公开(公告)号：US08249777B2

公开(公告)日：2012-08-21

申请号：US13136532

申请日：2011-08-03

申请人： Roland Greul ,  Thomas Werner

发明人： Roland Greul ,  Thomas Werner

IPC分类号： B62D6/00

CPC分类号： B62D6/008

摘要： In order to achieve a steering feel for SbW systems and EPS systems having a control design for controlling the steering torque by generating a target steering torque (torTB) that can be adapted to various steering systems, vehicle types, or requirements, in which the resulting steering feel is a steering feel, in all driving conditions and driving situations, which is equivalent to, or better than, hydraulic and electromechanical steering systems available on the market today, according to the invention: a base steering torque (torB) is determined as a function of an externally acting force (torR) and a vehicle speed (velV); a damping torque (torD) is determined as a function of a steering speed (anvSW) and the vehicle speed (velV); a hysteresis torque (torF) is determined as a function of the steering speed (anvSW) and the vehicle speed (velV); a centering torque (torCF; torC) in the direction of the straight-ahead position is determined as a function of a steering wheel angle (angSW) and the vehicle speed (velV); and the base steering torque (torB), the damping torque (torD), the hysteresis torque (torF) and the centering torque (torCF; torC) form individual components, as a function of which the target steering torque (torTB) is determined.

公开(公告)号：US20120153479A1

公开(公告)日：2012-06-21

申请号：US13190214

申请日：2011-07-25

申请人： Oliver Aubel ,  Christian Hennesthal ,  Frank Feustel ,  Thomas Werner

发明人： Oliver Aubel ,  Christian Hennesthal ,  Frank Feustel ,  Thomas Werner

IPC分类号： H01L23/522 ,  H01L21/768

CPC分类号： H01L23/53238 ,  H01L21/76847 ,  H01L21/76877 ,  H01L2924/0002 ,  H01L2924/00

摘要： In metallization systems of complex semiconductor devices, an intermediate interface layer may be incorporated into the interconnect structures in order to provide superior electromigration performance. To this end, the deposition of the actual fill material may be interrupted at an appropriate stage and the interface layer may be formed, for instance, by deposition, surface treatment and the like, followed by the further deposition of the actual fill metal. In this manner, the grain size issue, in particular at lower portions of the scaled inter-connect features, may be addressed.

摘要翻译： 在复杂半导体器件的金属化系统中，中间接口层可以并入到互连结构中，以便提供优异的电迁移性能。 为此，实际填充材料的沉积可以在适当的阶段被中断，并且界面层可以例如通过沉积，表面处理等形成，然后进一步沉积实际的填充金属。 以这种方式，可以解决晶粒尺寸问题，特别是在缩放的互连特征的较低部分。

公开(公告)号：US20120083972A1

公开(公告)日：2012-04-05

申请号：US13317625

申请日：2011-10-24

申请人： Stefan Gruener ,  Thomas Werner

发明人： Stefan Gruener ,  Thomas Werner

IPC分类号： B62D6/00

CPC分类号： B62D6/008

摘要： Provided is a way of using an estimator to determine a force (Fz), which acts from the outside on a steering gear of a steering device in a vehicle by way of a steering linkage, wherein a motor for generating a steering torque is assigned to the steering device. This is achieved by estimating the force (Fz) acting from the outside as a function of an effective motor torque (tor_RAeff), wherein the effective motor torque (tor_RAeff) is determined as a function of a motor torque and an efficiency, the efficiency being determined as a function of the estimated force (Fz).

摘要翻译： 提供了一种使用估计器来确定通过转向联动从外部在车辆中的转向装置的舵机上作用的力（Fz）的方法，其中用于产生转向转矩的电动机被分配给 转向装置。 这通过估计作为有效电动机转矩（tor_RAeff）的函数的从外部作用的力（Fz）来实现，其中有效电动机转矩（tor_RAeff）被确定为电动机转矩和效率的函数，效率为 作为估计力（Fz）的函数确定。

公开(公告)号：US07958092B2

公开(公告)日：2011-06-07

申请号：US11984040

申请日：2007-11-13

申请人： Thomas Werner ,  Claus Vetter ,  Lorenzo Gulli ,  Erik Svensson ,  Tatjana Kostic

发明人： Thomas Werner ,  Claus Vetter ,  Lorenzo Gulli ,  Erik Svensson ,  Tatjana Kostic

IPC分类号： G06F17/30

CPC分类号： G06F9/52

摘要： The present disclosure facilitates the interoperability between different local applications. Related local data objects are referenced via global objects or reference containers within a global data model or a global address space of an integration solution. The present disclosure assumes that the integration solution is per default in a consistent state, e.g., an engineered or initially configured global address space is regarded as consistent, and all software components that operate within this space assume that the information they access is valid and likewise consistent. The local applications are the only components that can interact with the global address space and introduce invalidations, they are continuously monitored for changes. Invalidation and subsequent synchronization or restoration of consistency is performed upon a particular triggering event related to a change in a local application object (such as an insertion or removal of an object or a modification of an attribute thereof) or related to a changing application or adapter status (component shutdown/startup).

