公开(公告)号：US20190288540A1

公开(公告)日：2019-09-19

申请号：US15920803

申请日：2018-03-14

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  Duixian Liu ,  Jean-Olivier Plouchart ,  John Knickerbocker

IPC: H02J7/02 ,  H04B1/3827 ,  H02J50/10 ,  H02J50/80 ,  H02J50/90 ,  A61L2/26 ,  A61L2/10 ,  A61L2/04 ,  A61L2/16

Abstract: Systems, devices, and techniques facilitating wirelessly charging and/or communicating with one or more electronic devices (e.g., electronic wearable devices) are provided. A device can comprise a memory and a storage component that can be operatively coupled to the memory. The storage component can comprise one or more recesses that can receive a second device that can be charged by the storage component. The storage component can comprise a charging circuit and an inductive circuit that can be coupled to the charging circuit. The storage component can harvest energy from one or more energy sources to charge the charging circuit. Based on the energy harvested, the inductive circuit can inductively couple to the second device having a second inductive circuit and positioned in at least one of the recesses and the inductive circuit can charge a power source of the second device.

公开(公告)号：US10325785B2

公开(公告)日：2019-06-18

申请号：US15855134

申请日：2017-12-27

Applicant: International Business Machines Corporation

Inventor： Paul S. Andry ,  Bing Dang ,  Jeffrey Donald Gelorme ,  Li-Wen Hung ,  John U. Knickerbocker ,  Cornelia Tsang Yang

IPC: H01L21/56 ,  H01L21/67 ,  H01L21/683 ,  H01L23/00

Abstract: Various embodiments process semiconductor devices. In one embodiment, a release layer is applied to a handler. The at least one singulated semiconductor device is bonded to the handler. The at least one singulated semiconductor device is packaged while it is bonded to the handler. The release layer is ablated by irradiating the release layer through the handler with a laser. The at least one singulated semiconductor device is removed from the transparent handler after the release layer has been ablated.

公开(公告)号：US10286198B2

公开(公告)日：2019-05-14

申请号：US15094003

申请日：2016-04-08

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  Duixian Liu ,  Jean-Olivier Plouchart

IPC: A61K9/22 ,  A61M31/00 ,  A61K9/00

Abstract: Devices and methods are provided for controlled delivery of medical substances such as drugs and medication. For example, a microchip medical substance delivery device includes a control system, and a medical substance capsule that comprises a medical substance contained with a reservoir, and a release structure to release the medical substance from within the reservoir in response to an activation signal generated by the control system. The control system comprises a wireless signal receiving element, processor, actuator circuit, and power supply source. The wireless signal receiving element captures a wireless signal. The processor detects an activation code embedded within the captured wireless signal, and generates an actuator control signal in response to the detection of the activation code. The actuator circuit generates the activation signal in response to the actuator control signal generated by the processor. The power supply source provides power to operate components of the control system.

公开(公告)号：US20190097183A1

公开(公告)日：2019-03-28

申请号：US15841720

申请日：2017-12-14

Applicant: International Business Machines Corporation

Inventor： Qianwen Chen ,  Bing Dang ,  John Knickerbocker ,  Bo Wen

IPC: H01M2/02 ,  H01M10/0525

Abstract: Systems and/or techniques associated with a solid-state microbattery packaging system are provided. In one example, a device comprises a substrate layer and a tape substrate layer. The substrate layer is associated with a set of solid-state microbattery components. The tape substrate comprises a releasable adhesive material and a polymer sealing material. A conductive surface associated with the set of solid-state microbattery components is disposed on the releasable adhesive material of the tape substrate layer.

公开(公告)号：US20190097182A1

公开(公告)日：2019-03-28

申请号：US15715722

申请日：2017-09-26

Applicant: International Business Machines Corporation

Inventor： Qianwen Chen ,  Bing Dang ,  John Knickerbocker ,  Bo Wen

IPC: H01M2/02 ,  H01M10/0525

Abstract: Systems and/or techniques associated with a solid-state microbattery packaging system are provided. In one example, a device comprises a substrate layer and a tape substrate layer. The substrate layer is associated with a set of solid-state microbattery components. The tape substrate comprises a releasable adhesive material and a polymer sealing material. A conductive surface associated with the set of solid-state microbattery components is disposed on the releasable adhesive material of the tape substrate layer.

