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    SYSTEM AND METHOD FOR SENSOR RECALIBRATION
    91.
    发明申请
    SYSTEM AND METHOD FOR SENSOR RECALIBRATION 有权
    用于传感器回波的系统和方法

    公开(公告)号：US20080039822A1

    公开(公告)日：2008-02-14

    申请号：US11843601

    申请日：2007-08-22

    申请人： Yanan Zhang ,  Lu Wang ,  Rajiv Shah

    发明人： Yanan Zhang ,  Lu Wang ,  Rajiv Shah

    IPC分类号： A61M37/00

    CPC分类号： A61B5/1486 ,  A61B5/1495 ,  A61B5/4839 ,  G06F19/00

    摘要： An implantable sensing system that includes a sensor for sensing a biological parameter, a processor connected to the sensor for processing the parameter and a drug delivery unit connected to the processor for responding to the processor based on the parameter. The processor is programnmed to adjust an output of the sensor by compiling an array of data relating to the sensor, adjusting a sensor parameter a first time based on data in the array, adjusting a curve representing the sensor output based on data in the array and adjusting the sensor parameter a second time based on data in the array.

    摘要翻译： 一种可植入感测系统，其包括用于感测生物参数的传感器，连接到所述传感器以用于处理所述参数的处理器以及连接到所述处理器的药物输送单元，以基于所述参数响应所述处理器。 处理器被编程以通过编译与传感器相关的数据阵列来调节传感器的输出，基于阵列中的数据首次调整传感器参数，基于阵列中的数据调整表示传感器输出的曲线，以及 基于阵列中的数据再次调整传感器参数。

    MULTILAYER SUBSTRATE
    92.
    发明申请
    MULTILAYER SUBSTRATE 有权
    多层基板

    公开(公告)号：US20080026592A1

    公开(公告)日：2008-01-31

    申请号：US11868898

    申请日：2007-10-08

    申请人： Rajiv Shah ,  Shaun Pendo ,  Edward Babiracki

    发明人： Rajiv Shah ,  Shaun Pendo ,  Edward Babiracki

    IPC分类号： H01L21/02

    CPC分类号： H01L21/4857 ,  H01L2924/0002 ,  H05K1/092 ,  H05K3/4061 ,  H05K3/4647 ,  H05K3/4667 ,  H05K3/467 ,  H05K2201/0179 ,  H05K2203/0278 ,  H01L2924/00

    摘要： A multilayer substrate device formed from a base substrate and alternating metalization layers and dielectric layers. Each layer is formed without firing. Vias may extend through one of the dielectric layers such that two metalization layers surrounding the dielectric layers make contact with each other. The vias may be formed by placing pillars on top of a metalization layer, forming a dielectric layer on top of the metalization layer and surrounding the pillars, and removing the pillars. Dielectric layers may be followed by other dielectric layers and metalization layers may be followed by other metalization layers. Vias in the substrate may be filled by forming an assembly around the substrate, the assembly including printing sheets containing a conductive ink and pressure plates for applying pressure. A vacuum may be applied to remove air in the ink. Pressure may then be applied to the printing sheets through the pressure plates. The conductive ink in the printing sheets is pushed through the vias when pressure is applied by the pressure plates.

    摘要翻译： 由基底基板和交替的金属化层和电介质层形成的多层衬底器件。 每层形成而不烧制。 通孔可以延伸穿过介电层之一，使得围绕电介质层的两个金属化层彼此接触。 可以通过将金属化层顶部放置柱子形成通孔，在金属化层的顶部上形成电介质层并围绕柱子，并移除支柱。 电介质层之后可以是其它电介质层，金属化层之后可以是其它金属化层。 可以通过在基板周围形成组件来填充基板中的通孔，该组件包括含有导电油墨的印刷纸和用于施加压力的压力板。 可以施加真空以除去油墨中的空气。 然后可以通过压力板将压力施加到印刷纸上。 当通过压力板施加压力时，打印纸中的导电油墨被推过通孔。

    Multilayer substrate
    93.
    发明授权
    Multilayer substrate 有权
    多层基板

    公开(公告)号：US07297627B2

    公开(公告)日：2007-11-20

    申请号：US10845002

    申请日：2004-05-12

    申请人： Rajiv Shah ,  Shaun Pendo ,  Edward G. Babiricki

    发明人： Rajiv Shah ,  Shaun Pendo ,  Edward G. Babiricki

    IPC分类号： H01L21/4763

    CPC分类号： H01L21/4857 ,  H01L2924/0002 ,  H05K1/092 ,  H05K3/4061 ,  H05K3/4647 ,  H05K3/4667 ,  H05K3/467 ,  H05K2201/0179 ,  H05K2203/0278 ,  H01L2924/00

