Abstract:
Disclosed herein is a printed circuit board including an electronic component embedded therein, as the electronic component is supported on the metal layer of core substrate, thus supporting and radiation performances are improved, production costs are reduced, and the manufacturing process is simplified.
Abstract:
A mobile communications terminal and a method for preventing an input error of a key input unit are provided. The mobile communications terminal includes a touch sensor unit for sensing a key that is input by touching a keypad region in order to output a key input signal corresponding to the key and a controller adapted to determine a key input according to either a priority between multiple keys from which key signals are received or whether a received key signal was generated inadvertently.
Abstract:
A light-emitting diode (“LED”) package is disclosed. The LED package includes a substrate, a pad frame, an LED chip and a housing. The pad frame includes a conductive lead divided by insulation materials on the substrate. The LED chip is mounted on the conductive lead. The housing surrounds the LED chip and the conductive lead, and has opening recess exposing the LED chip and a part of the conductive lead. The conductive lead includes a protrusion extended in both directions substantially perpendicular to a longitudinal direction of the housing.
Abstract:
Disclosed is a method for manufacturing an image sensor. The method includes a process for removing foreign matter from a non-device area of a wafer before forming contacts in a device area of the wafer. According to an embodiment, an insulating layer formed in the non-device area is removed by performing a first process with respect to the non-device area. Then, a contact can be formed in the insulating layer in the device area.
Abstract:
A method of fabricating a semiconductor device includes a step of preparing a semiconductor substrate in which an edge region and a cell formation region are defined. Next, an insulating layer is deposited on an entire surface of the semiconductor substrate. The insulating layer deposited on the edge region of the semiconductor substrate is then selectively etched within a chamber of plasma etch equipment equipped with a lower support member, on which the semiconductor substrate can be mounted, and an upper insulating member opposite to the semiconductor substrate. Finally, an annealing process is performed on the insulating layer of the semiconductor substrate.
Abstract:
An actuator to be used in a mobile optical recording/reproducing apparatus, the actuator including a holder; a movable member having an objective lens to focus an incident light; a support member positioned between the holder and the movable member, by which the movable member is movable supported with respect to the holder; and a magnetic driving unit, provided on a middle portion of the movable member and at an upper portion and/or a lower portion of the movable member, to drive the movable member in a track direction and a focus direction.
Abstract:
An optical pickup and driving method for an optical disk drive holding an optical disk includes a base, an object lens, and a slider supporting the object lens, where the object lens focuses a light on a recording surface of the optical disk. An optical head section includes the slider, where an air bearing floats the slider generated between the optical head section and the optical disk. Wire suspensions movably support the optical head section with respect to the base. A driving unit drives the optical head section in a tracking direction and a focusing direction. A latching unit selectively securely positions the optical head section at a predetermined distance away from the optical disk preventing the optical head section from colliding with the optical disk.