公开(公告)号：US06265782B1

公开(公告)日：2001-07-24

申请号：US09284131

申请日：1999-08-30

申请人： Kazunori Yamamoto ,  Yasushi Shimada ,  Yasushi Kumashiro ,  Teiichi Inada ,  Hiroyuki Kuriya ,  Aizo Kaneda ,  Takeo Tomiyama ,  Yoshihiro Nomura ,  Yoichi Hosokawa ,  Hiroshi Kirihara ,  Akira Kageyama

发明人： Kazunori Yamamoto ,  Yasushi Shimada ,  Yasushi Kumashiro ,  Teiichi Inada ,  Hiroyuki Kuriya ,  Aizo Kaneda ,  Takeo Tomiyama ,  Yoshihiro Nomura ,  Yoichi Hosokawa ,  Hiroshi Kirihara ,  Akira Kageyama

IPC分类号： H01L2348

CPC分类号： H01L23/49827 ,  C09J163/00 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/50 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83856 ,  H01L2224/92247 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/15159 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/351 ,  Y10T428/28 ,  Y10T428/2848 ,  Y10T428/2852 ,  Y10T428/287 ,  Y10T428/31511 ,  Y10T428/31515 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012

摘要： The present invention aims at an improvement in temperature-cycle resistance after packaging in semiconductor devices and also an improvement in moisture-absorbed reflow resistance, and provides an adhesive having a storage elastic modulus at 25° C. of from 10 to 2,000 MPa and a storage elastic modulus at 260° C. of from 3 to 50 MPa as measured with a dynamic viscoelastic spectrometer, and also a double-sided adhesive film, a semiconductor device and a semiconductor chip mounting substrate which make use of the adhesive, and their production process.

摘要翻译： 本发明旨在提高半导体器件中的封装后的耐温循环性，并且提高吸湿回流焊性，并提供在25℃下的储能弹性模量为10〜2000MPa的粘合剂和 使用动态粘弹性光谱仪测量的260℃下的储存弹性模量为3至50MPa，以及使用粘合剂的双面粘合膜，半导体器件和半导体芯片安装基板，以及它们的生产 处理。

公开(公告)号：US06621170B2

公开(公告)日：2003-09-16

申请号：US09842441

申请日：2001-04-26

申请人： Kazunori Yamamoto ,  Yasushi Shimada ,  Yasushi Kumashiro ,  Teiichi Inada ,  Hiroyuki Kuriya ,  Aizo Kaneda ,  Takeo Tomiyama ,  Yoshihiro Nomura ,  Yoichi Hosokawa ,  Hiroshi Kirihara ,  Akira Kageyama

发明人： Kazunori Yamamoto ,  Yasushi Shimada ,  Yasushi Kumashiro ,  Teiichi Inada ,  Hiroyuki Kuriya ,  Aizo Kaneda ,  Takeo Tomiyama ,  Yoshihiro Nomura ,  Yoichi Hosokawa ,  Hiroshi Kirihara ,  Akira Kageyama

IPC分类号： H01L2348

CPC分类号： H01L23/49827 ,  C09J163/00 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L24/29 ,  H01L24/32 ,  H01L24/45 ,  H01L24/48 ,  H01L24/50 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73265 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83856 ,  H01L2224/92247 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01015 ,  H01L2924/01019 ,  H01L2924/0102 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01045 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01077 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/07802 ,  H01L2924/10253 ,  H01L2924/12041 ,  H01L2924/12044 ,  H01L2924/15159 ,  H01L2924/15184 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/351 ,  Y10T428/28 ,  Y10T428/2848 ,  Y10T428/2852 ,  Y10T428/287 ,  Y10T428/31511 ,  Y10T428/31515 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00012

摘要： The present invention aims at an improvement in temperature-cycle resistance after packaging in semiconductor devices and also an improvement in moisture-absorbed reflow resistance, and provides an adhesive having a storage elastic modulus at 25° C. of from 10 to 2,000 MPa and a storage elastic modulus at 260° C. of from 3 to 50 MPa as measured with a dynamic viscoelastic spectrometer, and also a double-sided adhesive film, a semiconductor device and a semiconductor chip mounting substrate which make use of the adhesive, and their production process.

