公开(公告)号：US20200163253A1

公开(公告)日：2020-05-21

申请号：US16196372

申请日：2018-11-20

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Harvey J. Lunsman ,  Tahir Cader

IPC: H05K7/20 ,  G06F1/20 ,  H05K1/18 ,  H05K1/02

Abstract: An example cooling system is described herein. The cooling system can include a first cold plate including a first heat pipe to couple to a side of a dual in-line memory module (DIMM) where the first heat pipe transfers heat from the DIMM to the first cold plate; and a second cold plate including a second heat pipe to couple to the side of the DIMM, where the second heat pipe transfers heat from the DIMM to the second cold plate.

公开(公告)号：US20200159297A1

公开(公告)日：2020-05-21

申请号：US16774137

申请日：2020-01-28

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Zhikui Wang ,  Tuong Q. Tran ,  Tahir Cader ,  Chunjian Ni

IPC: G06F1/20 ,  G05D23/19 ,  H05K7/20

Abstract: In one implementation, a system for hybrid cooling control of a computing system includes a coordinated controller engine to: determine a number of liquid loop set-points and a number of air loop set-points, determine a number of system parameters corresponding to the number of liquid loop set-points and the number of air loop set-points, determine a correlation factor for the number of system parameters; and alter the number of liquid loop set-points and the number of air loop set-points based on the correlation factor to lower an energy consumption or to maximize energy reuse of a number of cooling resources associated with the number of system parameters.

公开(公告)号：US10548242B2

公开(公告)日：2020-01-28

申请号：US15329246

申请日：2014-07-31

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： Tahir Cader ,  Wade D Vinson ,  Douglas Kent Garday ,  John P Franz

IPC: H05K7/20 ,  G06F1/20 ,  H05K7/14

Abstract: A system to cool a module data center including a fluid cooling device to cool a first set of components of the module data center using a fluid cooling loop and an air cooling device to provide an air to cool a second set of components of the module data center. Also, a control apparatus to determine an air cooling temperature for the air cooling loop based on an environmental condition, determine a fluid cooling temperature for the fluid cooling loop based on the environmental condition, transmit an air signal to the air cooling device to set the air cooling temperature, and transmit a fluid signal to the fluid cooling device to set the fluid cooling temperature.

公开(公告)号：US10512195B2

公开(公告)日：2019-12-17

申请号：US15522634

申请日：2014-10-31

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： John P Franz ,  Tahir Cader

IPC: H05K7/20 ,  H05K1/14 ,  H05K7/14

Abstract: Example implementations relate to a server device with a capacitive circuit. For example, a server device with a capacitive circuit can include a capacitive circuit located on a printed circuit assembly (PCA) of the server device and a baseboard management controller unit (BMC) to provide a communication interface between the capacitive circuit and a computing device. A voltage can be applied across the capacitive circuit and a signal can be sent from the capacitive circuit to the computing device using the BMC in response to a change in voltage.

公开(公告)号：US10356957B2

公开(公告)日：2019-07-16

申请号：US15523674

申请日：2014-10-31

Applicant: HEWLETT PACKARD ENTERPRISE DEVELOPMENT LP

Inventor： John P Franz ,  Tahir Cader

IPC: H05K7/04 ,  H05K7/14 ,  H05K7/20

Abstract: Example implementations relate to an adaptive cooling assembly. For example, an adaptive cooling assembly includes a removable shelf installed in the adaptive cooling assembly, an adaptive cooling bay located in a slot formed by the removable shelf, and a removable thermal bus bar installed in the adaptive cooling bay and connected to a pair of connectors. The adaptive cooling bay includes the pair of connectors and the removable thermal bus bar provides liquid cooling to an electronic device.

