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17 条记录 (耗时 0.042 秒)

    Chip package and method for forming the same
    2.
    发明授权
    Chip package and method for forming the same 有权
    芯片封装及其形成方法

    公开(公告)号：US08900913B2

    公开(公告)日：2014-12-02

    申请号：US13588898

    申请日：2012-08-17

    申请人： Chuan-Jin Shiu ,  Po-Shen Lin ,  Shen-Yuan Mao ,  Cheng-Chi Peng

    发明人： Chuan-Jin Shiu ,  Po-Shen Lin ,  Shen-Yuan Mao ,  Cheng-Chi Peng

    IPC分类号： H01L33/00 ,  H01L21/00 ,  H01L27/146

    CPC分类号： H01L27/14618 ,  H01L2224/13 ,  H01L2933/0025

    摘要： An embodiment of the invention provides a method for forming a chip package which includes: providing a substrate having a first surface and a second surface, wherein at least one optoelectronic device is formed in the substrate; forming an insulating layer on the substrate; forming a conducting layer on the insulating layer on the substrate, wherein the conducting layer is electrically connected to the at least one optoelectronic device; and spraying a solution of light shielding material on the second surface of the substrate to form a light shielding layer on the second surface of the substrate.

    摘要翻译： 本发明的一个实施例提供了一种用于形成芯片封装的方法，其包括：提供具有第一表面和第二表面的衬底，其中在衬底中形成至少一个光电器件; 在所述基板上形成绝缘层; 在所述基板上的所述绝缘层上形成导电层，其中所述导电层电连接到所述至少一个光电器件; 以及在所述基板的第二表面上喷射遮光材料的溶液，以在所述基板的第二表面上形成遮光层。

    Chip package and method for fabricating the same
    5.
    发明授权
    Chip package and method for fabricating the same 有权
    芯片封装及其制造方法

    公开(公告)号：US08575634B2

    公开(公告)日：2013-11-05

    申请号：US12981600

    申请日：2010-12-30

    申请人： Tsang-Yu Liu ,  Yu-Lin Yen ,  Chuan-Jin Shiu ,  Po-Shen Lin

    发明人： Tsang-Yu Liu ,  Yu-Lin Yen ,  Chuan-Jin Shiu ,  Po-Shen Lin

    IPC分类号： H01L33/60 ,  H01L33/48

    CPC分类号： H01L27/14618 ,  H01L21/76898 ,  H01L23/055 ,  H01L23/16 ,  H01L27/14683 ,  H01L31/0203 ,  H01L2924/0002 ,  H01L2924/00

    摘要： The present invention provides a chip package, including: a chip having a semiconductor device thereon; a cap layer over the semiconductor device; a spacer layer between the chip and the cap layer, wherein the spacer layer surrounds the semiconductor device and forms a cavity between the chip and the cap layer; and an anti-reflective layer between the cap layer and the chip, wherein the anti-reflective layer has a overlapping region with the spacer layer and extends into the cavity. Furthermore, a method for fabricating a chip package is also provided.

    摘要翻译： 本发明提供了一种芯片封装，包括：其上具有半导体器件的芯片; 半导体器件上的覆盖层; 在所述芯片和所述盖层之间的间隔层，其中所述间隔层围绕所述半导体器件并且在所述芯片和所述盖层之间形成空腔; 以及在所述盖层和所述芯片之间的抗反射层，其中所述抗反射层具有与所述间隔层的重叠区域并延伸到所述空腔中。 此外，还提供了一种用于制造芯片封装的方法。

    Chip package and method for forming the same
    6.
    发明授权
    Chip package and method for forming the same 有权
    芯片封装及其形成方法