    摘要： A multilayer substrate device formed from a base substrate and alternating metalization layers and dielectric layers. Each layer is formed without firing. Vias may extend through one of the dielectric layers such that two metalization layers surrounding the dielectric layers make. contact with each other. The vias may be formed by placing pillars on top of a metalization layer, forming a dielectric layer on top of the metalization layer and surrounding the pillars, and removing the pillars. Dielectric layers may be followed by other dielectric layers and metalization layers may be followed by other metalization layers. Vias in the substrate may be filled by forming an assembly around the substrate, the assembly including printing sheets containing a conductive ink and pressure plates for applying pressure. A vacuum may be applied to remove air in the ink. Pressure may then be applied to the printing sheets through the pressure plates. The conductive ink in the printing sheets is pushed through the vias when pressure is applied by the pressure plates.

    摘要翻译： 由基底基板和交替的金属化层和电介质层形成的多层衬底器件。 每层形成而不烧制。 通孔可以延伸穿过介电层之一，使得包围电介质层的两个金属化层形成。 互相接触。 可以通过将金属化层顶部放置柱子形成通孔，在金属化层的顶部上形成电介质层并围绕柱子，并移除支柱。 电介质层之后可以是其它电介质层，金属化层之后可以是其它金属化层。 可以通过在基板周围形成组件来填充基板中的通孔，该组件包括含有导电油墨的印刷纸和用于施加压力的压力板。 可以施加真空以除去油墨中的空气。 然后可以通过压力板将压力施加到印刷纸上。 当通过压力板施加压力时，打印纸中的导电油墨被推过通孔。

    Substrate sensor
    95.
    发明授权
    Substrate sensor 有权
    基板传感器

    公开(公告)号：US06498043B1

    公开(公告)日：2002-12-24

    申请号：US09718782

    申请日：2000-11-22

    申请人： Joseph H. Schulman ,  Charles L. Byers ,  John C. Gord ,  Rajiv Shah ,  Lyle Dean Canfield

    发明人： Joseph H. Schulman ,  Charles L. Byers ,  John C. Gord ,  Rajiv Shah ,  Lyle Dean Canfield

    IPC分类号： H01L2100

    CPC分类号： A61N1/36585 ,  A61B5/0031 ,  A61B5/14532 ,  A61B5/14546 ,  A61B5/14865 ,  A61B5/4839 ,  A61B2560/0219 ,  A61M5/1723 ,  A61N1/05 ,  A61N1/372 ,  A61N1/3754 ,  H01L23/3107 ,  H01L29/0657 ,  H01L2924/0002 ,  H01L2924/19041 ,  H01L2924/00

    摘要： An implantable substrate sensor has electronic circuitry and electrodes formed on opposite sides of a substrate. A protective coating covers the substrate, effectively hermetically sealing the electronic circuitry under the coating. Exposed areas of the electrodes are selectively left uncovered by the protective coating, thereby allowing such electrodes to be exposed to body tissue and fluids when the sensor is implanted in living tissue. The substrate on which the electronic circuitry and electrodes are formed is the same substrate or “chip” on which an integrated circuit (IC) is formed, which integrated circuit contains the desired electronic circuitry. Such approach eliminates the need for an hermetically sealed lid or cover to cover hybrid electronic circuitry, and allows the sensor to be made much thinner than would otherwise be possible. In one embodiment, two such substrate sensors may be placed back-to-back, with the electrodes facing outward. As required, capacitors that form part of the sensor's electronic circuits are formed on the substrate by placing metalization layers and a dielectric in vacant areas of the substrate surface.

    摘要翻译： 可植入衬底传感器具有形成在衬底的相对侧上的电子电路和电极。 保护涂层覆盖基材，有效地气密地密封涂层下的电子电路。 电极的暴露区域选择性地被保护涂层覆盖，从而当传感器植入生物体组织时允许这样的电极暴露于身体组织和流体。 其上形成有电子电路和电极的基板是形成有集成电路（IC）的相同的基板或“芯片”，该集成电路包含所需的电子电路。 这种方法消除了密封的盖或盖以覆盖混合电子电路的需要，并且允许传感器制造得比其他可能的薄得多。 在一个实施例中，两个这样的衬底传感器可以背对背放置，电极面向外。 根据需要，通过将金属化层和电介质放置在基板表面的空的区域中，形成在传感器的电子电路的一部分的电容器。

