公开(公告)号：US20080131238A1

公开(公告)日：2008-06-05

申请号：US12030736

申请日：2008-02-13

申请人： Peter van der Meulen

发明人： Peter van der Meulen

IPC分类号： H01L21/00

CPC分类号： B65G25/02 ,  B65G37/00 ,  H01L21/67161 ,  H01L21/67196 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/68792 ,  Y10S414/139

摘要： Modular wafer transport and handling facilities are combined in a variety of ways deliver greater levels of flexibility, utility, efficiency, and functionality in a vacuum semiconductor processing system. Various processing and other modules may be interconnected with tunnel-and-cart transportation systems to extend the distance and versatility of the vacuum environment. Other improvements such as bypass thermal adjusters, buffering aligners, batch processing, multifunction modules, low particle vents, cluster processing cells, and the like are incorporated to expand functionality and improve processing efficiency.

摘要翻译： 模块化晶片输送和处理设备以各种方式组合，在真空半导体处理系统中提供更高水平的灵活性，效用，效率和功能。 各种加工和其他模块可以与隧道和车辆运输系统相互连接，以延长真空环境的距离和通用性。 引入诸如旁路热调节器，缓冲对准器，批处理，多功能模块，低粒子通风口，集束处理单元等的其它改进以扩展功能并提高处理效率。

公开(公告)号：US20080131237A1

公开(公告)日：2008-06-05

申请号：US12030902

申请日：2008-02-14

申请人： Peter van der Meulen

发明人： Peter van der Meulen

IPC分类号： H01L21/677 ,  B65H9/00 ,  B66C23/00 ,  B65H3/00

CPC分类号： B65G25/02 ,  B65G37/00 ,  H01L21/67161 ,  H01L21/67196 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/68792 ,  Y10S414/139

摘要： Modular wafer transport and handling facilities are combined in a variety of ways deliver greater levels of flexibility, utility, efficiency, and functionality in a vacuum semiconductor processing system. Various processing and other modules may be interconnected with tunnel-and-cart transportation systems to extend the distance and versatility of the vacuum environment. Other improvements such as bypass thermal adjusters, buffering aligners, batch processing, multifunction modules, low particle vents, cluster processing cells, and the like are incorporated to expand functionality and improve processing efficiency.

摘要翻译： 模块化晶片输送和处理设备以各种方式组合，在真空半导体处理系统中提供更高水平的灵活性，效用，效率和功能。 各种加工和其他模块可以与隧道和车辆运输系统相互连接，以延长真空环境的距离和通用性。 引入诸如旁路热调节器，缓冲对准器，批处理，多功能模块，低粒子通风口，集束处理单元等的其它改进以扩展功能并提高处理效率。

公开(公告)号：US20070135933A1

公开(公告)日：2007-06-14

申请号：US11386446

申请日：2006-03-21

申请人： Patrick Panesse ,  Peter van der Meulen

发明人： Patrick Panesse ,  Peter van der Meulen

IPC分类号： G05B11/01

CPC分类号： B25J9/1671 ,  G05B2219/33299 ,  G05B2219/34256 ,  G05B2219/40311 ,  G05B2219/45031

摘要： A programming interface for a hardware system includes an embedded layer for programmatic access to a physical realization of hardware, a simulation system for simulation of the hardware, and a diagnostics engine that analyzes and compares feedback data from the simulation system and the physical realization. The programming interface may be usefully employed, for example, in the design, purchase, and deployment of robotics for semiconductor manufacturing.

