Abstract:
A method for planarizing the surface of a semiconductor wafer or device during manufacture. Dependencies of polish rate and substrate thickness on process parameters of downforce and polish speed, and on the characteristic product high feature area on the wafer, are explicitly defined and used to control Chemical-Mechanical Polish in Run-to-Run and real-time semiconductor production control applications.
Abstract:
The system includes a polishing pad, a pad height sensor; a window; and a window raising mechanism. The polishing pad has an aperture with the window vertically moveable therein. The pad height sensor is positioned above the polishing pad and measures the vertical position of the pad before polishing. The window raising mechanism adjusts the vertical position of the window based on information from the pad height sensor. An endpoint measurement sensor can be disposed beneath the window for in-situ measurement of the polishing process.
Abstract:
The present invention is a steering guide for surface cutting machines. The steering guide is made up of two sighting means that are connected to a surface cutting machine by a guide arm and are configured to align with the cutting edge portion of the saw blade. The first and second sighting means are visible by the sawyer while operating the device. Since the first and second sighting means are configured to align with the saw blade along a straight line, aligning the first and second sighting means with the guide line also aligns the cutting portion of the saw blade with the guideline. This enables the saw blade to be kept in alignment with the guideline while moving along a surface to be cut.
Abstract:
In certain preferred embodiments, the present invention provides a grinding machine for creating depression patterns in a surface such as asphalt or concrete. The depression pattern may be a rumble strip for alerting drivers who drift off a driving lane, or may be for other uses. Use of a depression pattern (instead of protrusions) eliminates interference with snowplow operation in areas where plows are used. In the present invention, the grinding machine is based on a trolley which moves at a uniform height along a surface, and includes a forward nullgaugenull wheel which controls the relative grinding drum depth based on the wheel position and rotation. In a preferred embodiment, the grinding assembly is raised and lowered relative to the trolley in correspondence with the advancement of the trolley.
Abstract:
A load cup for transferring a substrate in a chemical mechanical polishing system is provided. In one embodiment, a load cup for transferring substrates in a chemical mechanical polishing system includes a substrate support having a first side adapted to support a substrate thereon and at least one actuator coupled to the substrate support and adapted to move the substrate support laterally. In another embodiment, a method for transferring a substrate between a polishing head and a load cup includes sensing a position of the polishing head relative to the load cup and automatically aligning the load cup and polishing head in response to the sensed relative position.
Abstract:
An apparatus for planarizing a work piece includes an easily assembled work carrier. The carrier includes a carrier insert having a work piece bladder clamped to a carrier backing plate with a plurality of clamps to form a plurality of web plenums. The outer edge of the bladder is supported by a rib that is coupled to a carrier plenum. By adjusting the pressure in the carrier plenum, the pressure exerted on the edge of a work piece during a planarization operation can be adjusted. The carrier also includes a floating wear ring that surrounds the work piece bladder and a work piece mounted on that bladder. By adjusting the force exerted by the wear ring on a polishing pad, independently of the pressure exerted by the rib at the edge of the bladder, the material removal rate near the edge of the work piece can be controlled.
Abstract:
A device for removing an abrasive disk from a rotary sander of the type having a disk-shaped sanding pad with upper and lower surfaces that are parallel to each other and spaced apart from each other by a predetermined distance. The device includes a frame having a pair of elongated guide rails secured to the frame. Each guide rail has an elongated guide surface adapted to abut against the upper surface of the sanding pad on opposite sides of the sanding pad. At least one blade is secured to the frame so that the blade lies in a plane parallel to the guide surfaces and is spaced from the guide surfaces by the predetermined distance corresponding to the thickness of the sanding pad. In use, the sanding pad is moved along the guide rails by a robot so that the upper surface of the sanding pad slides along the guide surfaces. In doing so, the blade engages the sanding pad between its lower surface and its attached abrasive disk thus removing the abrasive disk from the sanding pad.
Abstract:
Monitoring the process of planarizing a workpiece, e.g., conditioning a CMP pad, can present some difficulties. Aspects of this invention provide methods and systems for monitoring and/or controlling such a planarization cycle. For example, a control system may monitor the proximity of a workpiece holder and an abrasion member by measuring the capacitance between a first sensor associated with the workpiece holder and a second sensor associated with the abrasion member. This exemplary control system may adjust a process parameter of the planarization cycle in response to a change in the measured capacitance. This can be useful in endpointing the planarization cycle, for example. In certain applications, the control system may define a pad profile based on multiple capacitance measurements and use the pad profile to achieve better planarity of the planarized surface.
Abstract:
A method for dressing a grinding worm that is to be used in forming a conical face gear that meshingly engages a conical involute pinion. The method employs true conjugate action between a theoretical conical involute pinion and a conical face gear to accurately position a dressing tool relative to a grinding worm.