公开(公告)号：US07273654B2

公开(公告)日：2007-09-25

申请号：US10246620

申请日：2002-09-19

申请人： Yoshiyuki Tanabe ,  Yoshihiro Nomura ,  Hiroshi Kirihara ,  Youichi Hosokawa ,  Shinji Iioka ,  Satoru Yanagisawa

发明人： Yoshiyuki Tanabe ,  Yoshihiro Nomura ,  Hiroshi Kirihara ,  Youichi Hosokawa ,  Shinji Iioka ,  Satoru Yanagisawa

IPC分类号： B32B7/12

CPC分类号： H01L24/32 ,  H01L23/4951 ,  H01L23/544 ,  H01L24/27 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L2223/54473 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83856 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/181 ,  Y10S428/901 ,  Y10T83/155 ,  Y10T83/543 ,  Y10T83/9416 ,  Y10T156/1056 ,  Y10T156/1062 ,  Y10T156/1084 ,  Y10T428/24273 ,  Y10T428/24322 ,  Y10T428/28 ,  Y10T428/2852 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A punched adhesive tape for semiconductor which is made by punching an adhesive tape comprising a base film and an adhesive layer provided on one or each side of the base film to mark the regions in the adhesive tape where contaminants or defects are contained; a method of producing an adhesive tape-bearing lead frame by punching the punched adhesive tape for semiconductor, with the parts containing the punched holes skipped over, and applying the adhesive tape pieces punched out from the punched adhesive tape for semiconductor to a lead frame; a semiconductor device fabricated by using the adhesive-bearing lead frame.

摘要翻译： 一种用于半导体的冲压胶带，其通过冲压包括基膜的粘合带和设置在基膜的一侧或两侧上的粘合剂层来标记粘合带中含有污染物或缺陷的区域; 通过冲压用于半导体的冲压胶带来生产带状带引线框架的方法，其中包含冲孔的部件被跳过，并将从冲压的半导体胶带冲压出的粘合带片施加到引线框架; 通过使用粘合剂承载引线框架制造的半导体器件。

公开(公告)号：US07449076B2

公开(公告)日：2008-11-11

申请号：US11241992

申请日：2005-10-04

申请人： Yoshiyuki Tanabe ,  Yoshihiro Nomura ,  Hiroshi Kirihara ,  Youichi Hosokawa ,  Shinji Iioka ,  Satoru Yanagisawa

发明人： Yoshiyuki Tanabe ,  Yoshihiro Nomura ,  Hiroshi Kirihara ,  Youichi Hosokawa ,  Shinji Iioka ,  Satoru Yanagisawa

IPC分类号： B32B41/00

CPC分类号： H01L24/32 ,  H01L23/4951 ,  H01L23/544 ,  H01L24/27 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L2223/54473 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83856 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/181 ,  Y10S428/901 ,  Y10T83/155 ,  Y10T83/543 ,  Y10T83/9416 ,  Y10T156/1056 ,  Y10T156/1062 ,  Y10T156/1084 ,  Y10T428/24273 ,  Y10T428/24322 ,  Y10T428/28 ,  Y10T428/2852 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A punched adhesive tape for semiconductor which is made by punching an adhesive tape comprising a base film and an adhesive layer provided on one or each side of the base film to mark the regions in the adhesive tape where contaminants or defects are contained; a method of producing an adhesive tape-bearing lead frame by punching the punched adhesive tape for semiconductor, with the parts containing the punched holes skipped over, and applying the adhesive tape pieces punched out from the punched adhesive tape for semiconductor to a lead frame; a semiconductor device fabricated by using the adhesive-bearing lead frame.