公开(公告)号：US10243091B2

公开(公告)日：2019-03-26

申请号：US15944222

申请日：2018-04-03

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  John U. Knickerbocker ,  Steven Lorenz Wright ,  Cornelia Tsang Yang

IPC: H01L31/024 ,  H01L31/18 ,  H01J1/30

Abstract: A semiconductor structure includes a thin-film device layer, an optoelectronic device disposed in the thin-film device layer, and a surrogate substrate permanently attached to the thin film device layer. The surrogate substrate is optically transparent and has a thermal conductivity of at least 300 W/m-K. The optoelectronic device excitable by visible light transmitted through the surrogate substrate.

公开(公告)号：US10224229B2

公开(公告)日：2019-03-05

申请号：US15215658

申请日：2016-07-21

Applicant: International Business Machines Corporation

Inventor： Paul S. Andry ,  Russell A. Budd ,  Bing Dang ,  Li-Wen Hung ,  John U. Knickerbocker ,  Cornelia Kang-I Tsang

IPC: B23K26/57 ,  B32B43/00 ,  H01L21/683 ,  H01L21/67 ,  H01L21/78 ,  H01L23/544

Abstract: A bonded structure contains a substrate containing at least one feature, the substrate having a top surface; a first release layer overlying the top surface of the substrate, the first release layer being absorptive of light having a first wavelength for being decomposed by the light; an adhesive layer overlying the first release layer, and a second release layer overlying the adhesive layer. The second release layer is absorptive of light having a second wavelength for being decomposed by the light having the second wavelength. The bonded structure further contains a handle substrate that overlies the second release layer, where the handle substrate is substantially transparent to the light having the first wavelength and the second wavelength. Also disclosed is a debonding method to process the bonded structure to remove and reclaim the adhesive layer for re-use. In another embodiment a multi-step method optically cuts and debonds a bonded structure.

公开(公告)号：US10132836B2

公开(公告)日：2018-11-20

申请号：US14708198

申请日：2015-05-09

Applicant: International Business Machines Corporation

Inventor： Bing Dang ,  John Knickerbocker ,  Yang Liu ,  Maurice Mason ,  Lubomyr T. Romankiw

IPC: G01R1/073 ,  H01L23/00 ,  B81B3/00 ,  G01R31/26 ,  B23K35/00 ,  B81C1/00

Abstract: A method of forming surface protrusions on an article, and the article with the protrusions attached. The article may be an Integrated Circuit (IC) chip, a test probe for the IC chip or any suitable substrate or nanostructure. The surface protrusions are electroplated to a template or mold wafer, transferred to the article and easily separated from the template wafer. Thus, the attached protrusions may be, e.g., micro-bumps or micro pillars on an IC chip or substrate, test probes on a probe head, or one or more cantilevered membranes in a micro-machine or micro-sensor or other micro-electro-mechanical systems (MEMS) formed without undercutting the MEMS structure.

公开(公告)号：US20180323473A1

公开(公告)日：2018-11-08

申请号：US15802109

申请日：2017-11-02

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Qianwen Chen ,  Bing Dang ,  John U. Knickerbocker

IPC: H01M10/0585 ,  A61B5/00 ,  H01M10/0525

CPC classification number: H01M10/0585 ,  A61B5/681 ,  A61B5/6861 ,  A61B2560/0214 ,  H01M10/0525 ,  H01M2220/30

Abstract: A method for integrating a thin film microbattery with electronic circuitry includes forming a release layer over a handler, forming a thin film microbattery over the release layer of the handler, removing the thin film microbattery from the handler, depositing the thin film microbattery on an interposer, forming electronic circuitry on the interposer, and sealing the thin film microbattery and the electronic circuitry to create individual microbattery modules.

公开(公告)号：US10115711B2

公开(公告)日：2018-10-30

申请号：US15415505

申请日：2017-01-25

Applicant: International Business Machines Corporation

Inventor： Stephen W. Bedell ,  Bing Dang ,  Ning Li ,  Frank R. Libsch ,  Devendra K. Sadana

IPC: H01L25/07 ,  H01L33/32 ,  H01L33/62 ,  H01L33/30 ,  H01L29/00 ,  H01L25/075

Abstract: A structure containing a vertical light emitting diode (LED) is provided. The vertical LED is present in an opening located in a display substrate, and the vertical LED is coupled to a back contact structure via a magnetic back contact structure. A first top contact structure contacts a topmost surface of the vertical LED and a second top contact structure contacts a surface of the back contact structure.