CURABLE COMPOSITIONS FOR THREE-DIMENSIONAL PRINTING
    3.
    发明申请
    CURABLE COMPOSITIONS FOR THREE-DIMENSIONAL PRINTING 审中-公开
    用于三维打印的可固化组合物

    公开(公告)号:US20140053754A1

    公开(公告)日:2014-02-27

    申请号:US14070013

    申请日:2013-11-01

    Abstract: Curable, phase-change compositions and inks used for printing three-dimensional objects including a curable monomer, a photoinitiator, a wax and a gellant, where the composition of the cured formulation has a room temperature modulus of from about 0.01 to about 5 Gpa. The curable monomer includes acrylic monomer, polybutadiene adducted with maleic anhydride, aliphatic urethane acrylate, polyester acrylate, 3-acryloxypropyltrimethoxysilane, or acryloxypropyl t-structured siloxane.

    Abstract translation: 用于印刷包括可固化单体,光引发剂,蜡和胶凝剂的三维物体的可固化的相变组合物和油墨,其中固化制剂的组成为约0.01至约5Gpa的室温模量。 可固化单体包括丙烯酸单体,与马来酸酐加成的聚丁二烯,脂族氨基甲酸酯丙烯酸酯,聚酯丙烯酸酯,3-丙烯酰氧基丙基三甲氧基硅烷或丙烯酰氧基丙基t-结构的硅氧烷。

    HYBRID NANOSILVER/LIQUID METAL INK COMPOSITION AND USES THEREOF

    公开(公告)号:US20200015354A1

    公开(公告)日:2020-01-09

    申请号:US16573590

    申请日:2019-09-17

    Abstract: The present disclosure is directed to a hybrid conductive ink including: silver nanoparticles and eutectic low melting point alloy particles, wherein a weight ratio of the eutectic low melting point alloy particles and the silver nanoparticles ranges from 1:20 to 1:5. Also provided herein are methods of forming an interconnect including a) depositing a hybrid conductive ink on a conductive element positioned on a substrate, wherein the hybrid conductive ink comprises silver nanoparticles and eutectic low melting point alloy particles, the eutectic low melting point alloy particles and the silver nanoparticles being in a weight ratio from about 1:20 to about 1:5; b) placing an electronic component onto the hybrid conductive ink; c) heating the substrate, conductive element, hybrid conductive ink and electronic component to a temperature sufficient i) to anneal the silver nanoparticles in the hybrid conductive ink and ii) to melt the low melting point eutectic alloy particles, wherein the melted low melting point eutectic alloy flows to occupy spaces between the annealed silver nanoparticles, d) allowing the melted low melting point eutectic alloy of the hybrid conductive ink to harden and fuse to the electronic component and the conductive element, thereby forming an interconnect. Electrical circuits including conductive traces and, optionally, interconnects formed with the hybrid conductive ink are also provided.

    METHOD OF IMPROVING SHEET RESISTIVITY OF PRINTED CONDUCTIVE INKS
    7.
    发明申请
    METHOD OF IMPROVING SHEET RESISTIVITY OF PRINTED CONDUCTIVE INKS 有权
    改进印刷电导率片材电阻率的方法

    公开(公告)号:US20140377454A1

    公开(公告)日:2014-12-25

    申请号:US13925438

    申请日:2013-06-24

    Abstract: A method of forming a printed pattern on a substrate includes printing a pattern onto the substrate with a conductive ink including a conductive material, a thermoplastic binder and a solvent, curing the printed pattern, and fusing the printed pattern by feeding the printed pattern through a fusing system operated at a temperature of about 20° C. to about 130° C. above the glass transition temperature of the thermoplastic binder and at least 120° C. at a minimum, a pressure of from about 50 psi to about 1500 psi, and a feed rate through the fusing system of about 1 m/min to about 100 m/min. The method may be done continuously. The method improves the sheet resistivity of the printed ink.

    Abstract translation: 在衬底上形成印刷图案的方法包括:用包含导电材料,热塑性粘合剂和溶剂的导电油墨将图案印刷到基材上,固化印刷图案,并通过将印刷图案馈送通过 熔融体系在约20℃至约130℃的温度下操作,高于热塑性粘合剂的玻璃化转变温度,至少120℃,压力为约50psi至约1500psi, 以及通过熔化系统的进料速率为约1m / min至约100m / min。 该方法可以连续进行。 该方法提高了印刷油墨的薄层电阻率。

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