摘要翻译： 用于硬件系统的编程接口包括用于对硬件的物理实现进行编程访问的嵌入层，用于模拟硬件的仿真系统以及分析和比较来自仿真系统的反馈数据和物理实现的诊断引擎。 编程接口可以有用地用于例如用于半导体制造的机器人的设计，购买和部署。

公开(公告)号：US20050223837A1

公开(公告)日：2005-10-13

申请号：US10985730

申请日：2004-11-10

申请人： Peter van der Meulen

发明人： Peter van der Meulen

IPC分类号： B25J17/00 ,  B65G1/00 ,  B66C1/00 ,  F26B5/04 ,  F26B13/30 ,  G06F7/00 ,  G06F19/00 ,  H01L20060101 ,  H01L21/00 ,  H01L21/677

CPC分类号： H01L21/67167 ,  B25J9/042 ,  H01L21/67126 ,  H01L21/67161 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/67184 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67201 ,  H01L21/67207 ,  H01L21/67253 ,  H01L21/67259 ,  H01L21/67706 ,  H01L21/67727 ,  H01L21/67733 ,  H01L21/67736 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/67754 ,  H01L21/67757 ,  H01L21/67781 ,  H01L21/68 ,  H01L21/68707 ,  H01L21/68735 ,  Y10S414/135 ,  Y10S414/137 ,  Y10S414/139 ,  Y10T74/20305

摘要： Methods and systems are provided for handling materials in a vacuum semiconductor manufacturing process. The methods and systems include a motor drive system for a robotic component of the vacuum handling system, where the motor drive system can be removed from the robotic component without breaking the seal of the vacuum.

摘要翻译： 提供了用于在真空半导体制造工艺中处理材料的方法和系统。 所述方法和系统包括用于真空处理系统的机器人部件的马达驱动系统，其中马达驱动系统可以从机器人部件移除而不破坏真空的密封。

公开(公告)号：US08775148B2

公开(公告)日：2014-07-08

申请号：US11877180

申请日：2007-10-23

申请人： Patrick D. Pannese ,  Vinaya Kavathekar ,  Peter van der Meulen

发明人： Patrick D. Pannese ,  Vinaya Kavathekar ,  Peter van der Meulen

IPC分类号： G06G7/62 ,  G05B99/00

CPC分类号： G05B99/00 ,  G05B15/02 ,  G05B19/41865 ,  G05B19/41885 ,  G05B23/0267 ,  G05B2219/30 ,  G05B2219/31 ,  G05B2219/31467 ,  G05B2219/31472 ,  G05B2219/32128 ,  G05B2219/32267 ,  G05B2219/32329 ,  G05B2219/32335 ,  G05B2219/32342 ,  G05B2219/32351 ,  G05B2219/35494 ,  G05B2219/40411 ,  G05B2219/40412 ,  G05B2219/40413 ,  G05B2219/40419 ,  G05B2219/40424 ,  G05B2219/45031 ,  G06T7/0004 ,  H01L21/67161 ,  H01L21/67184 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67201 ,  H01L21/67207 ,  H01L21/67742 ,  H01L21/67745 ,  Y02P90/18 ,  Y02P90/20 ,  Y02P90/26 ,  Y02P90/86

摘要： Software for controlling processes in a heterogeneous semiconductor manufacturing environment may include a wafer-centric database, a real-time scheduler using a neural network, and a graphical user interface displaying simulated operation of the system. These features may be employed alone or in combination to offer improved usability and computational efficiency for real time control and monitoring of a semiconductor manufacturing process. More generally, these techniques may be usefully employed in a variety of real time control systems, particularly systems requiring complex scheduling decisions or heterogeneous systems constructed of hardware from numerous independent vendors.

摘要翻译： 用于控制异构半导体制造环境中的处理的软件可以包括以晶圆为中心的数据库，使用神经网络的实时调度器和显示系统的模拟操作的图形用户界面。 这些特征可以单独使用或组合使用以提供用于半导体制造过程的实时控制和监视的改进的可用性和计算效率。 更一般来说，这些技术可以有用地用于各种实时控制系统中，特别是需要复杂调度决策的系统或由许多独立供应商的硬件构成的异构系统。

