公开(公告)号：US07484886B2

公开(公告)日：2009-02-03

申请号：US11381427

申请日：2006-05-03

申请人： William F. Clark, Jr. ,  Edward J. Nowak

发明人： William F. Clark, Jr. ,  Edward J. Nowak

IPC分类号： G01K7/01

CPC分类号： G01K7/015 ,  G01K7/22 ,  G01K15/00

摘要： Disclosed are embodiments of an improved on-chip temperature sensing circuit, based on bolometry, which provides self calibration of the on-chip temperature sensors for ideality and an associated method of sensing temperature at a specific on-chip location. The circuit comprises a temperature sensor, an identical reference sensor with a thermally coupled heater and a comparator. The comparator is adapted to receive and compare the outputs from both the temperature and reference sensors and to drive the heater with current until the outputs match. Based on the current forced into the heater, the temperature rise of the reference sensor can be calculated, which in this state, is equal to that of the temperature sensor.

摘要翻译： 公开了一种改进的片上温度感测电路的实施例，其基于速率测量，其提供用于理想的片上温度传感器的自校准以及在特定片上位置处感测温度的相关联的方法。 该电路包括温度传感器，具有热耦合加热器的相同参考传感器和比较器。 比较器适用于接收和比较来自温度和参考传感器的输出，并用电流驱动加热器直到输出匹配。 基于被迫进入加热器的电流，可以计算参考传感器的温度上升，在该状态下，其温度上升等于温度传感器的温升。

公开(公告)号：US07312502B2

公开(公告)日：2007-12-25

申请号：US11427031

申请日：2006-06-28

申请人： William F. Clark, Jr. ,  Edward J. Nowak

发明人： William F. Clark, Jr. ,  Edward J. Nowak

IPC分类号： H01L31/0392

CPC分类号： H01L29/785 ,  H01L21/845 ,  H01L27/1211 ,  H01L29/66795 ,  H01L29/66818

摘要： Disclosed is a method and structure for a fin-type field effect transistor (FinFET) structure that has different thickness gate dielectrics covering the fins extending from the substrate. These fins have a central channel region and source and drain regions on opposite sides of the channel region. The thicker gate dielectrics can comprise multiple layers of dielectric and the thinner gate dielectrics can comprise less layers of dielectric. A cap comprising a different material than the gate dielectrics can be positioned over the fins.

摘要翻译： 公开了一种鳍式场效应晶体管（FinFET）结构的方法和结构，其具有覆盖从衬底延伸的翅片的不同厚度的栅极电介质。 这些翅片在通道区域的相对侧具有中心通道区域和源极和漏极区域。 较厚的栅极电介质可以包括多层电介质，较薄的栅极电介质可以包含更少的电介质层。 包括与栅极电介质不同的材料的盖可以位于鳍片上方。

公开(公告)号：US06943405B2

公开(公告)日：2005-09-13

申请号：US10604206

申请日：2003-07-01

申请人： Andres Bryant ,  William F. Clark, Jr. ,  David M. Fried ,  Mark D. Jaffe ,  Edward J. Nowak ,  John J. Pekarik ,  Christopher S. Putnam

发明人： Andres Bryant ,  William F. Clark, Jr. ,  David M. Fried ,  Mark D. Jaffe ,  Edward J. Nowak ,  John J. Pekarik ,  Christopher S. Putnam

IPC分类号： H01L21/308 ,  H01L21/336 ,  H01L21/84 ,  H01L27/12 ,  H01L29/786 ,  H01L21/00 ,  H01L29/76

CPC分类号： H01L21/84 ,  H01L21/3086 ,  H01L21/3088 ,  H01L21/823821 ,  H01L27/1203 ,  H01L29/66795 ,  H01L29/785 ,  Y10S438/947

摘要： A method and structure for an integrated circuit structure that utilizes complementary fin-type field effect transistors (FinFETs) is disclosed. The invention has a first-type of FinFET which includes a first fin, and a second-type of FinFET which includes a second fin running parallel to the first fin. The invention also has an insulator fin positioned between the source/drain regions of the first first-type of FinFET and the second-type of FinFET. The insulator fin has approximately the same width dimensions as the first fin and the second fin, such that the spacing between the first-type of FinFET and the second-type of FinFET is approximately equal to the width of one fin. The invention also has a common gate formed over channel regions of the first-type of FinFET and the second-type of FinFET. The gate includes a first impurity doping region adjacent the first-type of FinFET and a second impurity doping region adjacent the second-type of FinFET. The differences between the first impurity doping region and the second impurity doping region provide the gate with different work functions related to differences between the first-type of FinFET and the second-type of FinFET. The first fin and the second fin have approximately the same width.

摘要翻译： 公开了利用互补翅片型场效应晶体管（FinFET）的集成电路结构的方法和结构。 本发明具有包括第一鳍片的第一类型的FinFET和包括与第一鳍片平行的第二鳍片的第二类型的FinFET。 本发明还具有位于第一第一类型FinFET的源极/漏极区域和第二类型FinFET之间的绝缘体鳍片。 绝缘体鳍片具有与第一鳍片和第二鳍片大致相同的宽度尺寸，使得第一类型的FinFET和第二类型的FinFET之间的间隔大致等于一个鳍片的宽度。 本发明还具有形成在第一类型FinFET和第二类型FinFET的沟道区上的公共栅极。 栅极包括与第一类型的FinFET相邻的第一杂质掺杂区域和与第二类型的FinFET相邻的第二杂质掺杂区域。 第一杂质掺杂区域和第二杂质掺杂区域之间的差异为栅极提供与第一类型FinFET和第二类型FinFET之间的差异有关的不同功函数。 第一鳍片和第二鳍片具有大致相同的宽度。

公开(公告)号：US06664150B2

公开(公告)日：2003-12-16

申请号：US10205528

申请日：2002-07-25

申请人： William F. Clark, Jr. ,  Edward J. Nowak ,  Jed H. Rankin ,  Minh H. Tong

发明人： William F. Clark, Jr. ,  Edward J. Nowak ,  Jed H. Rankin ,  Minh H. Tong

IPC分类号： H01L2100

CPC分类号： H01L29/66772 ,  H01L21/743 ,  H01L29/66545 ,  H01L29/78612 ,  H01L29/78618 ,  Y10S148/077 ,  Y10S148/15

摘要： A semiconductor device fabricated on a silicon-on-insulator substrate and having an active well scheme as well as methods, including a non-self-aligned and self-aligned, of fabricating such a device are disclosed herein. The semiconductor device includes field effect transistor 124 comprising at least body region 127 and diffusion regions 132; buried interconnect plane 122 optionally self-aligned to diffusion regions 132 and in contact with body region 127; isolation oxide region 118 between diffusion regions 132 and buried interconnect plane 122; and buried oxide layer 104 present beneath buried interconnect plane 122.