摘要翻译： 本发明旨在提高半导体器件中的封装后的耐温循环性，并且提高吸湿回流焊性，并提供在25℃下的储能弹性模量为10〜2000MPa的粘合剂和 使用动态粘弹性光谱仪测量的260℃下的储存弹性模量为3至50MPa，以及使用粘合剂的双面粘合膜，半导体器件和半导体芯片安装基板，以及它们的生产 处理。

公开(公告)号：US07273654B2

公开(公告)日：2007-09-25

申请号：US10246620

申请日：2002-09-19

申请人： Yoshiyuki Tanabe ,  Yoshihiro Nomura ,  Hiroshi Kirihara ,  Youichi Hosokawa ,  Shinji Iioka ,  Satoru Yanagisawa

发明人： Yoshiyuki Tanabe ,  Yoshihiro Nomura ,  Hiroshi Kirihara ,  Youichi Hosokawa ,  Shinji Iioka ,  Satoru Yanagisawa

IPC分类号： B32B7/12

CPC分类号： H01L24/32 ,  H01L23/4951 ,  H01L23/544 ,  H01L24/27 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L2223/54473 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83856 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/181 ,  Y10S428/901 ,  Y10T83/155 ,  Y10T83/543 ,  Y10T83/9416 ,  Y10T156/1056 ,  Y10T156/1062 ,  Y10T156/1084 ,  Y10T428/24273 ,  Y10T428/24322 ,  Y10T428/28 ,  Y10T428/2852 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A punched adhesive tape for semiconductor which is made by punching an adhesive tape comprising a base film and an adhesive layer provided on one or each side of the base film to mark the regions in the adhesive tape where contaminants or defects are contained; a method of producing an adhesive tape-bearing lead frame by punching the punched adhesive tape for semiconductor, with the parts containing the punched holes skipped over, and applying the adhesive tape pieces punched out from the punched adhesive tape for semiconductor to a lead frame; a semiconductor device fabricated by using the adhesive-bearing lead frame.

摘要翻译： 一种用于半导体的冲压胶带，其通过冲压包括基膜的粘合带和设置在基膜的一侧或两侧上的粘合剂层来标记粘合带中含有污染物或缺陷的区域; 通过冲压用于半导体的冲压胶带来生产带状带引线框架的方法，其中包含冲孔的部件被跳过，并将从冲压的半导体胶带冲压出的粘合带片施加到引线框架; 通过使用粘合剂承载引线框架制造的半导体器件。

公开(公告)号：US20090022893A1

公开(公告)日：2009-01-22

申请号：US12236756

申请日：2008-09-24

申请人： Yoshiyuki Tanabe ,  Yoshihiro Nomura ,  Hiroshi Kirihara ,  Youichi Hosokawa ,  Shinji Iioka ,  Satoru Yanagisawa

发明人： Yoshiyuki Tanabe ,  Yoshihiro Nomura ,  Hiroshi Kirihara ,  Youichi Hosokawa ,  Shinji Iioka ,  Satoru Yanagisawa

IPC分类号： B05D3/12

CPC分类号： H01L24/32 ,  H01L23/4951 ,  H01L23/544 ,  H01L24/27 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L2223/54473 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83856 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/181 ,  Y10S428/901 ,  Y10T83/155 ,  Y10T83/543 ,  Y10T83/9416 ,  Y10T156/1056 ,  Y10T156/1062 ,  Y10T156/1084 ,  Y10T428/24273 ,  Y10T428/24322 ,  Y10T428/28 ,  Y10T428/2852 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A punched adhesive tape for semiconductor which is made by punching an adhesive tape comprising a base film and an adhesive layer provided on one or each side of the base film to mark the regions in the adhesive tape where contaminants or defects are contained; a method of producing an adhesive tape-bearing lead frame by punching the punched adhesive tape for semiconductor, with the parts containing the punched holes skipped over, and applying the adhesive tape pieces punched out from the punched adhesive tape for semiconductor to a lead frame; a semiconductor device fabricated by using the adhesive-bearing lead frame.