摘要翻译： 一种用于半导体的冲压胶带，其通过冲压包括基膜的粘合带和设置在基膜的一侧或两侧上的粘合剂层来标记粘合带中含有污染物或缺陷的区域; 通过冲压用于半导体的冲压胶带来生产带状带引线框架的方法，其中包含冲孔的部件被跳过，并将从冲压的半导体胶带冲压出的粘合带片施加到引线框架; 通过使用粘合剂承载引线框架制造的半导体器件。

公开(公告)号：US20090022893A1

公开(公告)日：2009-01-22

申请号：US12236756

申请日：2008-09-24

申请人： Yoshiyuki Tanabe ,  Yoshihiro Nomura ,  Hiroshi Kirihara ,  Youichi Hosokawa ,  Shinji Iioka ,  Satoru Yanagisawa

发明人： Yoshiyuki Tanabe ,  Yoshihiro Nomura ,  Hiroshi Kirihara ,  Youichi Hosokawa ,  Shinji Iioka ,  Satoru Yanagisawa

IPC分类号： B05D3/12

CPC分类号： H01L24/32 ,  H01L23/4951 ,  H01L23/544 ,  H01L24/27 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L2223/54473 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83856 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/181 ,  Y10S428/901 ,  Y10T83/155 ,  Y10T83/543 ,  Y10T83/9416 ,  Y10T156/1056 ,  Y10T156/1062 ,  Y10T156/1084 ,  Y10T428/24273 ,  Y10T428/24322 ,  Y10T428/28 ,  Y10T428/2852 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A punched adhesive tape for semiconductor which is made by punching an adhesive tape comprising a base film and an adhesive layer provided on one or each side of the base film to mark the regions in the adhesive tape where contaminants or defects are contained; a method of producing an adhesive tape-bearing lead frame by punching the punched adhesive tape for semiconductor, with the parts containing the punched holes skipped over, and applying the adhesive tape pieces punched out from the punched adhesive tape for semiconductor to a lead frame; a semiconductor device fabricated by using the adhesive-bearing lead frame.

摘要翻译： 一种用于半导体的冲压胶带，其通过冲压包括基膜的粘合带和设置在基膜的一侧或两侧上的粘合剂层来标记粘合带中含有污染物或缺陷的区域; 通过冲压用于半导体的冲压胶带来生产带状带引线框架的方法，其中包含冲孔的部件被跳过，并将从冲压的半导体胶带冲压出的粘合带片施加到引线框架; 通过使用粘合剂承载引线框架制造的半导体器件。

公开(公告)号：US20060027312A1

公开(公告)日：2006-02-09

申请号：US11241992

申请日：2005-10-04

申请人： Yoshiyuki Tanabe ,  Yoshihiro Nomura ,  Hiroshi Kirihara ,  Youichi Hosokawa ,  Shinji Iioka ,  Satoru Yanagisawa

发明人： Yoshiyuki Tanabe ,  Yoshihiro Nomura ,  Hiroshi Kirihara ,  Youichi Hosokawa ,  Shinji Iioka ,  Satoru Yanagisawa

IPC分类号： B32B37/00 ,  B29C65/00

CPC分类号： H01L24/32 ,  H01L23/4951 ,  H01L23/544 ,  H01L24/27 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L2223/54473 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83856 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/181 ,  Y10S428/901 ,  Y10T83/155 ,  Y10T83/543 ,  Y10T83/9416 ,  Y10T156/1056 ,  Y10T156/1062 ,  Y10T156/1084 ,  Y10T428/24273 ,  Y10T428/24322 ,  Y10T428/28 ,  Y10T428/2852 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A punched adhesive tape for semiconductor which is made by punching an adhesive tape comprising a base film and an adhesive layer provided on one or each side of the base film to mark the regions in the adhesive tape where contaminants or defects are contained; a method of producing an adhesive tape-bearing lead frame by punching the punched adhesive tape for semiconductor, with the parts containing the punched holes skipped over, and applying the adhesive tape pieces punched out from the punched adhesive tape for semiconductor to a lead frame; a semiconductor device fabricated by using the adhesive-bearing lead frame.

