hsuan Wu ,  Chen-Hui Huang ,  Nai-Ying Lo ,  En-Wei Tsui ,  Yung-Yu Yang ,  Chen-Hsuan Hung

IPC: G06T7/00 ,  G01N21/95 ,  G06T7/13

CPC classification number: G01N21/9505 ,  G06T7/0004 ,  G06T7/13 ,  G06T2207/30148

Abstract: A wafer backside defect detection method and a wafer backside defect detection apparatus are provided. The wafer backside defect detection method includes the following steps. A peripheral edge area of a wafer backside image that at least one notch is located is cropped off. Adjacent white pixels on the wafer backside image are connected to obtain a plurality of abnormal regions. If a total area of top N of the abnormal regions is more than 10% of an area of the wafer, it is deemed that the wafer has a roughness defect. N is a natural number. If the total area of the top N of the abnormal regions is less than 1% of the area of the wafer and a largest abnormal region of the abnormal regions is longer than a predetermined length, it is deemed that the wafer has a scratch defect.

公开(公告)号：US20240176335A1

公开(公告)日：2024-05-30

申请号：US18433511

申请日：2024-02-06

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Yung-Yu Yang ,  Kang-Ping Li ,  Chih-Kuan Chang ,  Chung-Chih Hung ,  Chen-Hui Huang ,  Nai-Ying Lo ,  Shih-Wei Huang

IPC: G05B19/418 ,  G05B23/02

CPC classification number: G05B19/41865 ,  G05B23/0281 ,  G05B2219/45031

Abstract: A fault detection method, includes the following steps. A target sequence is received, the target sequence includes several data. A first moving average operation is performed on the target sequence to establish a first moving average sequence. A second moving average operation is performed on the target sequence to establish a second moving average sequence. A difference operation between the first moving average sequence and the second moving average sequence is performed to obtain a difference sequence, the difference sequence includes several difference values. An upper limit value is set. When one of the difference values is greater than the upper limit value, the target sequence is determines as abnormal.

公开(公告)号：US11644427B2

公开(公告)日：2023-05-09

申请号：US17100982

申请日：2020-11-23

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Chia-Feng Hsiao ,  Chung-Hsuan Wu ,  Shuo-Yu Chen ,  Nai-Ying Lo ,  Yi-Hui Tseng ,  Chen-Hui Huang ,  Yung-Yu Yang ,  Tzu-Ping Kao

IPC: G06K9/00 ,  G01N21/95 ,  H01L21/66 ,  G01N21/956 ,  G06T7/00 ,  G06T7/13 ,  G06V10/30 ,  G06V10/28 ,  G06V10/26 ,  G01N21/88 ,  G06T5/50 ,  G06V10/22

CPC classification number: G01N21/9503 ,  G01N21/8851 ,  G01N21/95607 ,  G06T5/50 ,  G06T7/001 ,  G06T7/0004 ,  G06T7/13 ,  G06V10/22 ,  G06V10/26 ,  G06V10/28 ,  G06V10/30 ,  H01L22/24 ,  G06T2207/20212 ,  G06T2207/20221 ,  G06T2207/30148

Abstract: An automatic detection method and an automatic detection system for detecting any crack on wafer edges are provided. The automatic detection method includes the following steps. Several wafer images of several wafers are obtained. The wafer images are integrated to create a templet image. Each of the wafer images is compared with the templet image to obtain a differential image. Each of the differential images is binarized. Each of the differential images which are binarized is de-noised. Whether each of the differential images has an edge crack is detected according to pattern of each of the differential images which are de-noised.

公开(公告)号：US10606253B2

公开(公告)日：2020-03-31

申请号：US15427279

申请日：2017-02-08

Applicant: UNITED MICROELECTRONICS CORP.

Inventor： Lian-Hua Shih ,  Chia-Chi Chang ,  Li-Ting Lin ,  Ching-Hsing Hsieh ,  Feng-Chi Chung ,  Meng-Chih Chang ,  Ming-Tung Wang ,  Chiu-Ping Chang ,  Yung-Yu Yang

IPC: G05B23/02

Abstract: A method of monitoring a processing system for processing a substrate is provided. The method includes the following steps: acquiring data from the processing system for a plurality of parameters, the data including a plurality of data values; grouping the parameters into a plurality of sub-groups, each of the sub-groups including a plurality of correlated parameters; constructing a principle components analysis (PCA) model from the data values for the correlated parameters in a first one of the sub-groups, including normalizing the data values in the first one of the sub-groups with a first weighting factor and a second weighting factor, wherein the first weighting factor is different from the second weighting factor; and determining a statistical quantity using the PCA model.