METHOD FOR CHEMICAL-MECHANICAL POLISH CONTROL IN SEMICONDUCTOR MANUFACTURING
    1.
    发明申请
    METHOD FOR CHEMICAL-MECHANICAL POLISH CONTROL IN SEMICONDUCTOR MANUFACTURING 有权
    半导体制造中化学机械光栅控制的方法

    公开(公告)号:US20040198180A1

    公开(公告)日:2004-10-07

    申请号:US10401336

    申请日:2003-03-28

    CPC classification number: B24D13/147 B24B37/042 B24D2203/00 H01L21/30625

    Abstract: A method for planarizing the surface of a semiconductor wafer or device during manufacture. Dependencies of polish rate and substrate thickness on process parameters of downforce and polish speed, and on the characteristic product high feature area on the wafer, are explicitly defined and used to control Chemical-Mechanical Polish in Run-to-Run and real-time semiconductor production control applications.

    Abstract translation: 一种用于在制造期间平面化半导体晶片或器件的表面的方法。 抛光速率和衬底厚度对下压力和抛光速度的工艺参数的依赖性以及晶片上特征性产品高特征区域的明确定义并用于控制运行中的化学机械抛光和实时半导体 生产控制应用。

    Chemical mechanical polishing endpoint detection system and method
    2.
    发明申请
    Chemical mechanical polishing endpoint detection system and method 失效
    化学机械抛光终点检测系统及方法

    公开(公告)号:US20040192169A1

    公开(公告)日:2004-09-30

    申请号:US10602034

    申请日:2003-06-23

    CPC classification number: B24B37/205 B24B49/12

    Abstract: The system includes a polishing pad, a pad height sensor; a window; and a window raising mechanism. The polishing pad has an aperture with the window vertically moveable therein. The pad height sensor is positioned above the polishing pad and measures the vertical position of the pad before polishing. The window raising mechanism adjusts the vertical position of the window based on information from the pad height sensor. An endpoint measurement sensor can be disposed beneath the window for in-situ measurement of the polishing process.

    Abstract translation: 该系统包括抛光垫,垫高度传感器; 一个窗口; 和升起机构。 抛光垫具有孔,其中窗可在其中垂直移动。 焊盘高度传感器位于抛光垫的上方,并在抛光之前测量焊盘的垂直位置。 窗口提升机构根据来自垫高度传感器的信息来调整窗口的垂直位置。 端点测量传感器可以设置在窗户下方,用于原位测量抛光过程。

    Steering guide for cutting equipment
    3.
    发明申请
    Steering guide for cutting equipment 有权
    切割设备转向指南

    公开(公告)号:US20040173198A1

    公开(公告)日:2004-09-09

    申请号:US10382788

    申请日:2003-03-05

    Inventor: J. Brandal Glenn

    CPC classification number: B23D59/002 B28D1/045

    Abstract: The present invention is a steering guide for surface cutting machines. The steering guide is made up of two sighting means that are connected to a surface cutting machine by a guide arm and are configured to align with the cutting edge portion of the saw blade. The first and second sighting means are visible by the sawyer while operating the device. Since the first and second sighting means are configured to align with the saw blade along a straight line, aligning the first and second sighting means with the guide line also aligns the cutting portion of the saw blade with the guideline. This enables the saw blade to be kept in alignment with the guideline while moving along a surface to be cut.

    Abstract translation: 本发明是用于表面切割机械的转向导向装置。 转向导轨由两个瞄准装置组成,两个瞄准装置通过导向臂连接到一台表面切割机上,并被构造成与锯片的切割边缘部分对准。 在操作设备时,锯锯可以看到第一和第二瞄准装置。 由于第一和第二瞄准装置被配置为沿着直线与锯片对准,所以使第一和第二瞄准装置与引导线对齐,还使锯片的切割部分与指南对准。 这使得锯片在沿着要切割的表面移动的同时保持与指南对准。

    Grinding machines for depression patterns along roads
    4.
    发明申请
    Grinding machines for depression patterns along roads 有权
    用于沿道路的凹陷模式的研磨机

    公开(公告)号:US20040166774A1

    公开(公告)日:2004-08-26

    申请号:US10784609

    申请日:2004-02-23

    CPC classification number: E01C23/0993 E01C23/088

    Abstract: In certain preferred embodiments, the present invention provides a grinding machine for creating depression patterns in a surface such as asphalt or concrete. The depression pattern may be a rumble strip for alerting drivers who drift off a driving lane, or may be for other uses. Use of a depression pattern (instead of protrusions) eliminates interference with snowplow operation in areas where plows are used. In the present invention, the grinding machine is based on a trolley which moves at a uniform height along a surface, and includes a forward nullgaugenull wheel which controls the relative grinding drum depth based on the wheel position and rotation. In a preferred embodiment, the grinding assembly is raised and lowered relative to the trolley in correspondence with the advancement of the trolley.

