摘要:
A shallow trench isolation type semiconductor device includes a gate insulating layer formed in a first region and in a second region. The gate insulating layer is of greater thickness in the first region, relative to the thickness of the gate insulating layer in the second region. A shallow trench isolation layer is also formed in the first region and the second region, the shallow trench isolation layer in the first region being thinner than shallow trench isolation layer in the second region.
摘要:
A memory cell array of a non-volatile semiconductor memory device includes unit strings grouped into first strings belonging to a first string group and second strings belonging to a second string group. Each unit string has a memory cells for storing data in a non-volatile state. Each first string is coupled between an associated bit line of a first bit line group and a first common source line whereas each second string is coupled between an associated bit line of a second bit line group and a second common source line. The bit lines and the common source lines are made of different conductive layers. In accordance with the invention, it is possible to achieve a less critical layout of sense amplifiers coupled to bit lines while easily performing a photolithography process as required in the manufacture of the memory device.
摘要:
A non-volatile memory device is disclosed in which a pair of two adjacent memory cell strings are commonly connected to one bit line and the memory cell strings are selectively driven to obtain a relatively wide pitch margin between two bit lines. The device has a conductive plate line which is located along each memory cell string or a pair of memory cell strings to drive memory cells thereof with a relatively low program voltage to a word line. The memory device comprises a plurality of memory cell strings which are arranged in parallel with one another and each of which extends in the same direction as a bit line 12, and a pair of two adjacent memory cell strings 11a and 11b are commonly connected to the bit line 12. The memory device also comprises a string selector for selecting either the first string 11a or the second string 11b in response to signals from string select lines SSL1 and SSL2, and a plurality of plate lines PLa or 21a and PLb or 21b which are respectively arranged on the first and second strings 11a and 11b. In the memory cell, if voltages having different levels are applied to the control gate of a memory cell of the string selected thus and the plate line, at least more than two coupling voltages are induced to a floating gate of a corresponding memory cell so that two bits of information can be stored in and read out of one memory cell. The memory device has a cell structure in which a pair of two adjacent memory cell strings are commonly connected to one bit line, so that margin width between two bit lines, i.e., a bit line pitch can be relatively widely obtained.
摘要:
A nonvolatile memory device includes a string selection transistor, a plurality of memory cell transistors, and a ground selection transistor electrically connected in series to the string selection transistor and to the pluralities of memory cell transistors. First impurity layers are formed at boundaries of the channels and the source/drain regions of the memory cell transistors. The first impurity layers are doped with opposite conductivity type impurities relative to the source/drain regions of the memory cell transistors. Second impurity layers are formed at boundaries between a channel and a drain region of the string selection transistor and between a channel and a source region of the ground selection transistor. The second impurity layers are doped with the same conductivity type impurities as the first impurity layers and have a higher impurity concentration than the first impurity layers.
摘要:
A semiconductor device and a method of fabricating the same are provided. The semiconductor device includes a first dielectric pattern, a data storage pattern and a second dielectric pattern, which are sequentially stacked on a semiconductor substrate. A first conductive pattern is provided on the second dielectric pattern. A second conductive pattern having a greater width than the first conductive pattern is provided on the first conductive pattern.
摘要:
A non-volatile memory device includes an array of non-volatile memory cells configured to support single bit and multi-bit programming states. A control circuit is provided, which is configured to program a first page of non-volatile memory cells in the array as M-bit cells during a first programming operation and further configured to program the first page of non-volatile memory cells as N-bit cells during a second programming operation. The first and second programming operations are separated in time by at least one operation to erase the first page of non-volatile memory cells. M and N are unequal integers greater than zero.
摘要:
A cell array includes a semiconductor substrate including an active region comprising a first region, a second region, and a transition region, the second region being separated from the first region by the transition region, wherein a top surface of the second region is at a different level than a top surface of the first region. The cell array also includes a plurality of word lines crossing over the first region. The cell array also includes a selection line crossing over the active region, wherein at least a portion of the selection line is located over the transition region.
摘要:
In some embodiments, a semiconductor memory device includes a substrate that includes a cell array region and a peripheral circuit region. The semiconductor memory device further includes a device isolation pattern on the substrate. The device isolation pattern defines a first active region and a second active region within the cell array region and a third active region in the peripheral circuit region. The semiconductor memory device further includes a first common source region, a plurality of first source/drain regions, and a first drain region in the first active region. The semiconductor memory device further includes a second common source region, a plurality of second source/drain regions, and a second drain region in the second active region. The semiconductor memory device further includes a third source/drain region in the third active region. The semiconductor memory device further includes a common source line contacting the first and second common source regions.
摘要:
A nonvolatile memory device includes a string selection transistor, a plurality of memory cell transistors, and a ground selection transistor electrically connected in series to the string selection transistor and to the pluralities of memory cell transistors. First impurity layers are formed at boundaries of the channels and the source/drain regions of the memory cell transistors. The first impurity layers are doped with opposite conductivity type impurities relative to the source/drain regions of the memory cell transistors. Second impurity layers are formed at boundaries between a channel and a drain region of the string selection transistor and between a channel and a source region of the ground selection transistor. The second impurity layers are doped with the same conductivity type impurities as the first impurity layers and have a higher impurity concentration than the first impurity layers.
摘要:
Nonvolatile memory devices and methods of making the same are described. A nonvolatile memory device includes a string selection transistor, a plurality of memory cell transistors, and a ground selection transistor electrically connected in series to the string selection transistor and to the pluralities of memory cell transistors. Each of the transistors includes a channel region and source/drain regions. First impurity layers are formed at boundaries of the channels and the source/drain regions of the memory cell transistors. The first impurity layers are doped with opposite conductivity type impurities relative to the source/drain regions of the memory cell transistors. Second impurity layers are formed at boundaries between a channel and a drain region of the string selection transistor and between a channel and a source region of the ground selection transistor. The second impurity layers are doped with the same conductivity type impurities as the first impurity layers and have a higher impurity concentration than the first impurity layers.