Abstract:
A high resolution field emission display includes a faceplate and a baseplate. The faceplate includes a transparent viewing layer, a transparent conductive layer formed on the transparent viewing layer and intersecting stripes of light-absorbing, opaque insulating material formed on the transparent conductive layer. The insulating material defines openings less than one hundred microns wide between the intersecting stripes. The faceplate also includes a plurality of localized regions of cathodoluminescent material, each formed in one of the openings. The cathodoluminescent material includes a metal oxide providing reduced resistivity in the cathodoluminescent material. Significantly, the reduced resistivity of the cathodoluminescent material together with the focusing effect of the insulating material provide increased acuity in luminous images formed on the faceplate. The baseplate includes a substrate, an emitter formed on the substrate and a dielectric layer formed on the substrate and having an opening formed about the emitter. The baseplate also includes a conductive extraction grid formed on the dielectric layer and having an opening formed about the emitter.
Abstract:
According to one aspect of the invention, a field emission display is provided comprising: an anode; a phosphor screen located on the anode; a cathode; an evacuated space between the anode and the cathode; an emitter located on the cathode opposite the phosphor; wherein the emitter comprises an electropositive element both in a body of the emitter and on a surface of the emitter. According to another aspect of the invention a process for manufacturing an FED is provided comprising the steps of: forming an emitter comprising an electropositive element in the body of the tip; positioning the emitter in opposing relation to a phosphor display screen; creating an evacuated space between the emitter tip and the phosphor display screen; and causing the electropositive element to migrate to the an emission surface of the emitter.
Abstract:
The present invention is a baseplate that has a supporting substrate with a primary surface upon which an array of emitters is formed. An insulator layer with a plurality of cavities aligned with respective emitters is disposed on the primary surface, and an extraction grid with a plurality of cavity openings aligned with respective emitters is deposited on the insulator layer. The extraction grid is made from a silicon based layer of material. A current control substrate formed from the silicon based layer of material of the extraction grid is provided such that the current control substrate is electrically isolated from the extraction grid and electrically connected to the emitters. The current control substrate has sufficient resistivity to limit the current from the emitters.
Abstract:
A method for creating emitters of a field emission device is provided. First, a hardmask layer is deposited on a substrate used to form emitters. On the hardmask layer, a photoresist layer is deposited. Islands of photoresist are exposed by an exposing energy through holes in a mask layer. The mask layer is removed and the substrate soft-baked in an oven having an atmosphere of basic gas. Following the soft-bake, the substrate is flood exposed, and then developed using conventional means, leaving behind hardened islands of exposed and baked photoresist. The hardmask layer is etched using the hardened islands as an etching barrier, and the substrate etched with a chemical etchant using the etched hardmask layer as an etching barrier. The etching continues until the substrate material below the etched hardmask layer is formed into an array of points of substrate. Once these emitter sites are formed, a field emission display having uniform emitters can be created.
Abstract:
A field emission display with raised conductive features at bonding locations, and methods of forming the raised conductive features. In accordance with one embodiment of the invention, a plurality of applicators are arranged in a pattern corresponding to a pattern of bonding locations on either a baseplate or a faceplate of a field emission display. The bonding locations and respective applicators are aligned with each other, and then a predetermined quantity of a thick film conductive bonding material is deposited substantially simultaneously through each applicator onto each bonding location. The thick film conductive bonding material forms a conductive pad at each bonding location. The pads of thick film conductive bonding material are subsequently fired to form a raised feature at each bonding location.
Abstract:
The present invention is directed to a novel etching process for a semiconductor material which inhibits corrosion of metal comprised of pretreating the material, preferably with a surfactant, and then exposing the material to a mixture comprising salt, a buffered oxide etch, and optionally a surfactant.
Abstract:
A system and method for making adjustment to pixel boundaries of images in a screen display includes active adjustment of the ratio of the anode voltage and an extraction structure voltage to obtain a desired screen display effect. The viewer can thus actively adjust the image definition to obtain a desired effect at the borders of images on the screen display.
Abstract:
A method for fabricating sharp asperities. A substrate is provided which has a mask layer disposed thereon, and a layer of micro-spheres is disposed superjacent the mask layer. The micro-spheres are for patterning the mask layer. Portions of the mask layer are selectively removed, thereby forming circular masks. The substrate is isotropically etched, thereby creating sharp asperities.
Abstract:
A method of forming a surface conduction electron emitter is as follows. A first electrode and a second electrode are provided on a surface. The first and second electrodes are separated by a gap. A composition comprising particles and carrier material is provided over the surface. A portion of the composition that is over the surface is within the gap, and another portion of the composition that is over the surface is over the electrodes. The composition is exposed to a pattern of radiation to render the portion of the composition within the gap less soluble in a solvent than the portion of the composition that is over the electrodes. The composition is exposed to the solvent to remove an entirety of the portion of the composition that is over the electrodes while leaving the portion of the composition that is within the gap.
Abstract:
According to one aspect of the invention, a field emission display is provided comprising: an anode; a phosphor screen located on the anode; a cathode; an evacuated space between the anode and the cathode; an emitter located on the cathode opposite the phosphor; wherein the emitter comprises an electropositive element both in a body of the emitter and on a surface of the emitter. According to another aspect of the invention a process for manufacturing an FED is provided comprising the steps of: forming an emitter comprising an electropositive element in the body of the tip; positioning the emitter in opposing relation to a phosphor display screen; creating an evacuated space between the emitter tip and the phosphor display screen; and causing the electropositive element to migrate to the an emission surface of the emitter.