公开(公告)号：US20160052777A1

公开(公告)日：2016-02-25

申请号：US14930642

申请日：2015-11-02

Applicant: mCube Inc.

Inventor： TE-HSI "TERRENCE" LEE ,  SUDHEER S. SRIDHARAMURTHY ,  SHINGO YONEOKA ,  WENHUA ZHANG

IPC: B81B7/00

CPC classification number: B81B7/0022 ,  B81B3/0086 ,  B81B2203/0118 ,  B81B2203/0307 ,  B81B2207/11 ,  B81C1/00246 ,  B81C1/0038 ,  B81C1/00531 ,  B81C1/00801 ,  B81C2201/053

Abstract: An integrated circuit includes a substrate member having a surface region and a CMOS IC layer overlying the surface region. The CMOS IC layer has at least one CMOS device. The integrated circuit also includes a bottom isolation layer overlying the CMOS IC layer, a shielding layer overlying a portion of the bottom isolation layer, and a top isolation layer overlying a portion of the bottom isolation layer. The bottom isolation layer includes an isolation region between the top isolation layer and the shielding layer. The integrated circuit also has a MEMS layer overlying the top isolation layer, the shielding layer, and the bottom isolation layer. The MEMS layer includes at least one MEMS structure having at least one movable structure and at least one anchored structure. The at least one anchored structure is coupled to a portion of the top isolation layer, and the at least one movable structure overlies the shielding layer.

Abstract translation: 集成电路包括具有表面区域的衬底构件和覆盖在表面区域上的CMOS IC层。 CMOS IC层具有至少一个CMOS器件。 集成电路还包括覆盖CMOS IC层的底部隔离层，覆盖在底部隔离层的一部分上的屏蔽层和覆盖在底部隔离层的一部分上的顶部隔离层。 底部隔离层包括顶部隔离层和屏蔽层之间的隔离区域。 集成电路还具有覆盖顶部隔离层，屏蔽层和底部隔离层的MEMS层。 MEMS层包括具有至少一个可移动结构和至少一个锚定结构的至少一个MEMS结构。 所述至少一个锚定结构耦合到所述顶部隔离层的一部分，并且所述至少一个可移动结构覆盖所述屏蔽层。

公开(公告)号：US20150241479A1

公开(公告)日：2015-08-27

申请号：US13922539

申请日：2013-06-20

Applicant: MCube Inc.

Inventor： DANIEL N. KOURY, JR. ,  SUDHEER S. SRIDHARAMURTHY

IPC: G01R3/00

CPC classification number: G01R3/00 ,  B81B3/0072 ,  B81B2203/0163 ,  B81B2203/0307 ,  G01C19/5783 ,  G01P15/125 ,  G01P2015/0857 ,  Y10T29/49007

Abstract: An improved MEMS transducer apparatus and method is provided. The apparatus has a movable base structure including an outer surface region and at least one portion removed to form at least one inner surface region. At least one intermediate anchor structure is disposed within the inner surface region. The apparatus includes an intermediate spring structure operably coupled to the central anchor structure, and at least one portion of the inner surface region. A capacitor element is disposed within the inner surface region.

Abstract translation: 提供了一种改进的MEMS换能器装置和方法。 该装置具有可移动的基座结构，其包括外表面区域和至少一个部分被去除以形成至少一个内表面区域。 至少一个中间锚结构设置在内表面区域内。 该装置包括可操作地联接到中心锚固结构的中间弹簧结构以及内表面区域的至少一部分。 电容器元件设置在内表面区域内。

公开(公告)号：US20150276406A1

公开(公告)日：2015-10-01

申请号：US14158765

申请日：2014-01-17

Applicant: mCube Inc.

Inventor： ALI J. RASTEGAR ,  SANJAY BHANDARI ,  SUDHEER S. SRIDHARAMURTHY

IPC: G01C19/5712 ,  B81B7/00 ,  B81B7/02

CPC classification number: G01C19/5776

Abstract: A system can include a MEMS gyroscope having a MEMS resonator overlying a CMOS IC substrate. The CMOS IC substrate can include an AGC loop circuit coupled to the MEMS gyroscope. The AGC loop acts in a way such that generated desired signal amplitude out of the drive signal maintains MEMS resonator velocity at a desired frequency and amplitude. A benefit of the AGC loop is that the charge pump of the HV driver inherently includes a ‘time constant’ for charging up of its output voltage. The system incorporates the Low pass functionality in to the AGC loop without requiring additional circuitry.

Abstract translation: 系统可以包括具有覆盖在CMOS IC衬底上的MEMS谐振器的MEMS陀螺仪。 CMOS IC衬底可以包括耦合到MEMS陀螺仪的AGC环路电路。 AGC环路的作用方式使得从驱动信号中产生的期望信号幅度将MEMS谐振器速度保持在期望的频率和幅度。 AGC环路的优点是HV驱动器的电荷泵固有地包括用于充电其输出电压的“时间常数”。 该系统将低通功能集成到AGC环路中，无需额外的电路。