摘要翻译： 一种用于半导体的冲压胶带，其通过冲压包括基膜的粘合带和设置在基膜的一侧或两侧上的粘合剂层来标记粘合带中含有污染物或缺陷的区域; 通过冲压用于半导体的冲压胶带来生产带状带引线框架的方法，其中包含冲孔的部件被跳过，并将从冲压的半导体胶带冲压出的粘合带片施加到引线框架; 通过使用粘合剂承载引线框架制造的半导体器件。

公开(公告)号：US20060027312A1

公开(公告)日：2006-02-09

申请号：US11241992

申请日：2005-10-04

申请人： Yoshiyuki Tanabe ,  Yoshihiro Nomura ,  Hiroshi Kirihara ,  Youichi Hosokawa ,  Shinji Iioka ,  Satoru Yanagisawa

发明人： Yoshiyuki Tanabe ,  Yoshihiro Nomura ,  Hiroshi Kirihara ,  Youichi Hosokawa ,  Shinji Iioka ,  Satoru Yanagisawa

IPC分类号： B32B37/00 ,  B29C65/00

CPC分类号： H01L24/32 ,  H01L23/4951 ,  H01L23/544 ,  H01L24/27 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L2223/54473 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83856 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/181 ,  Y10S428/901 ,  Y10T83/155 ,  Y10T83/543 ,  Y10T83/9416 ,  Y10T156/1056 ,  Y10T156/1062 ,  Y10T156/1084 ,  Y10T428/24273 ,  Y10T428/24322 ,  Y10T428/28 ,  Y10T428/2852 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A punched adhesive tape for semiconductor which is made by punching an adhesive tape comprising a base film and an adhesive layer provided on one or each side of the base film to mark the regions in the adhesive tape where contaminants or defects are contained; a method of producing an adhesive tape-bearing lead frame by punching the punched adhesive tape for semiconductor, with the parts containing the punched holes skipped over, and applying the adhesive tape pieces punched out from the punched adhesive tape for semiconductor to a lead frame; a semiconductor device fabricated by using the adhesive-bearing lead frame.

公开(公告)号：US06523446B1

公开(公告)日：2003-02-25

申请号：US09462943

申请日：2000-01-18

申请人： Yoshiyuki Tanabe ,  Yoshihiro Nomura ,  Hiroshi Kirihara ,  Youichi Hosokawa ,  Shinji Iioka ,  Satoru Yanagisawa

发明人： Yoshiyuki Tanabe ,  Yoshihiro Nomura ,  Hiroshi Kirihara ,  Youichi Hosokawa ,  Shinji Iioka ,  Satoru Yanagisawa

IPC分类号： B26D538

CPC分类号： H01L24/32 ,  H01L23/4951 ,  H01L23/544 ,  H01L24/27 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L2223/54473 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83856 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/181 ,  Y10S428/901 ,  Y10T83/155 ,  Y10T83/543 ,  Y10T83/9416 ,  Y10T156/1056 ,  Y10T156/1062 ,  Y10T156/1084 ,  Y10T428/24273 ,  Y10T428/24322 ,  Y10T428/28 ,  Y10T428/2852 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A punched adhesive tape for semiconductor which is made by punching an adhesive tape comprising a base film and an adhesive layer provided on one or each side of the base film to mark the regions in the adhesive tape where contaminants or defects are contained; a method of producing an adhesive tape-bearing lead frame by punching the punched adhesive tape for semiconductor, with the parts containing the punched holes skipped over, and applying the adhesive tape pieces punched out from the punched adhesive tape for semiconductor to a lead frame; a semiconductor device fabricated by using the adhesive-bearing lead frame.

