Abstract:
A method is provided for fabricating a thin-film transistor (TFT). The method includes forming a semiconductor layer over a gate insulator that covers a gate electrode, and depositing an insulator layer over the semiconductor layer, as well as etching the insulator layer to form a patterned etch-stop without losing the gate insulator. The method also includes forming a source electrode and a drain electrode over the semiconductor layer and the patterned etch-stop. The method further includes removing a portion of the semiconductor layer beyond the source electrode and the drain electrode such that a remaining portion of the semiconductor layer covers the gate insulator in a first overlapping area of the source electrode and the gate electrode and a second overlapping area of the drain electrode and gate electrode.
Abstract:
An electronic device may include a display having an array of display pixels on a substrate. The display pixels may be organic light-emitting diode display pixels or display pixels in a liquid crystal display. In an organic light-emitting diode display, hybrid thin-film transistor structures may be formed that include semiconducting oxide thin-film transistors, silicon thin-film transistors, and capacitor structures. The capacitor structures may overlap the semiconducting oxide thin-film transistors. Organic light-emitting diode display pixels may have combinations of oxide and silicon transistors. In a liquid crystal display, display driver circuitry may include silicon thin-film transistor circuitry and display pixels may be based on oxide thin-film transistors. A single layer or two different layers of gate metal may be used in forming silicon transistor gates and oxide transistor gates. A silicon transistor may have a gate that overlaps a floating gate structure.
Abstract:
Embodiments of the present disclosure relate to display devices and methods for manufacturing display devices. Specifically, embodiments of the present disclosure employ an enhanced etching process to create uniformity in the gate insulator of thin-film-transistor (TFTs) by using an active layer to protect the gate insulator from inadvertent etching while patterning an etch stop layer.
Abstract:
A TFT stack for a liquid crystal display is provided. The TFT stack includes a silicon layer that includes a heavily doped region, a non-doped region, and a lightly doped region between the heavily doped region and the non-doped region. The heavily doped region is hydrogenated. The TFT stack also includes an insulation layer that includes a first portion formed over the lightly doped region and a second portion disposed over the non-doped region and a gate metal electrode layer formed over the second portion of the non-doped region. The TFT stack also includes a first dielectric layer disposed over the gate metal electrode and over the first portion of the insulation layer. The heavily doped region is hydrogenated to reduce the dependence of the capacitance between the gate metal electrode and the conductive layer Cgd upon a bias voltage being applied between the gate metal electrode and the conductive layer.
Abstract:
A method is provided for fabricating a thin-film transistor (TFT). The method includes forming a semiconductor layer over a gate insulator that covers a gate electrode, and depositing an insulator layer over the semiconductor layer, as well as etching the insulator layer to form a patterned etch-stop without losing the gate insulator. The method also includes forming a source electrode and a drain electrode over the semiconductor layer and the patterned etch-stop. The method further includes removing a portion of the semiconductor layer beyond the source electrode and the drain electrode such that a remaining portion of the semiconductor layer covers the gate insulator in a first overlapping area of the source electrode and the gate electrode and a second overlapping area of the drain electrode and gate electrode.
Abstract:
Gate line driver circuitry applies an output pulse to each of several gate lines for a display element array. The circuitry has a number of gate drivers each being coupled to drive a respective one of the gate lines. Each of the gate drivers has an output stage in which a high side transistor and a low side transistor are coupled to drive the respective gate line, responsive to at least one clock signal. A pull down transistor is coupled to discharge a control electrode of the output stage. A control circuit having a cascode amplifier is coupled to drive the pull down transistor as a function of a) at least one clock signal and b) feedback from the control electrode. Other embodiments are also described and claimed.
Abstract:
Display ground plane structures may contain slits. Image pixel electrodes in the display may be arranged in rows and columns. Image pixels in the display may be controlled using gate lines that are associated with the rows and data lines that are associated with the columns. An electric field may be produced by each image pixel electrode that extends through a liquid crystal layer to an associated portion of the ground plane. The slits in the ground plane may have a slit width. Data lines may be located sufficiently below the ground plane and sufficiently out of alignment with the slits to minimize crosstalk from parasitic electric fields. A three-column inversion scheme may be used when driving data line signals into the display, so that pairs of pixels that straddle the slits are each driven with a common polarity. Gate line scanning patterns may be used that enhance display uniformity.