中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

11 records (took 0.011 seconds)

    METHOD OF MAKING SILVER CARBOXYLATES FOR CONDUCTIVE INK
    1.
    发明申请
    METHOD OF MAKING SILVER CARBOXYLATES FOR CONDUCTIVE INK 有权
    制造用于导电墨水的银羧酸酯的方法

    公开(公告)号：US20140342084A1

    公开(公告)日：2014-11-20

    申请号：US13894495

    申请日：2013-05-15

    Applicant: XEROX CORPORATION

    Inventor： Yiliang WU ,  Ping LIU

    IPC: H05K1/09 ,  H05K3/12

    CPC classification number: H05K1/09 ,  C07C51/412 ,  H05K1/092 ,  H05K3/105 ,  H05K3/12 ,  H05K2203/121 ,  H05K2203/125 ,  C07C53/126

    Abstract: A method of making silver carboxylate includes forming a mixture of at least one carboxylic acid and at least one aromatic hydrocarbon solvent, and at room temperature, introducing silver oxide into the mixture to form the silver carboxylate in the aromatic hydrocarbon solvent. The mixture may be free of alkali bases and mineral acids, with no additional materials being introduced into the mixture when introducing the silver oxide.

    Abstract translation: 制备羧酸银的方法包括形成至少一种羧酸和至少一种芳族烃溶剂的混合物，并且在室温下将氧化银引入混合物中以在芳族烃溶剂中形成羧酸银。 当引入氧化银时，该混合物可以不含碱性碱和无机酸，在混合物中没有其它物质被引入。

    CONDUCTIVE PASTES CONTAINING SILVER CARBOXYLATES
    2.
    发明申请
    CONDUCTIVE PASTES CONTAINING SILVER CARBOXYLATES 有权
    含有羧甲基纤维素的导电胶

    公开(公告)号：US20140342083A1

    公开(公告)日：2014-11-20

    申请号：US13894475

    申请日：2013-05-15

    Applicant: Xerox Corporation

    Inventor： Yiliang WU ,  Ping LIU

    IPC: C09D5/24

    CPC classification number: B22F1/0022 ,  B22F1/0059 ,  H01B1/02 ,  H01B1/22 ,  H01K1/00

    Abstract: A paste composition includes a branched metal carboxylate, a solvent in which the branched metal carboxylate is soluble and a gelling agent, wherein the gelling agent is a linear metal carboxylate. The paste solvent may be an aromatic hydrocarbon solvent. The paste compositing may be free of polymeric binder. The paste may be used in forming conductive features on a substrate, including by screen printing or offset printing.

    Abstract translation: 糊状组合物包括支链金属羧酸盐，其中可溶于支链羧酸金属的溶剂和胶凝剂，其中胶凝剂是线性金属羧酸盐。 糊剂溶剂可以是芳族烃溶剂。 糊状物的复合可以不含聚合物粘合剂。 该糊剂可用于在基底上形成导电特征，包括丝网印刷或胶版印刷。

    SEMICONDUCTOR COMPOSITES COMPRISING CARBON NANOTUBES AND DIKETOPYRROLOPYRROLE-THIOPHENE BASED COPOLYMERS
    3.
    发明申请
    SEMICONDUCTOR COMPOSITES COMPRISING CARBON NANOTUBES AND DIKETOPYRROLOPYRROLE-THIOPHENE BASED COPOLYMERS 有权
    包含碳纳米管和二苯基丙烯酰基 - 硫代苯乙烯共聚物的半导体复合材料

    公开(公告)号：US20140158946A1

    公开(公告)日：2014-06-12

    申请号：US13706836

    申请日：2012-12-06

    Applicant: XEROX CORPORATION

    Inventor： Yiliang WU ,  Anthony James WIGGLESWORTH ,  Ping LIU

    IPC: H01B1/12

    CPC classification number: H01B1/24 ,  B82Y30/00 ,  H01L51/0545 ,  Y10S977/742 ,  Y10S977/75 ,  Y10S977/784 ,  Y10S977/932 ,  Y10S977/936

    Abstract: A semiconductor composition includes a semiconducting polymer containing a diketopyrrolopyrrole (DKPP) moiety and carbon nanotubes dispersed into the semiconducting polymer. An electronic device contains a semiconductor layer including a semiconductor composition having a semiconducting polymer including a diketopyrrolopyrrole (DKPP) moiety and carbon nanotubes dispersed into the semiconducting polymer. A semiconductor composition contains a semiconducting polymer including a diketopyrrolopyrrole (DKPP) moiety, a solvent selected from the group consisting of tetrachloroethane, dichlorobenzene, chlorobenzene, chlorotoluene, and a mixture thereof, and a carbon nanotube.