摘要翻译： 一种用于半导体的冲压胶带，其通过冲压包括基膜的粘合带和设置在基膜的一侧或两侧上的粘合剂层来标记粘合带中含有污染物或缺陷的区域; 通过冲压用于半导体的冲压胶带来生产带状带引线框架的方法，其中包含冲孔的部件被跳过，并将从冲压的半导体胶带冲压出的粘合带片施加到引线框架; 通过使用粘合剂承载引线框架制造的半导体器件。

公开(公告)号：US07449076B2

公开(公告)日：2008-11-11

申请号：US11241992

申请日：2005-10-04

申请人： Yoshiyuki Tanabe ,  Yoshihiro Nomura ,  Hiroshi Kirihara ,  Youichi Hosokawa ,  Shinji Iioka ,  Satoru Yanagisawa

发明人： Yoshiyuki Tanabe ,  Yoshihiro Nomura ,  Hiroshi Kirihara ,  Youichi Hosokawa ,  Shinji Iioka ,  Satoru Yanagisawa

IPC分类号： B32B41/00

CPC分类号： H01L24/32 ,  H01L23/4951 ,  H01L23/544 ,  H01L24/27 ,  H01L24/29 ,  H01L24/45 ,  H01L24/48 ,  H01L2223/54473 ,  H01L2224/32014 ,  H01L2224/32245 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/4826 ,  H01L2224/73215 ,  H01L2224/73253 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83856 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/181 ,  Y10S428/901 ,  Y10T83/155 ,  Y10T83/543 ,  Y10T83/9416 ,  Y10T156/1056 ,  Y10T156/1062 ,  Y10T156/1084 ,  Y10T428/24273 ,  Y10T428/24322 ,  Y10T428/28 ,  Y10T428/2852 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/00

摘要： A punched adhesive tape for semiconductor which is made by punching an adhesive tape comprising a base film and an adhesive layer provided on one or each side of the base film to mark the regions in the adhesive tape where contaminants or defects are contained; a method of producing an adhesive tape-bearing lead frame by punching the punched adhesive tape for semiconductor, with the parts containing the punched holes skipped over, and applying the adhesive tape pieces punched out from the punched adhesive tape for semiconductor to a lead frame; a semiconductor device fabricated by using the adhesive-bearing lead frame.

摘要翻译： 一种用于半导体的冲压胶带，其通过冲压包括基膜的粘合带和设置在基膜的一侧或两侧上的粘合剂层来标记粘合带中含有污染物或缺陷的区域; 通过冲压用于半导体的冲压胶带来生产带状带引线框架的方法，其中包含冲孔的部件被跳过，并将从冲压的半导体胶带冲压出的粘合带片施加到引线框架; 通过使用粘合剂承载引线框架制造的半导体器件。

公开(公告)号：US06462148B1

公开(公告)日：2002-10-08

申请号：US09297203

申请日：1999-10-07

申请人： Masahiro Suzuki ,  Shin Nishimura ,  Masao Suzuki ,  Akio Takahashi ,  Akira Kageyama ,  Yoshihiko Honda ,  Toshiyasu Kawai ,  Shinji Iioka ,  Yoshihiro Nomura

发明人： Masahiro Suzuki ,  Shin Nishimura ,  Masao Suzuki ,  Akio Takahashi ,  Akira Kageyama ,  Yoshihiko Honda ,  Toshiyasu Kawai ,  Shinji Iioka ,  Yoshihiro Nomura

IPC分类号： C08L7100

CPC分类号： C08G65/4037 ,  C08G65/4006 ,  C08G75/23 ,  C08L71/00

摘要： A resin composition useful as an adhesive film and insulating material for a multilayer wiring substrate or electronic parts comprises (A) a polymer containing a quinoline ring represented by the formula (1) in the structure such as 6,6′-bis(2-(4-fluorophenyl)-4-phenylquinoline) and 4,4′-(1,1,1,3,3,3-hexafluoro-2,2-propylidene)bisphenol, and (B) a bismaleimide compound represented by the formula (2) such as 2,2-bis((4-maleimidophenoxy)phenyl)propane.

