-
公开(公告)号:US20210241423A1
公开(公告)日:2021-08-05
申请号:US17165778
申请日:2021-02-02
Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS
Inventor: Gregory ROFFET , Stephane DROUARD , Roger MONTEITH
IPC: G06T3/40 , G06T7/00 , G01S17/894
Abstract: A device for assembling at least two shots of a scene acquired by at least one sensor includes a memory and processing circuitry. The processing circuitry is configured to save, in the memory, a first data set contained in a first signal generated by each pixel of the sensor and indicative of a first shot of the scene, and a second data set contained in a second signal generated by each pixel of the sensor and indicative of a second shot of the scene. The processing circuitry is further configured to assemble the first and second shots on the basis of the content of the first and second data sets of a plurality of pixels in order to form a resulting scene.
-
公开(公告)号:US11038595B2
公开(公告)日:2021-06-15
申请号:US16409723
申请日:2019-05-10
Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS
Inventor: Alexandre Coullomb , Romain Coffy , Jean-Michel Riviere
IPC: H04B10/40 , H01L31/0203 , H01L25/04 , H04B10/50 , H04B10/69
Abstract: An optoelectronic device includes a substrate and a first optoelectronic chip flush with a surface of the substrate. The device includes a cover that covers the substrate and the first optoelectronic chip. The cover comprises a cavity above a first optical transduction region of the first optoelectronic chip. The device also includes a second optoelectronic chip having a second optical transduction region spaced apart from the first optical transduction region and the cavity continues above the second optical transduction region.
-
公开(公告)号:US20210164832A1
公开(公告)日:2021-06-03
申请号:US17102522
申请日:2020-11-24
Applicant: STMicroelectronics (Grenoble 2) SAS
Inventor: Mickael Guene , Salim Bouchene , Cedric Grospellier , Jean-Jacques Rouger , Pascal Mellot
IPC: G01J1/44
Abstract: The present disclosure relates to a device and method for measuring a flicker frequency of a light source configured to implement at least one phase lock loop.
-
公开(公告)号:US20210159785A1
公开(公告)日:2021-05-27
申请号:US17099106
申请日:2020-11-16
Applicant: STMicroelectronics (Grenoble 2) SAS
Inventor: Xavier BRANCA
Abstract: A charge pump generates an output voltage. A first circuit generates a pulse width-modulated signal as a function of a deviation between the output voltage and a setpoint voltage. A second circuit receives a periodic signal and conditions the supply of the periodic signal to a control input of the charge pump as a function of the state of the pulse width-modulated signal.
-
公开(公告)号:US10923638B2
公开(公告)日:2021-02-16
申请号:US16572979
申请日:2019-09-17
Applicant: STMicroelectronics (Grenoble 2) SAS
Inventor: Nicolas Mastromauro , Karine Saxod
Abstract: An electronic device includes a carrier substrate having a front face and an electronic chip mounted on the front face. An encapsulation cover is mounted above the front face and bounds a chamber in which the chip is situated. A front opening is provided in front of an optical component of the chip. An optical element, designed to allow light to pass, is mounted on the cover in a position which covers the front opening of the cover. The optical element includes a central region designed to deviate light and a positioning pattern that is visible through the front opening. An additional mask is mounted on the encapsulation cover in a position which extends in front of the optical element. A local opening of the additional mask is situated in front of the optical component.
-
公开(公告)号:US10817461B2
公开(公告)日:2020-10-27
申请号:US16530069
申请日:2019-08-02
Applicant: STMicroelectronics (Grenoble 2) SAS
Inventor: Giovanni Scozzola
Abstract: A microcontroller includes distinct electronic functions and an interconnection circuit capable of transmitting in wireless fashion data between the functions. The microcontroller can be operated by writing configuration characteristics into a memory of the interconnection circuit for electronic functional circuits that do not have configuration characteristics contained in the memory and erasing configuration characteristics from the memory for electronic functional circuits that have configuration characteristics contained in the memory but are determined to not be able to wirelessly communicate with the interconnection circuit. Data can be wirelessly transmitted between the interconnection circuit and electronic functional circuits having configuration characteristics contained in the memory.
-
97.
公开(公告)号:US20200305283A1
公开(公告)日:2020-09-24
申请号:US16815554
申请日:2020-03-11
Applicant: STMicroelectronics (Grenoble 2) SAS
Inventor: Fabien QUERCIA , David AUCHERE , Norbert CHEVRIER , Fabien CORSAT
Abstract: A support substrate has first electric contacts in a front face. An electronic component is located above the front face of the support substrate and has second electric contacts facing the first electric contacts of the support substrate. An electric connection structure is interposed between corresponding first and second electric contacts of the support substrate and the electronic component, respectively. Each electric connection structure is formed by: a shim that is made of a first electrically conducting material, and a coating that is made of a second electrically conducting material (different from the first electrically conducting material). The coating surrounds the shim and is in contact with the corresponding first and second electric contacts of the support substrate and the electronic component.
-
公开(公告)号:US10777710B2
公开(公告)日:2020-09-15
申请号:US16432561
申请日:2019-06-05
Applicant: STMICROELECTRONICS (GRENOBLE 2) SAS
Inventor: Romain Coffy , Jean-Michel Riviere
Abstract: A housing for a light source mounted on a substrate, the housing comprising: a barrel having first and second conducting columns; and a diffuser having a through-hole or partial hole filled with a conductive plug, the conductive plug electrically bridging a gap in an electrical connection between the first and second conducting columns.
-
99.
公开(公告)号:US10750188B2
公开(公告)日:2020-08-18
申请号:US16412106
申请日:2019-05-14
Applicant: STMicroelectronics (Grenoble 2) SAS
Inventor: Mariano Bona , Fritz Lebowsky
IPC: H04N19/154 , H04N19/132 , H04N19/196 , H04N19/176 , H04N19/895 , H04N19/182 , H04N19/15 , H04N19/103 , H04N19/593
Abstract: A method is provided for encoding a digital signal as an encoded signal. The method includes performing a plurality of localized encodings of a digital signal to generate a set of encoded local signals. Localized encodings are performed for a first sample of the digital signal. A plurality of physical quantities is assigned to the first sample. The set of encoded local signals includes an encoded local signal associated with each physical quantity of the plurality of physical quantities. The method further includes analyzing a characteristic associated with an encoded signal to determine a measured value of the characteristic. The encoded signal includes the set of encoded local signals. The method also includes adjusting a first encoding parameter associated with the plurality of localized encodings according to the measured value of the characteristic and a target value of the characteristic. The first encoding parameter is adjusted for a second sample of the digital signal. The second sample is processed after the first sample.
-
公开(公告)号:US20200257600A1
公开(公告)日:2020-08-13
申请号:US16787508
申请日:2020-02-11
Applicant: STMicroelectronics (Grenoble 2) SAS
Inventor: Jean CAMIOLO
Abstract: An apparatus is for testing a device to be supplied with power via USB Power Delivery (USB-PD). The apparatus includes at least one USB Type-C connector configured to be connected to the device to be supplied with power to be tested, the at least one USB Type-C connector including a power supply terminal. Processing circuitry of the apparatus is configured to verify that a voltage at the power supply terminal is lower than a first threshold, verify a role of the device, generate requests representative of power supply configurations supported by the role of the device, and verify compatibility of the power supply configurations supported by the device with standardized power supply configurations.
-
-
-
-
-
-
-
-
-