    公开(公告)号：US08890191B2

    公开(公告)日：2014-11-18

    申请号：US13536628

    申请日：2012-06-28

    申请人： Chuan-Jin Shiu ,  Po-Shen Lin ,  Yi-Ming Chang

    发明人： Chuan-Jin Shiu ,  Po-Shen Lin ,  Yi-Ming Chang

    IPC分类号： H01L33/00 ,  H01L21/00 ,  H01L27/146

    CPC分类号： H01L27/14618 ,  H01L27/1463 ,  H01L2224/13 ,  H01L2924/1461 ,  H01L2924/00

    摘要： An embodiment of the invention provides a chip package which includes: a substrate having a first surface and a second surface; an optoelectronic device formed in the substrate; a conducting layer disposed on the substrate, wherein the conducting layer is electrically connected to the optoelectronic device; an insulating layer disposed between the substrate and the conducting layer; a light shielding layer disposed on the second surface of the substrate and directly contacting with the conducting layer, wherein the light shielding layer has a light shielding rate of more than about 80% and has at least an opening exposing the conducting layer; and a conducting bump disposed in the opening of the light shielding layer to electrically contact with the conducting layer, wherein all together the light shielding layer and the conducting bump substantially and completely cover the second surface of the substrate.

    摘要翻译： 本发明的实施例提供了一种芯片封装，其包括：具有第一表面和第二表面的基板; 形成在所述基板中的光电子器件; 设置在所述基板上的导电层，其中所述导电层电连接到所述光电子器件; 设置在所述基板和所述导电层之间的绝缘层; 遮光层，其设置在所述基板的所述第二表面上并与所述导电层直接接触，其中所述遮光层具有大于约80％的遮光率并且具有暴露所述导电层的至少一个开口; 以及布置在所述遮光层的开口中以与所述导电层电接触的导电凸块，其中所述遮光层和所述导电凸起部分都基本上完全覆盖所述基板的第二表面。

    CHIP PACKAGE AND METHOD FOR FABRICATING THE SAME
    7.
    发明申请
    CHIP PACKAGE AND METHOD FOR FABRICATING THE SAME 有权
    芯片包装及其制造方法

    公开(公告)号：US20110156074A1

    公开(公告)日：2011-06-30

    申请号：US12981600

    申请日：2010-12-30

    申请人： Tsang-Yu LIU ,  Yu-Lin Yen ,  Chuan-Jin Shiu ,  Po-Shen Lin

    发明人： Tsang-Yu LIU ,  Yu-Lin Yen ,  Chuan-Jin Shiu ,  Po-Shen Lin

    IPC分类号： H01L33/60 ,  H01L33/48

    CPC分类号： H01L27/14618 ,  H01L21/76898 ,  H01L23/055 ,  H01L23/16 ,  H01L27/14683 ,  H01L31/0203 ,  H01L2924/0002 ,  H01L2924/00

    摘要： The present invention provides a chip package, including: a chip having a semiconductor device thereon; a cap layer over the semiconductor device; a spacer layer between the chip and the cap layer, wherein the spacer layer surrounds the semiconductor device and forms a cavity between the chip and the cap layer; and an anti-reflective layer between the cap layer and the chip, wherein the anti-reflective layer has a overlapping region with the spacer layer and extends into the cavity. Furthermore, a method for fabricating a chip package is also provided.

    摘要翻译： 本发明提供了一种芯片封装，包括：其上具有半导体器件的芯片; 半导体器件上的覆盖层; 在所述芯片和所述盖层之间的间隔层，其中所述间隔层围绕所述半导体器件并且在所述芯片和所述盖层之间形成空腔; 以及在所述盖层和所述芯片之间的抗反射层，其中所述抗反射层具有与所述间隔层的重叠区域并延伸到所述空腔中。 此外，还提供了一种用于制造芯片封装的方法。

    COF packaging unit and COF packaging tape
    9.
    发明授权
    COF packaging unit and COF packaging tape 有权
    COF包装单位和COF包装胶带