摘要翻译： 可用作粘合剂膜的树脂组合物和用于多层布线基板或电子部件的绝缘材料包括（A）包含式（1）所示的喹啉环的聚合物，其结构如6,6'-双（2- （4-氟苯基）-4-苯基喹啉）和4,4' - （1,1,1,3,3,3-六氟-2,2-亚丙基）双酚，和（B）由式 （2）如2,2-双（（4-马来酰亚胺基苯氧基）苯基）丙烷。

公开(公告)号：US09013138B2

公开(公告)日：2015-04-21

申请号：US13528514

申请日：2012-06-20

申请人： Yoshihiro Nomura

发明人： Yoshihiro Nomura

IPC分类号： H02J7/14 ,  H02J7/04

CPC分类号： H02J7/044 ,  B60L11/1816 ,  B60L11/1838 ,  B60L11/1862 ,  B60L2240/545 ,  B60L2240/547 ,  B60L2240/549 ,  B60L2240/80 ,  B60L2250/14 ,  H02J7/047 ,  Y02T10/7005 ,  Y02T10/7044 ,  Y02T10/705 ,  Y02T10/7072 ,  Y02T90/121 ,  Y02T90/128 ,  Y02T90/14 ,  Y02T90/163

摘要： A charging apparatus includes an electric power supply device and a control device. The control device that estimates a first region in which first charging power is supplied from the electric power supply device to a electric storage device; estimates a second region, in which second charging power that is smaller than the first charging power is supplied from the electric power supply device to the electric storage device, based on temperature of the electric storage device and a state-of-charge of the electric storage; estimates a first charging time that corresponds to the first region; estimates a second charging time that corresponds to the second region; estimates a total charging time by using the first charging time and the second charging time; obtains a charging completion time; and sets a charging start time based on the charging completion time and the total charging time.

摘要翻译： 充电装置包括电力供应装置和控制装置。 所述控制装置将从所述电力供给装置向所述蓄电装置供给了第一充电电力的第一区域; 估计第二区域，其中基于蓄电装置的温度和电力的充电状态，从电力供应装置向蓄电装置供给小于第一充电电力的第二充电功率 存储; 估计对应于第一区域的第一充电时间; 估计对应于第二区域的第二充电时间; 通过使用第一充电时间和第二充电时间来估计总充电时间; 获得充电完成时间; 并根据充电完成时间和总充电时间设定充电开始时间。

公开(公告)号：US20090088536A1

公开(公告)日：2009-04-02

申请号：US11573959

申请日：2004-09-28

申请人： Hiroyuki Kawakami ,  Reiko Yamaguchi ,  Yoshihiro Nomura

发明人： Hiroyuki Kawakami ,  Reiko Yamaguchi ,  Yoshihiro Nomura

IPC分类号： C08L79/08

CPC分类号： C08J3/215 ,  C08J2379/08 ,  C08L79/08 ,  C08L2205/02 ,  H01L23/293 ,  H01L24/05 ,  H01L24/13 ,  H01L2224/024 ,  H01L2224/0401 ,  H01L2224/05008 ,  H01L2224/05571 ,  H01L2224/13021 ,  H01L2224/131 ,  H01L2924/00013 ,  H01L2924/0002 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01016 ,  H01L2924/01027 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/014 ,  H01L2924/19041 ,  H01L2924/19043 ,  C08L2666/20 ,  H01L2224/13099 ,  H01L2224/13599 ,  H01L2224/05599 ,  H01L2224/05099 ,  H01L2224/29099 ,  H01L2224/29599 ,  H01L2224/05552

摘要： An object of the present invention is to provide a heat-resistant resin paste that enables the formation of a precise pattern, exhibits excellent adhesiveness, heat resistance and flexibility, and enables a shortening of the production time, as well as a method for producing thereof. The present invention relates to a heat-resistant resin paste, comprising a first organic solvent (A1), a second organic solvent (A2) that comprises a lactone, a heat-resistant resin (B) that is soluble in a mixed organic solvent of (A1) and (A2), and a heat-resistant resin filler (C) that is soluble in (A1) but insoluble in (A2), wherein (C) is dispersed within a solution comprising (A1), (A2) and (B).

摘要翻译： 本发明的目的是提供一种能够形成精确图案的耐热树脂浆料，显示出优异的粘合性，耐热性和柔软性，并且能够缩短生产时间及其制备方法 。 本发明涉及一种耐热树脂膏，其包含第一有机溶剂（A1），包含内酯的第二有机溶剂（A2），可溶于混合有机溶剂的耐热树脂（B） （A1）和（A2）中的溶解性（A1）但不溶于（A2）的耐热性树脂填料（C），其中（C）分散在包含（A1），（A2）和 （B）。