摘要翻译： 本公开有利于不同本地应用之间的互操作性。 相关的本地数据对象通过集成解决方案的全局数据模型或全局地址空间中的全局对象或引用容器进行引用。 本公开假定集成解决方案是以一致的状态为默认的，例如，被设计或初始配置的全局地址空间被认为是一致的，并且在该空间内操作的所有软件组件假定他们访问的信息是有效的，同样地 一致 本地应用程序是唯一可与全局地址空间进行交互并引入无效的组件，它们将不断地被监视以进行更改。 在与本地应用对象的变化相关的特定触发事件（例如，对象的插入或移除或其属性的修改）或与改变的应用或适配器有关的特定触发事件上执行无效和随后的同步或恢复 状态（组件关闭/启动）。

公开(公告)号：US07500382B2

公开(公告)日：2009-03-10

申请号：US10551812

申请日：2004-04-01

申请人： Thomas Werner

发明人： Thomas Werner

IPC分类号： G01M3/20 ,  G01M3/38

CPC分类号： G01M3/228

摘要： A method for the detection of leaks in a heat exchanger having discrete flow paths for working fluid and heat exchange fluid, respectively, the method comprises introduction of a detection fluid within one of said flow paths and allowing air to flow through the other of said flow paths causing the detection fluid to pass in different directions in said one flow path, and detecting any detection fluid which has leaked from one flow path to said other flow path.

摘要翻译： 一种用于检测分别具有用于工作流体和热交换流体的流动路径的热交换器中的泄漏的方法，所述方法包括在所述流动路径之一内引入检测流体，并允许空气流过所述流体中的另一个 使所述检测流体在所述一个流路中沿不同方向通过的路径，以及检测从一个流路泄漏到所述另一个流路的任何检测流体。

公开(公告)号：US20080133613A1

公开(公告)日：2008-06-05

申请号：US11984040

申请日：2007-11-13

申请人： Thomas Werner ,  Claus Vetter ,  Lorenzo Gulli ,  Erik Svensson ,  Tatjana Kostic

发明人： Thomas Werner ,  Claus Vetter ,  Lorenzo Gulli ,  Erik Svensson ,  Tatjana Kostic

IPC分类号： G06F17/30

CPC分类号： G06F9/52

摘要： The present disclosure facilitates the interoperability between different local applications. Related local data objects are referenced via global objects or reference containers within a global data model or a global address space of an integration solution. The present disclosure assumes that the integration solution is per default in a consistent state, e.g., an engineered or initially configured global address space is regarded as consistent, and all software components that operate within this space assume that the information they access is valid and likewise consistent. The local applications are the only components that can interact with the global address space and introduce invalidations, they are continuously monitored for changes. Invalidation and subsequent synchronization or restoration of consistency is performed upon a particular triggering event related to a change in a local application object (such as an insertion or removal of an object or a modification of an attribute thereof) or related to a changing application or adapter status (component shutdown/startup).

摘要翻译： 本公开有利于不同本地应用之间的互操作性。 相关的本地数据对象通过集成解决方案的全局数据模型或全局地址空间中的全局对象或引用容器进行引用。 本公开假定集成解决方案是以一致的状态为默认的，例如，被设计或初始配置的全局地址空间被认为是一致的，并且在该空间内操作的所有软件组件假设他们访问的信息是有效的，同样地 一致 本地应用程序是唯一可与全局地址空间进行交互并引入无效的组件，它们将不断地被监视以进行更改。 在与本地应用对象的变化相关的特定触发事件（例如，对象的插入或移除或其属性的修改）或与改变的应用或适配器有关的特定触发事件上执行无效和随后的同步或恢复 状态（组件关闭/启动）。

公开(公告)号：US20070276970A1

公开(公告)日：2007-11-29

申请号：US10593095

申请日：2004-03-17

申请人： Thomas Werner ,  Claus Vetter ,  Erik Svensson ,  Thomas Koch

发明人： Thomas Werner ,  Claus Vetter ,  Erik Svensson ,  Thomas Koch

IPC分类号： G06F17/30

CPC分类号： H04L41/0869 ,  H04L41/00

摘要： Attribute consistency works on the comparison of a reference value against the online value of the attributes, which are retrieved from the corresponding system. In order to know which attributes need to be considered for consistency, a list of relevant attributes of each entity type in each application is stored together with the reference value of the entity. This attribute list is used by the consistency service. Therefore several attribute values of one entity in one system can be included in a combined “hash” value. At start-up or in the engineering phase, this reference value is computed out of the defined attribute list. At the time of a consistency check, the values of the attributes are read and a “hash” value is calculated with the same algorithm as the reference value. If those two values differ, an inconsistency occurred. The inventive method allows validating consistency of attributes of an entity in one of the participating applications. Any inconsistency can be propagated to all other participating applications which then may trigger functionality accordingly.