公开(公告)号：US08612198B2

公开(公告)日：2013-12-17

申请号：US11877191

申请日：2007-10-23

申请人： Patrick D. Pannese ,  Vinaya Kavathekar ,  Peter van der Meulen

发明人： Patrick D. Pannese ,  Vinaya Kavathekar ,  Peter van der Meulen

IPC分类号： G06F17/50 ,  G06F7/50

CPC分类号： G05B99/00 ,  G05B15/02 ,  G05B19/41865 ,  G05B19/41885 ,  G05B23/0267 ,  G05B2219/30 ,  G05B2219/31 ,  G05B2219/31467 ,  G05B2219/31472 ,  G05B2219/32128 ,  G05B2219/32267 ,  G05B2219/32329 ,  G05B2219/32335 ,  G05B2219/32342 ,  G05B2219/32351 ,  G05B2219/35494 ,  G05B2219/40411 ,  G05B2219/40412 ,  G05B2219/40413 ,  G05B2219/40419 ,  G05B2219/40424 ,  G05B2219/45031 ,  G06T7/0004 ,  H01L21/67161 ,  H01L21/67184 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67201 ,  H01L21/67207 ,  H01L21/67742 ,  H01L21/67745 ,  Y02P90/18 ,  Y02P90/20 ,  Y02P90/26 ,  Y02P90/86

摘要： Software for controlling processes in a heterogeneous semiconductor manufacturing environment may include a wafer-centric database, a real-time scheduler using a neural network, and a graphical user interface displaying simulated operation of the system. These features may be employed alone or in combination to offer improved usability and computational efficiency for real time control and monitoring of a semiconductor manufacturing process. More generally, these techniques may be usefully employed in a variety of real time control systems, particularly systems requiring complex scheduling decisions or heterogeneous systems constructed of hardware from numerous independent vendors.

公开(公告)号：US08473270B2

公开(公告)日：2013-06-25

申请号：US11877214

申请日：2007-10-23

申请人： Patrick D. Pannese ,  Vinaya Kavathekar ,  Peter van der Meulen

发明人： Patrick D. Pannese ,  Vinaya Kavathekar ,  Peter van der Meulen

IPC分类号： G06F17/50

CPC分类号： G05B99/00 ,  G05B15/02 ,  G05B19/41865 ,  G05B19/41885 ,  G05B23/0267 ,  G05B2219/30 ,  G05B2219/31 ,  G05B2219/31467 ,  G05B2219/31472 ,  G05B2219/32128 ,  G05B2219/32267 ,  G05B2219/32329 ,  G05B2219/32335 ,  G05B2219/32342 ,  G05B2219/32351 ,  G05B2219/35494 ,  G05B2219/40411 ,  G05B2219/40412 ,  G05B2219/40413 ,  G05B2219/40419 ,  G05B2219/40424 ,  G05B2219/45031 ,  G06T7/0004 ,  H01L21/67161 ,  H01L21/67184 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67201 ,  H01L21/67207 ,  H01L21/67742 ,  H01L21/67745 ,  Y02P90/18 ,  Y02P90/20 ,  Y02P90/26 ,  Y02P90/86

摘要： Software for controlling processes in a heterogeneous semiconductor manufacturing environment may include a wafer-centric database, a real-time scheduler using a neural network, and a graphical user interface displaying simulated operation of the system. These features may be employed alone or in combination to offer improved usability and computational efficiency for real time control and monitoring of a semiconductor manufacturing process. More generally, these techniques may be usefully employed in a variety of real time control systems, particularly systems requiring complex scheduling decisions or heterogeneous systems constructed of hardware from numerous independent vendors.