    Implantable substrate sensor
    96.
    发明授权
    Implantable substrate sensor 失效
    可植入基片传感器

    公开(公告)号：US06259937B1

    公开(公告)日：2001-07-10

    申请号：US09100310

    申请日：1998-06-19

    申请人： Joseph H. Schulman ,  Charles L. Byers ,  John C. Gord ,  Rajiv Shah ,  Lyle Dean Canfield

    发明人： Joseph H. Schulman ,  Charles L. Byers ,  John C. Gord ,  Rajiv Shah ,  Lyle Dean Canfield

    IPC分类号： A61N105

    CPC分类号： A61N1/36585 ,  A61B5/0031 ,  A61B5/14532 ,  A61B5/14546 ,  A61B5/14865 ,  A61B5/4839 ,  A61B2560/0219 ,  A61M5/1723 ,  A61N1/05 ,  A61N1/372 ,  A61N1/3754 ,  H01L23/3107 ,  H01L29/0657 ,  H01L2924/0002 ,  H01L2924/19041 ,  H01L2924/00

    摘要： An implantable substrate sensor has electronic circuitry and electrodes formed on opposite sides of a substrate. A protective coating covers the substrate, effectively hermetically sealing the electronic circuitry under the coating. Exposed areas of the electrodes are selectively left uncovered by the protective coating, thereby allowing such electrodes to be exposed to body tissue and fluids when the sensor is implanted in living tissue. The substrate on which the electronic circuitry and electrodes are formed is the same substrate or “chip” on which an integrated circuit (IC) is formed, which integrated circuit contains the desired electronic circuitry. Such approach eliminates the need for an hermetically sealed lid or cover to cover hybrid electronic circuitry, and allows the sensor to be made much thinner than would otherwise be possible. In one embodiment, two such substrate sensors may be placed back-to-back, with the electrodes facing outward. As required, capacitors that form part of the sensor's electronic circuits are formed on the substrate by placing metalization layers and a dielectric in vacant areas of the substrate surface.

    摘要翻译： 可植入衬底传感器具有形成在衬底的相对侧上的电子电路和电极。 保护涂层覆盖基材，有效地气密地密封涂层下的电子电路。 电极的暴露区域选择性地被保护涂层覆盖，从而当传感器植入生物体组织时允许这样的电极暴露于身体组织和流体。 其上形成有电子电路和电极的基板是与其上形成有集成电路（IC）的相同的基板或“芯片”，该集成电路包含所需的电子电路。 这种方法消除了密封的盖或盖以覆盖混合电子电路的需要，并且允许传感器制造得比其他可能的薄得多。 在一个实施例中，两个这样的衬底传感器可以背对背放置，电极面向外。 根据需要，通过将金属化层和电介质放置在基板表面的空的区域中，形成在传感器的电子电路的一部分的电容器。

    Implantable enzyme-based monitoring systems adapted for long term use
    97.
    发明授权
    Implantable enzyme-based monitoring systems adapted for long term use 失效
    适用于长期使用的基于植入式酶的监测系统

    公开(公告)号：US6081736A

    公开(公告)日：2000-06-27

    申请号：US953817

    申请日：1997-10-20

    申请人： Michael S. Colvin ,  Joseph H. Schulman ,  Lyle Dean Canfield ,  Rajiv Shah

    发明人： Michael S. Colvin ,  Joseph H. Schulman ,  Lyle Dean Canfield ,  Rajiv Shah

    IPC分类号： A61B5/00

    CPC分类号： A61B5/14865 ,  A61B5/0031

    摘要： Improved implantable monitoring systems suitable for long-term in vivo use to measure the concentration of one or more prescribed substances, such as glucose are described herein. In particular, an implantable enzyme-based glucose monitoring system is described that includes at least one of the following: means for replenishing the enzyme solution as it is consumed by the enzymatic reaction; means for replenishing the electrolyte solution bathing the electrode assembly; and microprocessing means proximal the electrode assembly. In preferred embodiments a microprocessor assembly is hermetically associated with the substrate to which the electrode assembly is affixed. Further, the monitoring systems employ one or more reservoir systems in fluid communication with enzyme and electrolyte chambers wherein the enzyme and electrolyte solutions are used. In a further embodiment, the monitoring systems use enzyme and electrolyte reservoir bulbs in fluid communication with the enzyme and electrolyte reservoirs, respectively, and positioned near the skin surface, thereby providing ready access to the enzyme and electrolyte solutions without the need for explantation of the device. Further provided herein is an enzyme solution including microspheres in association with the enzyme; whereby the enzyme is immobilized by the microspheres and the microspheres are in a fluid, flowable solution. Also provided herein is a method of extending the useful life of an implantable enzyme-based monitoring system, which method includes providing means, within the system, to replenish the enzyme and/or electrolyte solution.