    Abstract translation: 在某些优选实施例中,本发明提供一种用于在诸如沥青或混凝土的表面中产生凹陷图案的研磨机。 抑郁症模式可能是一个隆隆声,用于警告从驾驶车道偏离的司机,或可能用于其他用途。 使用凹陷图案(而不是突起)消除了在使用犁的区域对除雪机操作的干扰。 在本发明中,磨床基于沿着表面以均匀的高度移动的手推车,并且包括前进的“量规”轮,其基于车轮位置和旋转来控制相对研磨鼓的深度。 在一个优选实施例中,相对于手推车的推进,研磨组件相对于手推车升高和降低。

    Load cup for chemical mechanical polishing
    5.
    发明申请
    Load cup for chemical mechanical polishing 失效
    负载杯用于化学机械抛光

    公开(公告)号:US20040127142A1

    公开(公告)日:2004-07-01

    申请号:US10621303

    申请日:2003-07-16

    CPC classification number: H01L21/68728 B24B37/345 H01L21/68764 H01L21/68771

    Abstract: A load cup for transferring a substrate in a chemical mechanical polishing system is provided. In one embodiment, a load cup for transferring substrates in a chemical mechanical polishing system includes a substrate support having a first side adapted to support a substrate thereon and at least one actuator coupled to the substrate support and adapted to move the substrate support laterally. In another embodiment, a method for transferring a substrate between a polishing head and a load cup includes sensing a position of the polishing head relative to the load cup and automatically aligning the load cup and polishing head in response to the sensed relative position.

    Abstract translation: 提供了用于在化学机械抛光系统中转印衬底的负载杯。 在一个实施例中,用于在化学机械抛光系统中传送衬底的负载杯包括具有适于在其上支撑衬底的第一侧的衬底支撑件和耦合到衬底支撑件并且适于横向移动衬底支架的至少一个致动器。 在另一个实施例中,用于在抛光头和负载杯之间传送衬底的方法包括:检测抛光头相对于负载杯的位置,并根据感测到的相对位置自动对准负载杯和抛光头。

    Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece
    7.
    发明申请
    Work piece carrier with adjustable pressure zones and barriers and a method of planarizing a work piece 有权
    具有可调节压力区和障碍物的工件载体以及对工件进行平面化的方法

    公开(公告)号:US20040067717A1

    公开(公告)日:2004-04-08

    申请号:US10672017

    申请日:2003-09-26

    CPC classification number: B24B37/30 B24B37/32 B24B49/16

    Abstract: An apparatus for planarizing a work piece includes an easily assembled work carrier. The carrier includes a carrier insert having a work piece bladder clamped to a carrier backing plate with a plurality of clamps to form a plurality of web plenums. The outer edge of the bladder is supported by a rib that is coupled to a carrier plenum. By adjusting the pressure in the carrier plenum, the pressure exerted on the edge of a work piece during a planarization operation can be adjusted. The carrier also includes a floating wear ring that surrounds the work piece bladder and a work piece mounted on that bladder. By adjusting the force exerted by the wear ring on a polishing pad, independently of the pressure exerted by the rib at the edge of the bladder, the material removal rate near the edge of the work piece can be controlled.

    Abstract translation: 用于平坦化工件的装置包括容易组装的工作载体。 载体包括载体插入物,其具有夹紧到具有多个夹具的载体背板的工件气囊,以形成多个腹板充气室。 囊的外边缘由连接到载体通风室的肋支撑。 通过调整载体通风室中的压力,可以调节在平坦化操作期间施加在工件边缘上的压力。 载体还包括围绕工件气囊的浮动磨损环和安装在该气囊上的工件。 通过将磨损环施加在抛光垫上的力与球囊边缘处的肋施加的压力无关,可以控制靠近工件边缘的材料去除率。

    Device for removing an abrasive disk from a sanding pad
    8.
    发明申请
    Device for removing an abrasive disk from a sanding pad 审中-公开
    用于从研磨垫移除研磨盘的装置

