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    Apparatus and method for estimating edge areas of digital image
    91.
    发明授权
    Apparatus and method for estimating edge areas of digital image 失效
    用于估计数字图像边缘区域的装置和方法

    公开(公告)号：US08693777B2

    公开(公告)日：2014-04-08

    申请号：US13091227

    申请日：2011-04-21

    Applicant: Joo Young Ha ,  Won Tae Choi ,  Byung Hyun Kim ,  Bong Soon Kang ,  Won Woo Jang ,  Kyung Rin Kim ,  Jung Joo Yang ,  Gi Dong Lee ,  Kang Joo Kim

    Inventor： Joo Young Ha ,  Won Tae Choi ,  Byung Hyun Kim ,  Bong Soon Kang ,  Won Woo Jang ,  Kyung Rin Kim ,  Jung Joo Yang ,  Gi Dong Lee ,  Kang Joo Kim

    IPC: G06K9/00

    CPC classification number: H04N1/4092 ,  G06T7/13 ,  G06T7/143

    Abstract: There are provided an apparatus and a method for estimating edge areas of pixels in a digital image to thereby prevent an edge sharpening algorithm from being applied to non-edge area of the digital image. Therefore, the apparatus can accurately determine whether each pixel is in an edge area or in a non-edge area, by generating a binary mask obtained by using a luminance difference average between each pixel and each of neighboring pixels in the digital image. Moreover, the determination of an edge-area or a non-edge area may be applied to various digital images, by adjusting a level of edge-area determination.

    Abstract translation: 提供了一种用于估计数字图像中的像素的边缘区域的装置和方法，从而防止边缘锐化算法被应用于数字图像的非边缘区域。 因此，通过生成通过使用数字图像中的每个像素和每个相邻像素之间的亮度差平均而获得的二进制掩码，该装置可以准确地确定每个像素是在边缘区域还是在非边缘区域。 此外，可以通过调整边缘区域确定的水平来将边缘区域或非边缘区域的确定应用于各种数字图像。

    Metal conductor chemical mechanical polish
    92.
    发明授权
    Metal conductor chemical mechanical polish 有权
    金属导体化学机械抛光

    公开(公告)号：US08673783B2

    公开(公告)日：2014-03-18

    申请号：US12829664

    申请日：2010-07-02

    Applicant: Huang Soon Kang ,  Han-Hsin Kuo ,  Chi-Ming Yang ,  Shwang-Ming Jeng ,  Chin-Hsiang Lin

    Inventor： Huang Soon Kang ,  Han-Hsin Kuo ,  Chi-Ming Yang ,  Shwang-Ming Jeng ,  Chin-Hsiang Lin

    IPC: H01L21/302

    CPC classification number: H01L23/5386 ,  H01L21/02074 ,  H01L21/28079 ,  H01L21/67011 ,  H01L21/7684 ,  H01L29/495 ,  H01L29/78 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: The present disclosure provides a method of fabricating a semiconductor device, a semiconductor device fabricated by such a method, and a chemical mechanical polishing (CMP) tool for performing such a method. In one embodiment, a method of fabricating a semiconductor device includes providing an integrated circuit (IC) wafer including a metal conductor in a trench of a dielectric layer over a substrate, and performing a chemical mechanical polishing (CMP) process to planarize the metal conductor and the dielectric layer. The method further includes cleaning the planarized metal conductor and dielectric layer to remove residue from the CMP process, rinsing the cleaned metal conductor and dielectric layer with an alcohol, and drying the rinsed metal conductor and dielectric layer in an inert gas environment.

    Abstract translation: 本公开提供了一种制造半导体器件的方法，通过这种方法制造的半导体器件和用于执行这种方法的化学机械抛光（CMP）工具。 在一个实施例中，制造半导体器件的方法包括在衬底上的电介质层的沟槽中提供包括金属导体的集成电路（IC）晶片，以及执行化学机械抛光（CMP）工艺以平坦化金属导体 和电介质层。 该方法还包括清洁平坦化的金属导体和电介质层以除去CMP工艺中的残留物，用醇漂洗清洁的金属导体和介电层，并在惰性气体环境中干燥漂洗的金属导体和电介质层。

    CMP Groove Depth and Conditioning Disk Monitoring
    94.
    发明申请
    CMP Groove Depth and Conditioning Disk Monitoring 审中-公开
    CMP沟槽深度和调节盘监控

    公开(公告)号：US20130217306A1

    公开(公告)日：2013-08-22

    申请号：US13397845

    申请日：2012-02-16

    Applicant: Jiann Lih Wu ,  Bo-I Lee ,  Soon Kang Huang ,  Chi-Ming Yang ,  Chin-Hsiang Lin

    Inventor： Jiann Lih Wu ,  Bo-I Lee ,  Soon Kang Huang ,  Chi-Ming Yang ,  Chin-Hsiang Lin

    IPC: B24B49/16 ,  B24B49/18

    CPC classification number: B24B49/16 ,  B24B37/005 ,  B24B49/18

    Abstract: Some embodiments relate to a chemical mechanical polishing (CMP) system. The CMP system includes a polishing pad having a polishing surface, and a wafer carrier to retain a wafer proximate to the polishing surface during polishing. A motor assembly rotates the polishing pad and concurrently rotates the wafer during polishing of the wafer. A conditioning disk has a conditioning surface that is in frictional engagement with the polishing surface during polishing. A torque measurement element measures a torque exerted by the motor assembly during polishing. A condition surface analyzer determines a surface condition of the conditioning surface or the polishing surface based on the measured torque. Other systems and methods are also disclosed.