公开(公告)号：US20180359881A1

公开(公告)日：2018-12-13

申请号：US15570692

申请日：2016-01-22

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Tahir Cader ,  Minh H. Nguyen

IPC: H05K7/20

CPC classification number: H05K7/20772 ,  G06F1/20 ,  H01L23/34 ,  H01L23/473 ,  H05K7/20 ,  H05K7/20254 ,  H05K7/20272 ,  H05K7/20781

Abstract: Examples herein disclose a system including a board and a cooling member. The board includes a first surface, a second surface, and a midpoint between the first and the surface, the boards supports an electrical component on the first surface. The cooling member is routed along the second surface of the board and delivers cooling liquid to the electrical component by crossing the midpoint of the board from the second surface to the first surface. The cooling member routes heated liquid from the electrical component by crossing the midpoint of the board from the first surface to the second surface.

公开(公告)号：US10143111B2

公开(公告)日：2018-11-27

申请号：US15476937

申请日：2017-03-31

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Matthew Slaby ,  Tuong Q Tran ,  Aaron Michael Childers ,  Tahir Cader

IPC: H05K7/20 ,  F04B49/20 ,  F04B51/00

Abstract: Examples herein disclose a coolant distribution unit (CDU) including a valve, a pump, and a controller. The valve controls a coolant through the CDU and the pump maintains a differential pressure of coolant to data center components. The controller exclusively controls the CDU to determine a position of the valve. In the response to the determined position of the valve, the CDU adjusts a speed of the pump.

公开(公告)号：US09997434B2

公开(公告)日：2018-06-12

申请号：US15311569

申请日：2014-05-19

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Niru Kumari ,  Tahir Cader ,  Sergio Escobar-Vargas ,  Cullen E. Bash

IPC: H05K7/20 ,  H01L23/473 ,  H01L23/427 ,  H01L23/34 ,  H01L25/065 ,  H01L23/02 ,  H01L25/18 ,  H01L23/44 ,  H01L23/467 ,  H01L23/48

CPC classification number: H01L23/427 ,  H01L23/02 ,  H01L23/34 ,  H01L23/44 ,  H01L23/467 ,  H01L23/473 ,  H01L23/4735 ,  H01L23/481 ,  H01L25/065 ,  H01L25/0657 ,  H01L25/18 ,  H01L2225/06589 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An example device in accordance with an aspect of the present disclosure includes a substrate that may be disposed in a housing. The substrate includes a sprayer to spray coolant.

公开(公告)号：US20180112656A1

公开(公告)日：2018-04-26

申请号：US15569249

申请日：2015-09-04

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Tahir Cader ,  John Franz ,  Sammy L. Zimmerman

IPC: F04B49/06 ,  F04B49/02

CPC classification number: F04B49/065 ,  F04B37/14 ,  F04B49/02 ,  F04B51/00 ,  G06F1/20 ,  G06F2200/201

Abstract: In one example implementation pump based issue identification includes monitoring a total number of operational cycles of a vacuum pump associated with a cooling device, comparing the total number of operational cycles to an operational cycle threshold, identify an issue based on the comparison of the total number of operational cycles to the operational cycle threshold, and generating a notification in response to identifying the issue.

公开(公告)号：US20180111846A1

公开(公告)日：2018-04-26

申请号：US15569650

申请日：2016-02-19

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Tahir Cader ,  Greg Scott Long ,  John Franz ,  Gardson Githu

IPC: C02F1/00 ,  G01N27/02 ,  A61L2/18 ,  C02F1/66 ,  C02F1/50

CPC classification number: C02F1/008 ,  A61L2/18 ,  A61L2/186 ,  A61L2202/14 ,  C02F1/50 ,  C02F1/66 ,  C02F2103/023 ,  C02F2209/005 ,  C02F2209/06 ,  C02F2303/04 ,  C02F2303/08 ,  G01N27/026 ,  G01N27/4167 ,  G01N33/18

Abstract: In the examples provided herein, a system includes an electrochemical sensor having two electrodes inserted in a fluid to be tested, where an alternative current (AC) voltage is applied across the two electrodes; an electrochemical sensor having two electrodes inserted in a fluid to be tested, wherein an alternative current (AC) voltage across the two electrodes; and a frequency response analyzer to analyze the measured the electrical response across multiple frequencies. The system also includes a memory to store a baseline of the electrical response across multiple frequencies, and a processor to determine from the stored baseline and the measured electrical response whether the electrical response is outside a predetermined range.