摘要翻译： 属性一致性用于比较参考值与属性的在线值，从相应的系统检索。 为了知道哪些属性需要考虑一致性，每个应用程序中每个实体类型的相关属性的列表与实体的参考值一起存储。 该属性列表由一致性服务使用。 因此，一个系统中的一个实体的几个属性值可以被包括在组合的“散列”值中。 在启动或工程阶段，该参考值是从定义的属性列表中计算的。 在一致性检查时，读取属性的值，并使用与参考值相同的算法计算“哈希”值。 如果这两个值不同，则发生不一致。 本发明的方法允许验证一个参与应用中的实体的属性的一致性。 任何不一致都可以传播到所有其他参与的应用程序，然后可以相应地触发功能。

公开(公告)号：US20070246156A1

公开(公告)日：2007-10-25

申请号：US11691697

申请日：2007-03-27

申请人： Heiko Kohlmann ,  Reinhard Hilscher ,  Hauke Esemann ,  Claudia Stolz ,  Thomas Werner ,  Ulrich Peuchert ,  Jose Zimmer

发明人： Heiko Kohlmann ,  Reinhard Hilscher ,  Hauke Esemann ,  Claudia Stolz ,  Thomas Werner ,  Ulrich Peuchert ,  Jose Zimmer

IPC分类号： B32B3/00

CPC分类号： C03C27/10 ,  Y10T428/16

摘要： A composite structure (10) is defined, consisting of components made of a zero-expansion material, in particular of a glass ceramic such as Zerodur®, which are joined together by at least one adhesive layer (17, 19, 26, 28, 30, 32). The composite structure (10) has the advantageous properties associated with zero-expansion materials, in particular a very low coefficient of thermal expansion, strength up to 150° C. and minimal outgassing.

摘要翻译： 复合结构（10）被定义为由零膨胀材料制成的部件，特别是由例如Zerodur的玻璃陶瓷组成的组件，它们通过至少一个粘合剂层（17,19,26， 28，30，32）。 复合结构（10）具有与零膨胀材料相关的有利特性，特别是非常低的热膨胀系数，高达150℃的强度和最小的除气。

公开(公告)号：US20060172525A1

公开(公告)日：2006-08-03

申请号：US11199526

申请日：2005-08-08

申请人： Thomas Werner ,  Matthias Schaller ,  Massud Aminpur

发明人： Thomas Werner ,  Matthias Schaller ,  Massud Aminpur

IPC分类号： H01L21/467

CPC分类号： H01L21/31138 ,  H01L21/31116 ,  H01L21/76808 ,  H01L21/76834

摘要： In an etch process for forming via openings and trench openings in a low-k dielectric layer, the material removal of an underlying etch stop layer is decoupled from the etching through the low-k dielectric in that the reduction in thickness is substantially achieved during the resist removal. For this purpose, the resist plasma etch may correspondingly be controlled to obtain the desired target thickness of the etch stop layer, wherein fluorine may be provided from an external source and/or fluorine may be generated in a controlled manner from polymer layers deposited within the etch chamber.

摘要翻译： 在用于在低k电介质层中形成通孔开口和沟槽开口的蚀刻工艺中，下层蚀刻停止层的材料去除与通过低k电介质的蚀刻分离，因为厚度的减小在 抵抗力消除。 为此，可以相应地控制抗蚀剂等离子体蚀刻以获得蚀刻停止层的期望目标厚度，其中可以从外部源提供氟，和/或​​氟可以以受控的方式从沉积在 蚀刻室。

公开(公告)号：US06867610B2

公开(公告)日：2005-03-15

申请号：US10441755

申请日：2003-05-20

申请人： Mathias Böttcher ,  Thomas Werner

发明人： Mathias Böttcher ,  Thomas Werner

IPC分类号： G01R31/28 ,  H01L23/544 ,  G01R31/02

CPC分类号： H01L22/34 ,  G01R31/2858 ,  G01R31/2884 ,  H01L22/32 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/056 ,  H01L2224/16 ,  H01L2924/00014

摘要： The present invention allows testing of bump connections under predefined conditions. To this end, a test structure including two substrates, each substrate having bond pads that are provided for flip-chip connecting both substrates. These bond pads may have electrical contact to other bond pads and/or special probe pads which are provided for making electrical connections to external devices. Electrically conductive bumps are formed on at least some of the bond pads of one of the substrates, and the bumps are electrically and mechanically connected to the bond pads in the other substrate.

摘要翻译： 本发明允许在预定条件下测试凸块连接。 为此，包括两个基板的测试结构，每个基板具有用于倒装芯片连接两个基板的接合焊盘。 这些接合焊盘可以与其它接合焊盘和/或专用探针焊盘电接触，这些焊盘用于与外部设备进行电连接。 在一个基板的至少一些接合焊盘上形成导电凸块，并且凸块电连接和机械连接到另一个基板中的接合焊盘。