    Abstract translation: 一些实施方案涉及化学机械抛光（CMP）系统。 CMP系统包括具有抛光表面的抛光垫和在抛光期间将晶片保持靠近抛光表面的晶片载体。 电机组件旋转抛光垫并在晶片抛光期间同时旋转晶片。 调理盘具有在抛光期间与抛光表面摩擦接合的调节表面。 扭矩测量元件测量在抛光期间由电动机组件施加的扭矩。 条件表面分析器基于测量的扭矩来确定调节表面或抛光表面的表面状态。 还公开了其它系统和方法。

    CMP Pad Cleaning Apparatus
    95.
    发明申请
    CMP Pad Cleaning Apparatus 有权
    CMP垫清洁装置

    公开(公告)号：US20130210323A1

    公开(公告)日：2013-08-15

    申请号：US13396854

    申请日：2012-02-15

    Applicant: Jiann Lih Wu ,  Bo-I Lee ,  Soon Kang Huang ,  Chi-Ming Yang ,  Chin-Hsiang Lin

    Inventor： Jiann Lih Wu ,  Bo-I Lee ,  Soon Kang Huang ,  Chi-Ming Yang ,  Chin-Hsiang Lin

    IPC: B24B1/00 ,  B24B41/06

    CPC classification number: B24B53/017

    Abstract: The present disclosure relates to a two-phase cleaning element that enhances polishing pad cleaning so as to prevent wafer scratches and contamination in chemical mechanical polishing (CMP) processes. In some embodiments, the two-phase pad cleaning element comprises a first cleaning element and a second cleaning element configured to successively operate upon a section of a CMP polishing pad. The first cleaning element comprises a megasonic cleaning jet configured to utilize cavitation energy to dislodge particles embedded in the CMP polishing pad without damaging the surface of the polishing pad. The second cleaning element is configured to apply a high pressure mist, comprising two fluids, to remove by-products from the CMP polishing pad. By using megasonic cleaning to dislodge embedded particles a two-fluid mist to flush away by-products (e.g., including the dislodged embedded particles), the two-phase pad cleaning element enhances polishing pad cleaning.

    Abstract translation: 本公开内容涉及增强抛光垫清洁以防止晶片划伤和化学机械抛光（CMP）工艺中的污染的两相清洁元件。 在一些实施例中，两相垫清洁元件包括第一清洁元件和第二清洁元件，其被配置为在CMP抛光垫的一部分上连续操作。 第一清洁元件包括配置为利用空穴能量去除嵌入在CMP抛光垫中的颗粒而不损坏抛光垫的表面的兆声波清洗喷嘴。 第二清洁元件构造成施加包括两种流体的高压雾以从CMP抛光垫移除副产物。 通过使用兆声波清洗来移除嵌入式颗粒的双液雾以冲走副产物（例如，包括移出的嵌入颗粒），两相垫清洁元件增强了抛光垫清洁。

    NETWORK BANDWIDTH DISTRIBUTION DEVICE AND METHOD THEREOF
    97.
    发明申请
    NETWORK BANDWIDTH DISTRIBUTION DEVICE AND METHOD THEREOF 审中-公开
    网络带宽分配设备及其方法

    公开(公告)号：US20130166733A1

    公开(公告)日：2013-06-27

    申请号：US13619913

    申请日：2012-09-14

    Applicant: Kyoung-Soon KANG ,  Hak Suh KIM ,  Ki Cheol JEON ,  Hyeonsik YOON ,  Boo Geum JUNG ,  Hea Sook PARK

    Inventor： Kyoung-Soon KANG ,  Hak Suh KIM ,  Ki Cheol JEON ,  Hyeonsik YOON ,  Boo Geum JUNG ,  Hea Sook PARK

    IPC: G06F15/173

    CPC classification number: H04L41/0896 ,  H04L41/5019 ,  H04L43/16 ,  H04L47/20

    Abstract: Disclosed is a network bandwidth distribution device which includes an information collector which collects information associated with a connection environment; a controller which judges a state of a connection environment according to the collected information and collects information of each user to judge whether an occupied bandwidth of each user is exceeded; and a bandwidth allotter which limits an occupied bandwidth of each user based on the judged state of a connection environment and whether an occupied bandwidth of each user is exceeded.

