TFT SUBSTRATE AND TFT SUBSTRATE MANUFACTURING METHOD
    94.
    发明申请
    TFT SUBSTRATE AND TFT SUBSTRATE MANUFACTURING METHOD 有权
    TFT基板和TFT基板制造方法

    公开(公告)号:US20100283055A1

    公开(公告)日:2010-11-11

    申请号:US12095681

    申请日:2006-11-30

    摘要: An object of the invention is to provide a TFT substrate and a method for producing a TFT substrate which is capable of drastically reducing the production cost by decreasing the number of steps in the production process and improving production yield. A TFT substrate comprises: a substrate; a first oxide layer formed above the substrate; a second oxide layer formed above the first oxide layer with a channel part interposed therebetween; a gate insulating film formed above the substrate, the first oxide layer and the second oxide layer; a gate electrode and a gate wire formed above the gate insulating film.

    摘要翻译: 本发明的目的是提供一种TFT基板和TFT基板的制造方法,其能够通过减少制造工序中的工序数和提高生产率而大大降低生产成本。 TFT基板包括:基板; 在基板上形成的第一氧化物层; 形成在所述第一氧化物层上方的第二氧化物层,其间插入有沟道部分; 在所述基板上形成的栅极绝缘膜,所述第一氧化物层和所述第二氧化物层; 形成在栅极绝缘膜上方的栅电极和栅极线。

    REFLECTIVE TFT SUBSTRATE AND METHOD FOR MANUFACTURING REFLECTIVE TFT SUBSTRATE
    95.
    发明申请
    REFLECTIVE TFT SUBSTRATE AND METHOD FOR MANUFACTURING REFLECTIVE TFT SUBSTRATE 审中-公开
    反射TFT基板和制造反射TFT基板的方法

    公开(公告)号:US20100163876A1

    公开(公告)日:2010-07-01

    申请号:US12278894

    申请日:2007-01-16

    IPC分类号: H01L27/088 H01L21/28

    摘要: A reflective TFT substrate which can be operated for a prolonged period of time due to the presence of a protective insulating film, is free from occurrence of crosstalk, and is capable of significantly reducing manufacturing cost by decreasing the production steps in the production process. A reflective TFT substrate 1 comprises a substrate 10; a gate electrode 23 and a gate wire 24; a gate insulating film 30; an n-type oxide semiconductor layer 40; a metal layer 60 formed with a channel part 41 interposed therebetween; and a protective insulating film 80 which covers the upper part of the glass substrate 10 on which a pixel electrode 67, a drain wire pad 68 and a gate wire pad 25 are exposed, wherein the metal layer 60 functions at least as a source wire 65, a drain wire 66, a source electrode 63, a drain electrode 64 and the pixel electrode 67.

    摘要翻译: 由于存在保护绝缘膜而能够长时间运转的反射型TFT基板不会发生串扰,并且能够通过减少制造工序中的制造工序而显着地降低制造成本。 反射型TFT基板1包括基板10; 栅电极23和栅极线24; 栅极绝缘膜30; n型氧化物半导体层40; 形成有介于其间的通道部41的金属层60; 以及覆盖玻璃基板10的上部的保护绝缘膜80,其上露出有像素电极67,漏极线焊盘68和栅极线焊盘25,其中金属层60至少起到源极线65的作用 漏极线66,源电极63,漏极电极64和像素电极67。

    SEMICONDUCTOR THIN FILM AND METHOD FOR MANUFACTURING SAME, AND THIN FILM TRANSISTOR
    96.
    发明申请
    SEMICONDUCTOR THIN FILM AND METHOD FOR MANUFACTURING SAME, AND THIN FILM TRANSISTOR 有权
    半导体薄膜及其制造方法及薄膜晶体管

    公开(公告)号:US20090267064A1

    公开(公告)日:2009-10-29

    申请号:US12093827

    申请日:2006-10-16

    摘要: The present invention provides a semiconductor thin film which can be manufactured at a relatively low temperature even on a flexible resin substrate. As a semiconductor thin film having a low carrier concentration, a high Hall mobility and a large energy band gap, an amorphous film containing zinc oxide and tin oxide is formed to obtain a carrier density of 10+17 cm−3 or less, a Hall mobility of 2 cm2/V·sec or higher, and an energy band gap of 2.4 eV or more. Then, the amorphous film is oxidized to form a transparent semiconductor thin film 40.

    摘要翻译: 本发明提供了即使在柔性树脂基板上也能够在相对低的温度下制造的半导体薄膜。 作为具有低载流子浓度,高霍尔迁移率和大能带隙的半导体薄膜,形成含有氧化锌和氧化锡的非晶体膜,以获得10 + 17cm-3以下的载流子密度,Hall 迁移率为2cm 2 / V·sec以上,能带隙为2.4eV以上。 然后,非晶膜被氧化以形成透明半导体薄膜40。

    Semiconductor, semiconductor device, complementary transistor circuit device
    99.
    发明授权
    Semiconductor, semiconductor device, complementary transistor circuit device 有权
    半导体,半导体器件,互补晶体管电路器件

    公开(公告)号:US08129714B2

    公开(公告)日:2012-03-06

    申请号:US11806995

    申请日:2007-06-05

    IPC分类号: H01L51/00

    摘要: A semiconductor device including a semiconductor 1, a first electrode 2, an insulating layer 3 interposed between the semiconductor 1 and the first electrode 2, the second electrode 4 which is in contact with the semiconductor 1 and is detached from the first electrode 2, and the third electrode 5 which is in contact with the semiconductor 1 and is detached from the first electrode 2 and the second electrode 4, wherein the semiconductor 1 is provided with the organic semiconductor layer 10 and the oxide semiconductor layer 11.

    摘要翻译: 包括半导体1,第一电极2,介于半导体1和第一电极2之间的绝缘层3,与半导体1接触并与第一电极2分离的第二电极4的半导体器件,以及 与半导体1接触并与第一电极2和第二电极4分离的第三电极5,其中半导体1设置有有机半导体层10和氧化物半导体层11。

    Fiber-Reinforced Resin Composition and Molded Body Thereof
    100.
    发明申请
    Fiber-Reinforced Resin Composition and Molded Body Thereof 审中-公开
    纤维增强树脂组合物及其成型体

    公开(公告)号:US20080242793A1

    公开(公告)日:2008-10-02

    申请号:US10592718

    申请日:2005-03-23

    申请人: Koki Yano

    发明人: Koki Yano

    IPC分类号: C08K3/04

    摘要: Disclosed is a fiber-reinforced polyolefin resin composition containing (A) 1-20 mass % of carbon fibers having a fiber diameter of 3-20 μm, (B) 3-50 mass % of black lead (graphite) having an average particle diameter of 1-100 μm, and (C) 25-95 mass % of a polyolefin resin, wherein the mass ratio of the black lead (graphite) (B) (Wg) to the carbon fibers (A) (Wcf), namely mass ratio (Wg/Wcf), is 1-10. Also disclosed is a molded body of such a fiber-reinforced polyolefin resin composition.

    摘要翻译: 公开了一种纤维增强聚烯烃树脂组合物,其含有(A)1-20质量%的纤维直径为3-20μm的碳纤维,(B)3-50质量%的具有平均粒径的黑色铅(石墨) (C)25-95质量%的聚烯烃树脂,其中黑铅(石墨)(B)(Wg)与碳纤维(A)的质量比(Wcf),即质量 (Wg / Wcf)为1-10。 还公开了这种纤维增强聚烯烃树脂组合物的成型体。