Apparatuses and methods including multilevel command and address signals

    公开(公告)号:US11842791B2

    公开(公告)日:2023-12-12

    申请号:US17805267

    申请日:2022-06-03

    Inventor: Kang-Yong Kim

    Abstract: Multilevel command and address (CA) signals are used to provide commands and memory addresses from a controller to a memory system. Using multilevel signals CA signals may allow for using fewer signals compared to binary signals to represent a same number of commands and/or address space, or using a same number of multilevel CA signals to represent a larger number of commands and/or address space. A number of external command/address terminals may be reduced without reducing a set of commands and/or address space. Alternatively, a number of external terminals may be maintained, but provide for an expanded set of commands and/or address space.

    Transaction management using metadata

    公开(公告)号:US11748033B2

    公开(公告)日:2023-09-05

    申请号:US17390093

    申请日:2021-07-30

    CPC classification number: G06F3/0659 G06F3/0604 G06F3/0679 G06F12/0238

    Abstract: Methods, systems, and devices for transaction management using metadata are described. In some examples, a memory device may include a volatile memory, and a non-volatile memory, which may have different access latencies. The memory device may receive from a host device a read command for data located at an address of the non-volatile memory. In response to the read command, the memory device and may determine whether the data is stored in the volatile memory. The memory device may then transmit, to the host device data and according to an expected latency, a set of data and an indication of whether the set of data was previously requested by the host device or unrequested by the host device. In some examples, the memory device may also transmit an identifier associated with the read command and a hash of the address.

    Shared error correction code (ECC) circuitry

    公开(公告)号:US11687407B2

    公开(公告)日:2023-06-27

    申请号:US17412050

    申请日:2021-08-25

    CPC classification number: G06F11/1068 G11C11/409

    Abstract: Described apparatuses and methods provide error correction code (ECC) circuitry that is shared between two or more memory banks of a memory, such as a low-power dynamic random-access memory (DRAM). A memory device may include one or more dies, and a die can have multiple memory banks. The ECC circuitry can service at least two memory banks by producing ECC values based on respective data stored in the two memory banks. By sharing the ECC circuitry, instead of including a per-bank ECC engine, a total die area allocated to ECC functionality can be reduced. Thus, the ECC circuitry can be elevated from a one-bit ECC algorithm to a multibit ECC algorithm, which may increase data reliability. In some cases, memory architecture may operate in environments in which a masked-write command or an internal read-modify-write operation is precluded, including with shared ECC circuitry.

    SEMICONDUCTOR DEVICE PERFORMING REFRESH OPERATION

    公开(公告)号:US20230154520A1

    公开(公告)日:2023-05-18

    申请号:US17454963

    申请日:2021-11-15

    CPC classification number: G11C11/40618 G11C11/40615

    Abstract: Disclosed herein is an apparatus that includes a plurality of memory banks and a refresh controller configured to perform a refresh operation on one or more of the plurality of memory banks having a first state without performing the refresh operation on one or more of the plurality of memory banks having a second state responsive to a first refresh command, and perform the refresh operation on a selected one of the plurality of memory banks responsive to a second refresh command. The refresh controller is configured to bring the selected one of the plurality of memory banks into the second state when the refresh operation is performed responsive to the second refresh command.

    DIE LOCATION DETECTION FOR GROUPED MEMORY DIES

    公开(公告)号:US20230052489A1

    公开(公告)日:2023-02-16

    申请号:US17818413

    申请日:2022-08-09

    Abstract: Methods, systems, and devices for die location detection for grouped memory dies are described. A memory device may include multiple memory die that are coupled with a shared bus. In some examples, each memory die may include a circuit configured to output an identifier associated with a location of the respective memory die. For example, a first memory die may output a first identifier, based on receiving one or more signals, that identifies a location of the first memory die. Identifying the locations of the respective memory dies may allow for the dies to be individually accessed despite being coupled with a shared bus.

    Write Timing Compensation
    98.
    发明申请

    公开(公告)号:US20220406365A1

    公开(公告)日:2022-12-22

    申请号:US17804422

    申请日:2022-05-27

    Abstract: This document describes apparatuses and techniques for write timing compensation. In various aspects, a write timing compensator of a memory controller can apply a delay to data signals transmitted to a memory circuit based on various operating parameters, which may include voltage or latency information. In some cases, the memory controller or memory circuit powers components of write timing compensation circuitry using a dynamic power rail that scales with an operating voltage of the memory circuit. By so doing, the write timing compensator or compensation circuits may improve signal integrity of data signals communicated between the memory controller and the memory circuit at different frequencies and voltages.

    APPARATUSES AND METHODS INCLUDING MULTILEVEL COMMAND AND ADDRESS SIGNALS

    公开(公告)号:US20220293147A1

    公开(公告)日:2022-09-15

    申请号:US17805278

    申请日:2022-06-03

    Inventor: Kang-Yong Kim

    Abstract: Multilevel command and address (CA) signals are used to provide commands and memory addresses from a controller to a memory system. Using multilevel signals CA signals may allow for using fewer signals compared to binary signals to represent a same number of commands and/or address space, or using a same number of multilevel CA signals to represent a larger number of commands and/or address space. A number of external command/address terminals may be reduced without reducing a set of commands and/or address space. Alternatively, a number of external terminals may be maintained, but provide for an expanded set of commands and/or address space.

    APPARATUSES AND METHODS INCLUDING MULTILEVEL COMMAND AND ADDRESS SIGNALS

    公开(公告)号:US20220293145A1

    公开(公告)日:2022-09-15

    申请号:US17805272

    申请日:2022-06-03

    Inventor: Kang-Yong Kim

    Abstract: Multilevel command and address (CA) signals are used to provide commands and memory addresses from a controller to a memory system. Using multilevel signals CA signals may allow for using fewer signals compared to binary signals to represent a same number of commands and/or address space, or using a same number of multilevel CA signals to represent a larger number of commands and/or address space. A number of external command/address terminals may be reduced without reducing a set of commands and/or address space. Alternatively, a number of external terminals may be maintained, but provide for an expanded set of commands and/or address space.

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