Abstract:
A rack system for a server includes a number of server units, which includes first to the third sets of server units, voltage converter, first to third power supply circuits. The voltage converter receives and converters a three-phase alternating current (AC) power signal to provide first to third single-phase power signals. The first to the third sets of power supply circuits respectively provides first to third direct current (DC) power signals according to the first to the third single-phase power signals. The first set to the third set of server units is respectively powered by first to the third DC power signals or respectively powered by first part, second part, and third part of the first to the third DC power signals.
Abstract:
A magnetic module includes a magnetic element and a base. The magnetic element includes a conductive assembly and a magnetic core assembly. The conductive assembly includes a plurality of terminals. The magnetic core assembly is partially embedded within the conductive assembly. The base includes a base body and a plurality of conductive structures. The base body has a first surface, wherein the magnetic element is disposed on the first surface. The conductive structures are disposed on the base body and engaged with the plurality of terminals, so that the plurality of terminals are fixed by and electrically connected with the plurality of conductive structures, respectively.
Abstract:
A heat dissipation device assembly structure includes a heat dissipation unit and at least one fastening member. The heat dissipation unit has a bottom face and a locating section. The locating section is formed with at least one channel in communication with the bottom face. The fastening member is assembled on the bottom face. The fastening member has at least one latch section correspondingly inserted in the locating section. The fastening member further has at least one locking section on one side of the fastening member, which side is distal from the bottom face. The fastening member can be quickly assembled with the heat dissipation unit by means of inserting the latch section into the locating section of the heat dissipation unit. The heat dissipation device assembly structure has higher heat dissipation efficiency and is free from welding process so that the welding cost is saved.
Abstract:
A bobbin can be used for a magnetic component. The magnetic component includes at least one coil, and the coil includes at least one pin. The bobbin includes a body and a pin holder. The body includes a winding part and two plates. The winding part is used for winding the coil. The plates are respectively disposed on the opposites of the winding part. The pin holder is disposed on one of the plates, and it includes at least one locating hole for inserting the pin.
Abstract:
A reference frequency setting method of a flash memory storage apparatus is provided. The flash memory storage apparatus includes a flash memory module, a storage unit, and an oscillator circuit without a crystal. The reference frequency setting method includes following steps. Whether a setting code is stored in the flash memory module or the storage unit is determined, wherein the setting code includes information of a reference frequency. If the setting code is stored in the flash memory module, the setting code is read to allow the oscillator circuit to generate the reference frequency according to the setting code. A memory controller and a flash memory storage apparatus using the reference frequency setting method are also provided.
Abstract:
A light emitting device including a carrier, a substrate, at least one electrode pair, at least one light emitting diode (LED) and at least one positioning element is provided. The substrate is disposed on the carrier and has a body portion and at least one bending portion. The bending portion connects to the body portion. The bending portion is not coplanar with the body portion. The electrode pair is located on the body portion of the substrate. The LED is disposed on the body portion of the substrate and electrically connected to the electrode pair. The positioning element is disposed on the bending portion of the substrate for fixing the substrate on the carrier.
Abstract:
A server system and a management method thereof are provided. A main server is used to manage a plurality of hosts in the server system. The main server detects a device controller of each of the hosts for obtaining location information of each device controller. One Internet Protocol (IP) address is configured to each location information. A virtual network interface card (NIC) is established according to the IP address, and a remote package is received through the virtual NIC for transmitting package to the device controller corresponding to the virtual NIC.
Abstract:
The present disclosure provides a semiconductor memory device. The device includes a pinning layer having an anti-ferromagnetic material and disposed over a first electrode; a pinned layer disposed over the pinning layer; a composite layer disposed over the pinned layer, the composite layer having a magnetic material randomly distributed in a non-magnetic material; a barrier layer disposed on the composite layer; a free layer disposed over the barrier layer; and a second electrode disposed over the free layer.
Abstract:
Methods and apparatuses for a magnetic tunnel junction (MTJ) which can be used in as a magnetic random access memory cell are disclosed. The MTJ comprises a free layer and an insulator layer. The MTJ further comprises a pinned layer with a first region, a second region, and a third region. The second region is of a first length and of a first thickness, and the first region and the third region are of a second length and of a second thickness. A ratio of the first thickness to the second thickness may be larger than 1.2. A ratio of the second length to the first length is larger than 0.5. The first thickness may be larger than a spin diffusion length of a material for the pinned layer. So formed MTJ results in increased tunneling magnetic resistance ratio and reduced critical switch current of the MTJ.
Abstract:
Sustained release pharmaceutical formulations comprising an antihyperglycemic drug or a pharmaceutically acceptable salt thereof are disclosed. The formulations provide therapeutic plasma levels of the antihyperglycemic drug to a human patient over a 24 hour period after administration.