摘要:
A design workflow construction apparatus is provided for supporting design of an object having a plurality of design elements. In constructing the design workflow, the apparatus uses input variables, design variables, and intermediate variables. The design workflow construction apparatus includes means for acquiring object design elements and means for determining an order of designing the object design elements. The apparatus also includes means for determining the important design variables.
摘要:
A design system (1) is provided with a function of acquiring a design specification of an object to be designed and an evaluation index for evaluating a value of the object to be designed in the design specification; a function of acquiring profile data of the object to be designed; a function (design order determining section (12)) of extracting entity design elements and important design variables from the profile data and prioritizing the entity design elements and the important design variables so as to construct a design workflow; a function (evaluation approach construction section (13)) of constructing an evaluation formula for performance/evaluation of a design result of each of the entity design elements in conformity with the design workflow; a function of finding an appropriate solution by performing automatic optimization while evaluating the design result with use of the evaluation index in accordance with the design workflow with which the evaluation formula is associated; and a function of outputting the appropriate solution thus found. This allows the object to be designed to be parametrically handled, and makes it possible to create a design workflow for efficiently finding an optimum design solution by properly combining a series of design elements and to find an appropriate solution with the use of the design workflow.
摘要:
In one embodiment, an RF coil device includes a base board, a belt member, a first coil element, a second coil element inside the base board, and a connecting unit. Both ends of the belt member are respectively connected to mutually separated places on the base board, so that the center part of the belt member is located on the anterior surface of the base board. The belt member is curved to form airspace between the center part thereof and the anterior surface for letting an arm pass through in interdigitation state. The first coil element includes first and second partial coils inside the belt member, and becomes a loop coil element by their connection. The connecting unit detachably connects the base board to the belt member, and mutually connects the first and second partial coils in the interdigitation state.
摘要:
According to one embodiment, a apparatus includes a coil, a clock generator, an echo transmitter, a carrier generator, a clock transmitter, a regenerator, an receiver, a reconstructor, a detector, and a controller. The echo transmitter generates and transmits an echo transmission signal synchronously with a clock signal generated by the clock generator to wirelessly transmit an echo signal output from the col. The carrier generator generates a carrier signal have a frequency within a variable range. The clock transmitter wirelessly transmits a clock transmission signal. The regenerator regenerates the clock signal based on the transmitted clock transmission signal. The receiver extracts the echo signal synchronously with the regenerated clock signal from the transmitted echo transmission signal. The detector detects a frequency of an interference wave. The controller controls the carrier generator to generate the carrier signal having a frequency which comparatively small interference with respect to the detected frequency.
摘要:
Provided is a multi-layered semiconductor apparatus with improved heat diffusion and improved heat release. The multi-layered semiconductor apparatus (100) includes a plurality of layered semiconductor chips (20-1, 20-2) that each include at least one circuit region, and the circuit regions are arranged such that heat generated by the circuit regions as a result of the circuit regions being driven is spread out. The multi-layered semiconductor apparatus (100) further comprises a heat releasing section (50) that releases the heat generated by the circuit regions, and the circuit regions are arranged such that there is less thermal resistance between the heat releasing section and circuit regions that generate a greater amount of heat per unit area.
摘要:
A radio frequency coil assembly is provided that includes a first radio frequency coil for receiving a magnetic resonance signal from a tested body; a second radio frequency coil for receiving a magnetic resonance signal from the tested body; and a third radio frequency coil for receiving a magnetic resonance signal from the tested body and having a shape that is different from that of at least one of the first and second radio frequency coils so as to increase local sensitivity in an image-picked-up region.
摘要:
A stacking apparatus that stacks chip assemblies each having a plurality of chips disposed continuously with circuit patterns and electrodes, includes: a plurality of stages each allowed to move arbitrarily, on which the chip assemblies are placed; a storage unit that stores an estimated extent of change in a position of an electrode at each chip, expected to occur as heat is applied to the chip assemblies placed on the plurality of stages during a stacking process; and a control unit that sets positions of the plurality of stages to be assumed relative to each other during the stacking process based upon the estimated extent of change in the position of the electrode at each chip provided from the storage unit and position information indicating positions of individual chips formed at the chip assemblies and controls at least one of the plurality of stages.
摘要:
A plurality of valve assemblies are provided to a base, and an air-supply flow path for supplying compressed air to each valve assembly is formed in the base. A main flow path communicating with the air-supply flow path and communicating with a pilot air-supply flow path is formed in an air supply block. When the compressed air is supplied to the air-supply flow path and the pilot air-supply flow path from the main flow path, a manifold solenoid valve becomes an internal pilot type. An external pilot flow path communicating with the pilot air-supply flow path is formed in an external pilot block, and when the external pilot block is provided, communication between the main flow path and the pilot air-supply flow path is shut off, and the manifold solenoid valve becomes an external pilot type in which the pilot pressure is supplied from the external pilot flow path.
摘要:
Provided is a multi-layered semiconductor apparatus with improved heat diffusion and improved heat release. The multi-layered semiconductor apparatus (100) includes a plurality of layered semiconductor chips (20-1, 20-2) that each include at least one circuit region, and the circuit regions are arranged such that heat generated by the circuit regions as a result of the circuit regions being driven is spread out. The multi-layered semiconductor apparatus (100) further comprises a heat releasing section (50) that releases the heat generated by the circuit regions, and the circuit regions are arranged such that there is less thermal resistance between the heat releasing section and circuit regions that generate a greater amount of heat per unit area.
摘要:
A radio frequency coil unit includes a plurality of surface coils and a distributing/combining unit. The plurality of surface coils are arranged in a body-axis direction. The distributing/combining unit distributes and combines reception signals output from the plurality of surface coils to generate a new reception signal.