    Abstract translation: 公开了一种网络带宽分配装置，其包括收集与连接环境相关联的信息的信息收集器; 控制器，根据所收集的信息判断连接环境的状态，并收集每个用户的信息，判断是否超过了每个用户的占用带宽; 以及带宽分配器，其基于所判断的连接环境的状态以及是否超过每个用户的占用带宽来限制每个用户的占用带宽。

    Slurry dispenser for chemical mechanical polishing (CMP) apparatus and method
    99.
    发明授权
    Slurry dispenser for chemical mechanical polishing (CMP) apparatus and method 有权
    用于化学机械抛光（CMP）设备和方法的浆料分配器

    公开(公告)号：US08277286B2

    公开(公告)日：2012-10-02

    申请号：US12370662

    申请日：2009-02-13

    Applicant: Kun-Ku Hung ,  Zin-Chang Wei ,  Huang Soon Kang ,  Chyi-Shyuan Chern

    Inventor： Kun-Ku Hung ,  Zin-Chang Wei ,  Huang Soon Kang ,  Chyi-Shyuan Chern

    IPC: B24B1/00 ,  B24B57/02 ,  B24B29/00

    CPC classification number: B24B57/02 ,  B24B37/04

    Abstract: A chemical mechanical polishing method and apparatus provides a deformable, telescoping slurry dispenser arm coupled to a dispenser head that may be arcuate in shape and may also be a bendable telescoping member that can be adjusted to vary the number of slurry dispenser ports and the degree of curvature of the dispenser head. The dispenser arm may additionally include slurry dispenser ports therein. The dispenser arm may advantageously be formed of a plurality of nested tubes that are slidable with respect to one another. The adjustable dispenser arm may pivot about a pivot point and can be variously positioned to accommodate different sized polishing pads used to polish substrates of different dimensions and the bendable, telescoping slurry dispenser arm and dispenser head provide uniform slurry distribution to any of various wafer polishing locations, effective slurry usage and uniform polishing profiles in each case.

    Abstract translation: 化学机械抛光方法和装置提供了可变形的，可伸缩的浆料分配器臂，其联接到分配器头部，其可以是弓形的形状，并且还可以是可弯曲的伸缩构件，其可以被调节以改变浆料分配器端口的数量和 分配头的曲率。 分配器臂可以另外包括其中的浆料分配器端口。 分配器臂可以有利地由可相对于彼此滑动的多个嵌套管形成。 可调节的分配器臂可围绕枢转点枢转并且可以被不同地定位以适应用于抛光不同尺寸的基板的不同尺寸的抛光垫，并且可弯曲的可伸缩浆料分配器臂和分配器头部向各种晶片抛光位置 ，有效的浆料使用和均匀的抛光轮廓在每种情况下。

    APPARATUS FOR IMPROVING SHARPNESS OF IMAGE
    100.
    发明申请
    APPARATUS FOR IMPROVING SHARPNESS OF IMAGE 失效
    改善图像锐度的装置

    公开(公告)号：US20120033885A1

    公开(公告)日：2012-02-09

    申请号：US13092438

    申请日：2011-04-22

    Applicant: Joo Young HA ,  Won Tae CHOI ,  Bong Soon KANG ,  Byung Hyun KIM ,  Joo Hyun KIM ,  Sun Mi SIN ,  Won Woo JANG ,  Hak Yong HAN ,  Gi Dong LEE

    Inventor： Joo Young HA ,  Won Tae CHOI ,  Bong Soon KANG ,  Byung Hyun KIM ,  Joo Hyun KIM ,  Sun Mi SIN ,  Won Woo JANG ,  Hak Yong HAN ,  Gi Dong LEE

    IPC: G06K9/40 ,  G06K9/00

    CPC classification number: G06T5/003 ,  G06T7/13 ,  G06T2207/20192

    Abstract: There is provided an apparatus for improving the sharpness of an image, which may prevent occurrence of distortion of an image in an edge enhancement process of the image by applying an active weight in accordance with a two-dimensional (2D) high pass filtering value of the image. The apparatus may include: a 2D high pass filter outputting a high frequency element value for the luminance values of pixels of an input image; a weight generating unit generating a weight changed depending on a magnitude of the high frequency element value; a weight applying unit applying the weight to the high frequency element value; and an edge enhancement image generating unit adding, to the luminance values of the pixels of the input image, the high frequency element value to which the weight is applied to thereby output an image of which an edge is enhanced.

    Abstract translation: 提供了一种用于提高图像的清晰度的装置，其可以通过根据二维（2D）高通滤波值施加有效权重来防止图像的边缘增强处理中的图像失真的发生 图片。 所述装置可以包括：输出用于输入图像的像素的亮度值的高频元素值的2D高通滤波器; 权重生成单元，生成根据高频元素值的大小而变化的权重; 加权单元，将所述权重应用于所述高频元素值; 以及边缘增强图像生成单元，对输入图像的像素的亮度值加上加权的高频单元值，从而输出边缘增强的图像。

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