SYSTEMS AND METHODS FOR CONTROLLING WAFER-BREAKER DEVICES
    3.
    发明申请
    SYSTEMS AND METHODS FOR CONTROLLING WAFER-BREAKER DEVICES 有权
    用于控制断路器装置的系统和方法

    公开(公告)号:US20150346712A1

    公开(公告)日:2015-12-03

    申请号:US14291397

    申请日:2014-05-30

    发明人: Cesar D. LARA

    IPC分类号: G05B19/418 H01L21/67

    摘要: Systems and methods for controlling wafer-breaker devices. In some embodiments, a controller for a semiconductor wafer singulation apparatus can be configured to receive an input signal having information about at least one singulation parameter. The controller can be further configured to generate an output signal based on the input signal to effectuate an operation associated with the singulation parameter. The controller can be further configured to disable manual control of the singulation parameter. In some embodiments, such a controller can be implemented, for example, in a control module, in a kit for modifying an existing singulation apparatus, as an integral part of a singulation apparatus, or any combination thereof.

    摘要翻译: 用于控制晶片断路器装置的系统和方法。 在一些实施例中,用于半导体晶片单片化装置的控制器可被配置为接收具有关于至少一个单独参数的信息的输入信号。 控制器还可以被配置为基于输入信号产生输出信号,以实现与分割参数相关联的操作。 控制器还可以被配置为禁止手动控制单个参数。 在一些实施例中,这样的控制器可以例如在控制模块中,在用于修改现有的分离设备的套件中,作为分割设备的组成部分或其任何组合来实现。

    Bonded Wafer Assembly System and Method
    6.
    发明申请
    Bonded Wafer Assembly System and Method 有权
    粘合晶片装配系统和方法

    公开(公告)号:US20100075482A1

    公开(公告)日:2010-03-25

    申请号:US12238038

    申请日:2008-09-25

    IPC分类号: H01L21/302 B26F3/00 B26D9/00

    摘要: A system and method for the removal of superfluous material in a bonded wafer assembly. The method includes cutting a plurality of parallel cuts in a top wafer, the plurality of cuts defining a segment of the top wafer attached to another portion of the top wafer via a tab, inserting a wedge-shaped breaker bar into at least one cut of the plurality of cuts, applying force to the breaker bar to fracture the tab, and removing the segment of the top wafer from the bonded wafer assembly, wherein a bottom wafer remains unsingulated after the removing.

    摘要翻译: 一种用于在接合晶片组件中去除多余材料的系统和方法。 该方法包括切割顶部晶片中的多个平行切口,多个切口限定经由突片附接到顶部晶片的另一部分的顶部晶片的段,将楔形断路器条插入到至少一个切口中 所述多个切口对所述断路器杆施加力以使所述突片断裂,以及从所述接合的晶片组件移除所述顶部晶片的所述段,其中在所述移除之后,底部晶片保持未起伏。

    DEVICE MANUFACTURING METHOD AND DICING METHOD
    8.
    发明申请
    DEVICE MANUFACTURING METHOD AND DICING METHOD 有权
    装置制造方法及其方法

    公开(公告)号:US20080132037A1

    公开(公告)日:2008-06-05

    申请号:US11848423

    申请日:2007-08-31

    申请人: Toshikazu FURUI

    发明人: Toshikazu FURUI

    IPC分类号: H01L21/00

    摘要: Prior to dicing, a volatile protective agent is applied to at least the face of the substrate in which the devices are fabricated. Then the devices are separated by dicing. After dicing, the surface of the volatile protective agent is cleaned, and then the volatile protective agent is evaporated.

    摘要翻译: 在切割之前,将挥发性保护剂施加到至少其中制造器件的衬底的表面。 然后通过切割分离设备。 切割后,清洁挥发性保护剂的表面,然后蒸发挥发性保护剂。

    Semiconductor wafer cutting blade and method

    公开(公告)号:US07306975B2

    公开(公告)日:2007-12-11

    申请号:US11172975

    申请日:2005-07-01

    IPC分类号: H01L21/44

    摘要: The invention provides apparatus and methods for sawing and singulating individual devices from a silicon or glass-bonded semiconductor wafer. Using methods of the invention, wafer device singulation includes a step of sawing kerfs approximately coinciding with the peripheries of numerous devices arranged on a wafer. Kerfs are also sawn into the opposite side of the wafer approximately opposing the first kerfs. Mechanical stress is applied to the wafer causing controlled breakage of the intervening wafer material, severing each of the devices from its neighbors. A saw blade apparatus of the invention provides enhanced cutting characteristics and is particularly suited for glass-bonded semiconductor wafer device singulation. The saw blade has a diamond disc suitable for high-speed rotation about its axis. The saw blade of the invention also preferably has a radiused cutting edge, and an annular gutter symmetrically disposed about the circumference on each of the opposing planes of the disc.

    Dicing tape and die ejection method
    10.
    发明申请
    Dicing tape and die ejection method 有权
    切割胶带和模具喷射方法

    公开(公告)号:US20040140532A1

    公开(公告)日:2004-07-22

    申请号:US10348638

    申请日:2003-01-22

    IPC分类号: H01L023/544

    摘要: A tape assembly for use in wafer dicing includes a layer of adhesive dicing tape having a size at least as large as a footprint of a die, and a screening portion which is adhered to the tape. The screening portion is interposed between the layer of tape and the die when the die is adhered to the layer of tape. The screening portion covers an interior portion of the layer of tape. The screening portion is sized and shaped to leave a sufficient portion of the layer of tape underlying a perimeter of the die exposed to adhere the die to the layer of tape.

    摘要翻译: 用于晶片切割的带组件包括具有至少与模具的覆盖层一样大的尺寸的粘合剂切割带层和粘附到带上的屏蔽部分。 当模具粘附到胶带层上时,屏蔽部分插入在胶带层和模具之间。 遮蔽部分覆盖胶带层的内部。 筛分部分的尺寸和形状设置成留下在模具的周边下方的足够部分的胶带,该胶片层暴露以使模具粘附到胶带层上。