    公开(公告)号:US20040048549A1

    公开(公告)日:2004-03-11

    申请号:US10237291

    申请日:2002-09-09

    CPC classification number: B24D9/08

    Abstract: A device for removing an abrasive disk from a rotary sander of the type having a disk-shaped sanding pad with upper and lower surfaces that are parallel to each other and spaced apart from each other by a predetermined distance. The device includes a frame having a pair of elongated guide rails secured to the frame. Each guide rail has an elongated guide surface adapted to abut against the upper surface of the sanding pad on opposite sides of the sanding pad. At least one blade is secured to the frame so that the blade lies in a plane parallel to the guide surfaces and is spaced from the guide surfaces by the predetermined distance corresponding to the thickness of the sanding pad. In use, the sanding pad is moved along the guide rails by a robot so that the upper surface of the sanding pad slides along the guide surfaces. In doing so, the blade engages the sanding pad between its lower surface and its attached abrasive disk thus removing the abrasive disk from the sanding pad.

    Abstract translation: 一种用于从具有上下表面的盘形打磨垫类型的旋转式砂磨机去除研磨盘的装置,所述上表面和下表面彼此平行并且间隔开预定距离。 该装置包括具有固定到框架的一对细长导轨的框架。 每个导轨具有细长的导向表面,其适于在砂纸垫的相对侧上抵靠磨砂垫的上表面。 至少一个叶片固定到框架上,使得叶片位于平行于引导表面的平面中,并且与引导表面间隔开与砂磨垫的厚度相对应的预定距离。 在使用中,打磨垫通过机器人沿着导轨移动,使得打磨垫的上表面沿着引导表面滑动。 在这样做时,刀片在其下表面和其附着的研磨盘之间接合砂磨盘,从而从研磨垫移除研磨盘。

    Methods and systems for conditioning planarizing pads used in planarizing substrates
    9.
    发明申请
    Methods and systems for conditioning planarizing pads used in planarizing substrates 失效
    用于调整平面化基板的平面化焊盘的方法和系统

    公开(公告)号:US20040038623A1

    公开(公告)日:2004-02-26

    申请号:US10228154

    申请日:2002-08-26

    CPC classification number: B24B53/017 B24B37/013 B24B49/10

    Abstract: Monitoring the process of planarizing a workpiece, e.g., conditioning a CMP pad, can present some difficulties. Aspects of this invention provide methods and systems for monitoring and/or controlling such a planarization cycle. For example, a control system may monitor the proximity of a workpiece holder and an abrasion member by measuring the capacitance between a first sensor associated with the workpiece holder and a second sensor associated with the abrasion member. This exemplary control system may adjust a process parameter of the planarization cycle in response to a change in the measured capacitance. This can be useful in endpointing the planarization cycle, for example. In certain applications, the control system may define a pad profile based on multiple capacitance measurements and use the pad profile to achieve better planarity of the planarized surface.

    Abstract translation: 监测工件平坦化的过程,例如调整CMP垫,可能会出现一些困难。 本发明的方面提供了用于监测和/或控制这种平坦化循环的方法和系统。 例如,控制系统可以通过测量与工件保持器相关联的第一传感器和与磨损构件相关联的第二传感器之间的电容来监测工件保持器和磨损构件的接近度。 该示例性控制系统可以响应于测量的电容的变化来调整平坦化周期的过程参数。 例如,这可用于终止平坦化循环。 在某些应用中,控制系统可以基于多个电容测量来定义焊盘轮廓,并且使用焊盘轮廓来实现平坦化表面的更好的平坦度。

    Method for forming a grinding worm for forming a conical face gear that meshes with a conical involute pinion
    10.
    发明申请
    Method for forming a grinding worm for forming a conical face gear that meshes with a conical involute pinion 有权
    用于形成用于形成与锥形渐开线小齿轮啮合的锥形齿轮的研磨蜗杆的方法

    公开(公告)号:US20030207650A1

    公开(公告)日:2003-11-06

    申请号:US10453690

    申请日:2003-06-03

    Inventor: Jie Tan

    CPC classification number: B24B19/022 B23F23/1225 B24B53/075 B24B53/085

    Abstract: A method for dressing a grinding worm that is to be used in forming a conical face gear that meshingly engages a conical involute pinion. The method employs true conjugate action between a theoretical conical involute pinion and a conical face gear to accurately position a dressing tool relative to a grinding worm.

    Abstract translation: 一种用于修整磨削蜗杆的方法,该磨削蜗杆用于形成与锥形渐开线小齿轮啮合地接合的锥形面齿轮。 该方法在理论锥形渐开线小齿轮和锥形齿轮之间采用真正的共轭作用,以相对于研磨蜗杆精确地定位修整工具。

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