    摘要翻译： 本文描述了适于长期体内使用的改进的可植入监测系统以测量一种或多种规定物质如葡萄糖的浓度。 特别地，描述了可植入酶的葡萄糖监测系统，其包括以下至少一个：用于在酶反应消耗的时候补充酶溶液的装置; 用于补充洗涤电极组件的电解液的装置; 并且微处理装置近似于电极组件。 在优选实施例中，微处理器组件与固定电极组件的基底密封相关。 此外，监测系统采用与酶和电解质室流体连通的一个或多个储存器系统，其中使用酶和电解质溶液。 在另一个实施方案中，监测系统使用分别与酶和电解质储存器流体连通并且定位在皮肤表面附近的酶和电解质储存器灯泡，从而提供对酶和电解质溶液的准备进入，而不需要移除 设备。 本文还提供了包含与酶结合的微球的酶溶液; 由此通过微球固定酶，并且微球体处于流动的可流动溶液中。 本文还提供了延长可植入酶的监测系统的使用寿命的方法，该方法包括在系统内提供补充酶和/或电解质溶液的装置。

    Analyte Sensor
    98.
    发明申请
    Analyte Sensor 审中-公开

    公开(公告)号：US20200146596A1

    公开(公告)日：2020-05-14

    申请号：US16625884

    申请日：2018-06-22

    申请人： Rajiv Shah ,  Bradley Liang ,  Katherine Wolfe ,  Ellen Messer ,  Shaun Pendo ,  PERCUSENNE

    发明人： Rajiv Shah ,  Bradley Liang ,  Katherine Wolfe ,  Ellen Messer ,  Shaun Pendo

    IPC分类号： A61B5/1486 ,  A61B5/00 ,  G01N33/50

    摘要： An electrode measuring the presence of an analyte is described as one embodiment. The electrode includes a working conductor with an electrode reactive surface and a first reactive chemistry that is responsive to the analyte. The electrode further includes a first transport material that enables flux of the first analyte to the first reactive chemistry and a second transport material that supplies a reactant to the first reactive chemistry. Wherein the first reactive chemistry does not contact the electrode reactive surface while at least partially shadowing a portion of the electrode reactive surface.

    Methods and materials for stabilizing analyte sensors
    99.
    发明授权
    Methods and materials for stabilizing analyte sensors 有权
    用于稳定分析物传感器的方法和材料

    公开(公告)号：US09492111B2

    公开(公告)日：2016-11-15

    申请号：US11493054

    申请日：2006-07-26

    申请人： Rajiv Shah ,  Gopikrishnan Soundararajan ,  Nannette M. Van Antwerp ,  Barry Pham

    发明人： Rajiv Shah ,  Udo Hoss ,  Gopikrishnan Soundararajan ,  Nannette M. Van Antwerp ,  Barry Pham

    IPC分类号： A61B5/00 ,  A61B5/1486 ,  A61B5/145

    CPC分类号： A61B5/14865 ,  A61B5/14532 ,  A61B5/6849

    摘要： The disclosure provides a sensor including a sensor having an external surface and a cannula. The cannula comprises a substantially cylindrical wall encircling a lumen, at least one aperture and a distal end. The sensor is positioned within the lumen and the distal end of the cannula extends beyond the sensor. This configuration functions for example to stabilize chemical reactions associated with the sensor by creating a buffer zone between the sensor and the surrounding tissues at the site of implantation. In certain embodiments, the sensor can further comprise an accessory material in proximity to the external surface, wherein the accessory material modifies the biological response of a tissue that is in contact with the sensor. The sensor can also comprise anchors that keeps the sensor in contact with subcutaneous tissue of a subject upon insertion of the sensor into the body of the subject.

    摘要翻译： 本公开提供了一种传感器，其包括具有外表面和插管的传感器。 套管包括围绕内腔，至少一个孔和远端的基本上圆柱形的壁。 传感器位于内腔内，套管的远端延伸超过传感器。 该配置用于例如通过在植入位置处在传感器和周围组织之间产生缓冲区来稳定与传感器相关的化学反应。 在某些实施例中，传感器还可包括邻近外表面的辅助材料，其中辅助材料改变与传感器接触的组织的生物反应。 传感器还可以包括锚固件，当将传感器插入到受试者的身体中时，保持传感器与受试者的皮下组织接触。