    Abstract translation: 半导体组合物包括含有二酮吡咯并吡咯（DKPP）部分的半导体聚合物和分散在半导体聚合物中的碳纳米管。 电子器件含有包含半导体组合物的半导体层，该半导体组合物具有包含二酮吡咯并吡咯（DKPP）部分的半导体聚合物和分散在该半导体聚合物中的碳纳米管。 半导体组合物含有包含二酮吡咯并吡咯（DKPP）部分的半导体聚合物，选自四氯乙烷，二氯苯，氯苯，氯甲苯及其混合物的溶剂和碳纳米管。

    METHOD OF IMPROVING SHEET RESISTIVITY OF PRINTED CONDUCTIVE INKS
    4.
    发明申请
    METHOD OF IMPROVING SHEET RESISTIVITY OF PRINTED CONDUCTIVE INKS 有权
    改进印刷电导率片材电阻率的方法

    公开(公告)号：US20140377454A1

    公开(公告)日：2014-12-25

    申请号：US13925438

    申请日：2013-06-24

    Applicant: XEROX CORPORATION

    Inventor： Gabriel IFTIME ,  Yiliang WU ,  Naveen CHOPRA ,  Cuong VONG ,  Michael D'AMATO ,  Sandra J. GARDNER ,  Kurt I. HALFYARD ,  Adrien P. CÔTÉ

    IPC: H05K3/12

    CPC classification number: H05K3/1283 ,  B05D3/02 ,  B05D3/12 ,  B05D5/12 ,  H05K1/095 ,  H05K2201/0129 ,  H05K2201/0245 ,  H05K2203/1131 ,  H05K2203/1545

    Abstract: A method of forming a printed pattern on a substrate includes printing a pattern onto the substrate with a conductive ink including a conductive material, a thermoplastic binder and a solvent, curing the printed pattern, and fusing the printed pattern by feeding the printed pattern through a fusing system operated at a temperature of about 20° C. to about 130° C. above the glass transition temperature of the thermoplastic binder and at least 120° C. at a minimum, a pressure of from about 50 psi to about 1500 psi, and a feed rate through the fusing system of about 1 m/min to about 100 m/min. The method may be done continuously. The method improves the sheet resistivity of the printed ink.

    Abstract translation: 在衬底上形成印刷图案的方法包括：用包含导电材料，热塑性粘合剂和溶剂的导电油墨将图案印刷到基材上，固化印刷图案，并通过将印刷图案馈送通过 熔融体系在约20℃至约130℃的温度下操作，高于热塑性粘合剂的玻璃化转变温度，至少120℃，压力为约50psi至约1500psi， 以及通过熔化系统的进料速率为约1m / min至约100m / min。 该方法可以连续进行。 该方法提高了印刷油墨的薄层电阻率。

    SOLDER MASK INK COMPRISING AMIDE GELLANT
    6.
    发明申请
    SOLDER MASK INK COMPRISING AMIDE GELLANT 审中-公开
    焊膏包含酰胺凝胶

    公开(公告)号：US20140224531A1

    公开(公告)日：2014-08-14

    申请号：US13765403

    申请日：2013-02-12

    Applicant: XEROX CORPORATION

    Inventor： Naveen Chopra ,  Yiliang WU

    IPC: H01B3/44 ,  H05K1/02

    CPC classification number: H01B3/447 ,  G03F7/027 ,  H05K3/287 ,  H05K2203/013

    Abstract: Inkjet printer-compatible solder mask inks include amide gellants to provide improved print resolution. A solder mask ink includes an amide gellant and a plurality of acrylate monomers, oligomers, or combinations thereof.

    Abstract translation: 喷墨打印机兼容的焊接油墨包括酰胺胶凝剂以提供改进的印刷分辨率。 焊接掩模油墨包括酰胺胶凝剂和多种丙烯酸酯单体，低聚物或其组合。

    METHOD OF AEROSOL PRINTING A SOLDER MASK INK COMPOSITION
    8.
    发明申请
    METHOD OF AEROSOL PRINTING A SOLDER MASK INK COMPOSITION 有权
    气溶胶印刷焊膏掩模组合物的方法