公开(公告)号：US08439623B2

公开(公告)日：2013-05-14

申请号：US11382491

申请日：2006-05-10

申请人： Peter van der Meulen

发明人： Peter van der Meulen

IPC分类号： H01L21/677

CPC分类号： H01L21/67167 ,  B25J9/042 ,  H01L21/67126 ,  H01L21/67161 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/67184 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67201 ,  H01L21/67207 ,  H01L21/67253 ,  H01L21/67259 ,  H01L21/67706 ,  H01L21/67727 ,  H01L21/67733 ,  H01L21/67736 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/67754 ,  H01L21/67757 ,  H01L21/67781 ,  H01L21/68 ,  H01L21/68707 ,  H01L21/68735 ,  Y10S414/135 ,  Y10S414/137 ,  Y10S414/139 ,  Y10T74/20305

摘要： Methods and systems are provided for handling materials, including materials used in semiconductor manufacturing systems. The methods and systems include linear semiconductor processing facilities for vacuum-based semiconductor processing and handling, as well as linkable or extensible semiconductor processing facilities that can be flexibly configured to meet a variety of constraints.

摘要翻译： 提供了用于处理材料的方法和系统，包括在半导体制造系统中使用的材料。 该方法和系统包括用于基于真空的半导体处理和处理的线性半导体处理设备，以及可以灵活地配置以满足各种限制的可连接或可扩展的半导体处理设备。

公开(公告)号：US07945348B2

公开(公告)日：2011-05-17

申请号：US11877303

申请日：2007-10-23

申请人： Patrick D. Pannese ,  Vinaya Kavathekar ,  Peter van der Meulen

发明人： Patrick D. Pannese ,  Vinaya Kavathekar ,  Peter van der Meulen

IPC分类号： G06F3/048 ,  G05B19/402

CPC分类号： G05B99/00 ,  G05B15/02 ,  G05B19/41865 ,  G05B19/41885 ,  G05B23/0267 ,  G05B2219/30 ,  G05B2219/31 ,  G05B2219/31467 ,  G05B2219/31472 ,  G05B2219/32128 ,  G05B2219/32267 ,  G05B2219/32329 ,  G05B2219/32335 ,  G05B2219/32342 ,  G05B2219/32351 ,  G05B2219/35494 ,  G05B2219/40411 ,  G05B2219/40412 ,  G05B2219/40413 ,  G05B2219/40419 ,  G05B2219/40424 ,  G05B2219/45031 ,  G06T7/0004 ,  H01L21/67161 ,  H01L21/67184 ,  H01L21/6719 ,  H01L21/67196 ,  H01L21/67201 ,  H01L21/67207 ,  H01L21/67742 ,  H01L21/67745 ,  Y02P90/18 ,  Y02P90/20 ,  Y02P90/26 ,  Y02P90/86

摘要： Software for controlling processes in a heterogeneous semiconductor manufacturing environment may include a wafer-centric database, a real-time scheduler using a neural network, and a graphical user interface displaying simulated operation of the system. These features may be employed alone or in combination to offer improved usability and computational efficiency for real time control and monitoring of a semiconductor manufacturing process. More generally, these techniques may be usefully employed in a variety of real time control systems, particularly systems requiring complex scheduling decisions or heterogeneous systems constructed of hardware from numerous independent vendors.

公开(公告)号：US20080260500A1

公开(公告)日：2008-10-23

申请号：US12106975

申请日：2008-04-21

申请人： Peter van der Meulen

发明人： Peter van der Meulen

IPC分类号： H01L21/67

CPC分类号： B65G25/02 ,  B25J9/161 ,  B65G37/00 ,  G05B19/41865 ,  H01L21/67167 ,  H01L21/67276 ,  H01L21/67742 ,  H01L21/68707 ,  Y10S414/139 ,  Y10S706/904

摘要： A substrate-handling vacuum robot includes a first robotic arm with a single-substrate end effector and a second robotic arm with a batch end effector. The single-substrate end effector permits single-substrate pick-and-place operations while the batch end effector permits batch handling of substrates within a vacuum environment.

摘要翻译： 基板处理真空机器人包括具有单基板端部执行器的第一机器人臂和具有批尾端执行器的第二机器臂。 单衬底端部执行器允许单衬底拾取和放置操作，而批处理末端执行器允许在真空环境内批处理衬底。