    公开(公告)号：US08780577B2

    公开(公告)日：2014-07-15

    申请号：US13378566

    申请日：2011-11-08

    申请人： Liang-Chan Liao ,  Po-Shen Lin ,  Yuxin Bi

    发明人： Liang-Chan Liao ,  Po-Shen Lin ,  Yuxin Bi

    IPC分类号： H05K7/00 ,  H05K1/16 ,  H01L23/498 ,  G02F1/13

    CPC分类号： H01L23/4985 ,  G02F1/13 ,  H01L24/97 ,  H01L2924/14 ,  H01L2924/00

    摘要： The invention discloses a COF packaging unit and a COF packaging tape. The COF packaging unit comprises COF baseband(s), IC Die(s) packaged on the COF baseband(s), and input end wires and output end wires connected with the IC Die(s); the input end wires and the output end wires are respectively provided with input terminals and output terminals at two edges of the COF baseband. In the invention, because the input terminals and the output terminals are pitched along the edges of the COF baseband, the length of the single COF packaging unit is set in accordance with the pitching requirement of the input end wires and the output end wires, so that the COF baseband can have sufficient area for wiring, to adapt to the requirement of large LCD panels. Thus, resources are reasonably integrated and used, equipment utilization rate is increased, material purchasing cost is saved, and economic benefits are increased.

    摘要翻译： 本发明公开了一种COF包装单元和COF包装带。 COF封装单元包括COF基带，封装在COF基带上的IC芯片，以及与IC芯片连接的输入端线和输出端线; 输入端线和输出端线分别在COF基带的两个边缘处设置有输入端子和输出端子。 在本发明中，由于输入端子和输出端子沿着COF基带的边缘倾斜，所以单个COF封装单元的长度根据输入端线和输出端线的俯仰要求而设定，因此 COF基带可以有足够的布线面积，以适应大型液晶面板的需求。 资源合理整合利用，设备利用率提高，物资采购成本节省，经济效益提高。

    Liquid crystal display and chip on film thereof
    10.
    发明授权
    Liquid crystal display and chip on film thereof 有权
    液晶显示器及其薄膜上的芯片

    公开(公告)号：US08643155B2

    公开(公告)日：2014-02-04

    申请号：US13379640

    申请日：2011-08-31

    申请人： Liang-Chan Liao ,  Po-Shen Lin ,  Yu Wu

    发明人： Liang-Chan Liao ,  Po-Shen Lin ,  Yu Wu

    IPC分类号： H01L23/34 ,  H01L23/495

    CPC分类号： G02F1/13452 ,  H01L23/36 ,  H01L24/32 ,  H01L2224/83447 ,  H01L2924/15788 ,  H01L2924/00

    摘要： A chip on film (COF) is disclosed in the present disclosure, which comprises an adhesive base layer, a driving integrated circuit (IC), an adhesive layer and a copper layer. The driving IC is embedded on a surface of the adhesive base layer; the adhesive layer is located under the adhesive base layer; the copper layer is located under the adhesive layer. The adhesive base layer is formed with a heat and pressure spreading structure. A heat and pressure spreading structure is disposed on the adhesive base layer of the COF so that deformation or unevenness of the glass substrate in the bonded area can be avoided when the COF is thermally pressed to the glass substrate of the LCD. These guarantees the consistency between the bonded area and the unbounded area, the bonded area and the unbounded area of the glass substrate will have the same transmissivity and luminance.

    摘要翻译： 在本公开内容中公开了一种薄膜（COF），其包括粘合剂基层，驱动集成电路（IC），粘合剂层和铜层。 驱动IC嵌入在粘合剂基层的表面上; 粘合剂层位于粘合剂基层下方; 铜层位于粘合层下方。 粘合剂基层由热压扩散结构形成。 在COF的粘合剂基层上设置有热压扩散结构，使得当COF被热压到LCD的玻璃基板上时，可以避免在接合区域中的玻璃基板的变形或不均匀。 这些保证了接合面积和无界区域的一致性，玻璃基板的接合面积和无界面积将具有相同的透射率和亮度。