    公开(公告)号：US20160062230A1

    公开(公告)日：2016-03-03

    申请号：US14471967

    申请日：2014-08-28

    Applicant: Xerox Corporation

    Inventor： Yiliang WU ,  Kurt Halfyard

    IPC: G03F1/68 ,  B41J2/01

    CPC classification number: B41J2/215 ,  B41J2/01 ,  C09D11/033 ,  C09D11/102 ,  G03F1/68 ,  H05K1/0353 ,  H05K3/285 ,  H05K3/3452 ,  H05K2201/2081 ,  H05K2203/0545 ,  H05K2203/0783

    Abstract: A method of digitally printing a solder mask. The method includes providing a solder mask ink composition including: 1) a resin and 2) a solvent in an amount of at least 20% by weight relative to the total weight of the solder mask ink composition. The composition has a viscosity that is less than 1000 cps at a shear rate of 10 s−1 and a temperature of 25° C. An aerosol stream is generated from the solder mask ink composition with a pneumatic atomizer using an atomization gas. The aerosol stream is directed through a nozzle and focused using a sheath gas onto a substrate while changing the position of the nozzle with respect to the substrate to selectively deposit a solder mask pattern. The solder mask pattern is cured.

    Abstract translation: 一种数字印刷焊接掩模的方法。 该方法包括提供一种焊料掩模油墨组合物，其包括：1）树脂和2）相对于焊料掩模油墨组合物的总重量为至少20重量％的溶剂。 组合物在10s -1的剪切速率和25℃的温度下具有小于1000cps的粘度。使用雾化气体，使用气动雾化器从焊料掩模油墨组合物产生气溶胶流。 气雾剂流被引导通过喷嘴并且使用护套气体聚焦到衬底上，同时改变喷嘴相对于衬底的位置以选择性地沉积焊料掩模图案。 焊接掩模图案被固化。

    CONDUCTIVE METAL INKS WITH POLYVINYLBUTYRAL BINDER
    9.
    发明申请
    CONDUCTIVE METAL INKS WITH POLYVINYLBUTYRAL BINDER 审中-公开
    导电金属油墨与聚乙烯丁二烯键

    公开(公告)号：US20140374672A1

    公开(公告)日：2014-12-25

    申请号：US13925506

    申请日：2013-06-24

    Applicant: XEROX CORPORATION

    Inventor： Naveen CHOPRA ,  Gabriel IFTIME ,  James D. MAYO ,  Michael D'AMATO ,  Sandra J. Gardner ,  Cuong VONG ,  Ping LIU ,  Yiliang WU

    IPC: C09D11/00

    CPC classification number: C09D11/52 ,  C09D11/106

    Abstract: A conductive ink includes a conductive material, a thermoplastic polyvinylbutyral terpolymer binder and a glycol ether solvent. The conductive material may be a conductive material is a conductive particulate having an average size of from about 0.5 to about 10 microns and as aspect ratio of at least about 3 to 1, such as a silver flake.

    Abstract translation: 导电油墨包括导电材料，热塑性聚乙烯醇缩丁醛三元共聚物粘合剂和二醇醚溶剂。 导电材料可以是导电材料，其是具有约0.5至约10微米的平均尺寸和至少约3比1的纵横比的导电颗粒，例如银薄片。

    CONDUCTIVE METAL INKS WITH POLYVINYLBUTYRAL AND POLYVINYLPYRROLIDONE BINDER
    10.
    发明申请
    CONDUCTIVE METAL INKS WITH POLYVINYLBUTYRAL AND POLYVINYLPYRROLIDONE BINDER 审中-公开
    导电金属油墨与聚乙烯和聚乙烯吡咯烷酮键合

    公开(公告)号：US20140374671A1

    公开(公告)日：2014-12-25

    申请号：US13925352

    申请日：2013-06-24

    Applicant: Xerox Corporation

    Inventor： Naveen CHOPRA ,  James D. MAYO ,  Gabriel IFTIME ,  Yiliang WU

    IPC: C09D11/00

    CPC classification number: C09D11/52 ,  C09D11/106

    Abstract: A conductive ink includes a conductive material, a thermoplastic binder including a polyvinylbutyral terpolymer and a polyvinylpyrrolidone, and a solvent. The conductive material may be a conductive material is a conductive particulate having an average size of from about 0.5 to about 10 microns and as aspect ratio of at least about 3 to 1, such as a silver flake.

    Abstract translation: 导电油墨包括导电材料，包括聚乙烯醇缩丁醛三元共聚物和聚乙烯吡咯烷酮的热塑性粘合剂和溶剂。 导电材料可以是导电材料，其是具有约0.5至约10微米的平均尺寸和至少约3比1的纵横比的导电颗粒，例如银薄片。

Patent Agency Ranking