公开(公告)号：US06523446B1

公开(公告)日：2003-02-25

申请号：US09462943

申请日：2000-01-18

申请人： Yoshiyuki Tanabe ,  Yoshihiro Nomura ,  Hiroshi Kirihara ,  Youichi Hosokawa ,  Shinji Iioka ,  Satoru Yanagisawa

发明人： Yoshiyuki Tanabe ,  Yoshihiro Nomura ,  Hiroshi Kirihara ,  Youichi Hosokawa ,  Shinji Iioka ,  Satoru Yanagisawa

IPC分类号： B26D538

CPC分类号： H01L24/32 ,  H01L23/4951 ,  H01L23/544 ,  H01L24/27 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L2223/54473 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83856 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/181 ,  Y10S428/901 ,  Y10T83/155 ,  Y10T83/543 ,  Y10T83/9416 ,  Y10T156/1056 ,  Y10T156/1062 ,  Y10T156/1084 ,  Y10T428/24273 ,  Y10T428/24322 ,  Y10T428/28 ,  Y10T428/2852 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A punched adhesive tape for semiconductor which is made by punching an adhesive tape comprising a base film and an adhesive layer provided on one or each side of the base film to mark the regions in the adhesive tape where contaminants or defects are contained; a method of producing an adhesive tape-bearing lead frame by punching the punched adhesive tape for semiconductor, with the parts containing the punched holes skipped over, and applying the adhesive tape pieces punched out from the punched adhesive tape for semiconductor to a lead frame; a semiconductor device fabricated by using the adhesive-bearing lead frame.

摘要翻译： 一种用于半导体的冲压胶带，其通过冲压包括基膜的粘合带和设置在基膜的一侧或两侧上的粘合剂层来标记粘合带中含有污染物或缺陷的区域; 通过冲压用于半导体的冲压胶带来生产带状带引线框架的方法，其中包含冲孔的部件被跳过，并将从冲压的半导体胶带冲压出的粘合带片施加到引线框架; 通过使用粘合剂承载引线框架制造的半导体器件。

公开(公告)号：US06265782B1

公开(公告)日：2001-07-24

申请号：US09284131

申请日：1999-08-30

申请人： Kazunori Yamamoto ,  Yasushi Shimada ,  Yasushi Kumashiro ,  Teiichi Inada ,  Hiroyuki Kuriya ,  Aizo Kaneda ,  Takeo Tomiyama ,  Yoshihiro Nomura ,  Yoichi Hosokawa ,  Hiroshi Kirihara ,  Akira Kageyama

发明人： Kazunori Yamamoto ,  Yasushi Shimada ,  Yasushi Kumashiro ,  Teiichi Inada ,  Hiroyuki Kuriya ,  Aizo Kaneda ,  Takeo Tomiyama ,  Yoshihiro Nomura ,  Yoichi Hosokawa ,  Hiroshi Kirihara ,  Akira Kageyama

IPC分类号： H01L2348

CPC分类号： H01L23/49827 ,  C09J163/00 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/50 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83856 ,  H01L2224/92247 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/15159 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/351 ,  Y10T428/28 ,  Y10T428/2848 ,  Y10T428/2852 ,  Y10T428/287 ,  Y10T428/31511 ,  Y10T428/31515 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012

摘要： The present invention aims at an improvement in temperature-cycle resistance after packaging in semiconductor devices and also an improvement in moisture-absorbed reflow resistance, and provides an adhesive having a storage elastic modulus at 25° C. of from 10 to 2,000 MPa and a storage elastic modulus at 260° C. of from 3 to 50 MPa as measured with a dynamic viscoelastic spectrometer, and also a double-sided adhesive film, a semiconductor device and a semiconductor chip mounting substrate which make use of the adhesive, and their production process.

摘要翻译： 本发明旨在提高半导体器件中的封装后的耐温循环性，并且提高吸湿回流焊性，并提供在25℃下的储能弹性模量为10〜2000MPa的粘合剂和 使用动态粘弹性光谱仪测量的260℃下的储存弹性模量为3至50MPa，以及使用粘合剂的双面粘合膜，半导体器件和半导体芯片安装基板，以及它们的生产 处理。

公开(公告)号：US06621170B2

公开(公告)日：2003-09-16

申请号：US09842441

申请日：2001-04-26

申请人： Kazunori Yamamoto ,  Yasushi Shimada ,  Yasushi Kumashiro ,  Teiichi Inada ,  Hiroyuki Kuriya ,  Aizo Kaneda ,  Takeo Tomiyama ,  Yoshihiro Nomura ,  Yoichi Hosokawa ,  Hiroshi Kirihara ,  Akira Kageyama

发明人： Kazunori Yamamoto ,  Yasushi Shimada ,  Yasushi Kumashiro ,  Teiichi Inada ,  Hiroyuki Kuriya ,  Aizo Kaneda ,  Takeo Tomiyama ,  Yoshihiro Nomura ,  Yoichi Hosokawa ,  Hiroshi Kirihara ,  Akira Kageyama

IPC分类号： H01L2348

CPC分类号： H01L23/49827 ,  C09J163/00 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/50 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83856 ,  H01L2224/92247 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/15159 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/351 ,  Y10T428/28 ,  Y10T428/2848 ,  Y10T428/2852 ,  Y10T428/287 ,  Y10T428/31511 ,  Y10T428/31515 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012

摘要： The present invention aims at an improvement in temperature-cycle resistance after packaging in semiconductor devices and also an improvement in moisture-absorbed reflow resistance, and provides an adhesive having a storage elastic modulus at 25° C. of from 10 to 2,000 MPa and a storage elastic modulus at 260° C. of from 3 to 50 MPa as measured with a dynamic viscoelastic spectrometer, and also a double-sided adhesive film, a semiconductor device and a semiconductor chip mounting substrate which make use of the adhesive, and their production process.

摘要翻译： 本发明旨在提高半导体器件中的封装后的耐温循环性，并且提高吸湿回流焊性，并提供在25℃下的储能弹性模量为10〜2000MPa的粘合剂和 使用动态粘弹性光谱仪测量的260℃下的储存弹性模量为3至50MPa，以及使用粘合剂的双面粘合膜，半导体器件和半导体芯片安装基板，以及它们的生产 处理。

公开(公告)号：US08618743B2

公开(公告)日：2013-12-31

申请号：US13699907

申请日：2011-11-16

申请人： Takakazu Miyahara ,  Hiroshi Kirihara ,  Mitsuhiro Hashiguchi

发明人： Takakazu Miyahara ,  Hiroshi Kirihara ,  Mitsuhiro Hashiguchi

IPC分类号： G05F1/00

CPC分类号： H05B37/02 ,  H03L7/00 ,  H05B33/0806 ,  H05B33/0815 ,  H05B33/0845 ,  H05B39/048 ,  Y02B20/346

摘要： The present invention is aimed at providing a dimmer capable of preventing malfunctions due to noise contamination or waveform distortion of the voltage of an AC power source. The dimmer according to the present invention has a time division control circuit for controlling an effective voltage supplied to a lighting load by regulating the period of time to turn on a switching element, and further includes: a zero-crossing detector section 11 for detecting a zero-crossing point and generating a zero-crossing signal whose value changes at the zero-crossing point; an oscillator 13 for generating an oscillating signal having a frequency equal to that of the AC power source or an integral multiple of this frequency; a reference point determiner section 14 for measuring a phase difference between the zero-crossing signal and the oscillating signal every time the zero-crossing signal is generated, and for determining a reference point for setting the timing of turning on or off the switching element 6 based on a data of the measured value of the phase difference; and a time division control signal generator (on/off timing calculator section 15 and time division control signal generator section 17) for sending an on/off signal to the switching element 6 at the timing determined on the basis of the reference point and the effective voltage to be supplied to the lighting load.

摘要翻译： 本发明的目的在于提供一种能够防止由于噪声污染引起的故障或者AC电源的电压的波形失真的调光器。 根据本发明的调光器具有时分控制电路，用于通过调节开关元件的导通时间来控制提供给照明负载的有效电压，并且还包括：过零检测器部分11，用于检测 产生过零点，其过零点的值在零交叉点变化; 振荡器13，用于产生频率等于交流电源频率的振荡信号或该频率的整数倍; 用于在每次产生过零信号时测量过零信号和振荡信号之间的相位差的参考点确定器部分14，并且用于确定用于设置开关元件6的接通或断开定时的参考点 基于相位差的测量值的数据; 以及用于基于参考点确定的定时向开关元件6发送接通/断开信号的时分控制信号发生器（开/关定时计算部15和时分控制信号发生部17） 电压被提供给照明负载。