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公开(公告)号:US11842791B2
公开(公告)日:2023-12-12
申请号:US17805267
申请日:2022-06-03
Applicant: Micron Technology, Inc.
Inventor: Kang-Yong Kim
CPC classification number: G11C7/1084 , G11C7/106 , G11C7/1057 , G11C7/1087 , G11C8/10 , G11C8/18
Abstract: Multilevel command and address (CA) signals are used to provide commands and memory addresses from a controller to a memory system. Using multilevel signals CA signals may allow for using fewer signals compared to binary signals to represent a same number of commands and/or address space, or using a same number of multilevel CA signals to represent a larger number of commands and/or address space. A number of external command/address terminals may be reduced without reducing a set of commands and/or address space. Alternatively, a number of external terminals may be maintained, but provide for an expanded set of commands and/or address space.
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公开(公告)号:US11748033B2
公开(公告)日:2023-09-05
申请号:US17390093
申请日:2021-07-30
Applicant: Micron Technology, Inc.
Inventor: Chinnakrishnan Ballapuram , Kang-Yong Kim , Saira Samar Malik , Taeksang Song
CPC classification number: G06F3/0659 , G06F3/0604 , G06F3/0679 , G06F12/0238
Abstract: Methods, systems, and devices for transaction management using metadata are described. In some examples, a memory device may include a volatile memory, and a non-volatile memory, which may have different access latencies. The memory device may receive from a host device a read command for data located at an address of the non-volatile memory. In response to the read command, the memory device and may determine whether the data is stored in the volatile memory. The memory device may then transmit, to the host device data and according to an expected latency, a set of data and an indication of whether the set of data was previously requested by the host device or unrequested by the host device. In some examples, the memory device may also transmit an identifier associated with the read command and a hash of the address.
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93.
公开(公告)号:US11694736B2
公开(公告)日:2023-07-04
申请号:US17668592
申请日:2022-02-10
Applicant: MICRON TECHNOLOGY, INC.
Inventor: Kang-Yong Kim
IPC: G11C13/00 , G11C7/22 , G11C11/4076 , H03K5/156 , G11C7/10
CPC classification number: G11C7/222 , G11C7/109 , G11C7/1063 , G11C7/225 , G11C11/4076 , H03K5/1565
Abstract: Apparatuses and methods for setting a duty cycler adjuster for improving clock duty cycle are disclosed. The duty cycle adjuster may be adjusted by different amounts, at least one smaller than another. Determining when to use the smaller adjustment may be based on duty cycle results. A duty cycle monitor may have an offset. A duty cycle code for the duty cycle adjuster may be set to an intermediate value of a duty cycle monitor offset. The duty cycle monitor offset may be determined by identifying duty cycle codes for an upper and for a lower boundary of the duty cycle monitor offset.
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94.
公开(公告)号:US11694734B2
公开(公告)日:2023-07-04
申请号:US17495082
申请日:2021-10-06
Applicant: MICRON TECHNOLOGY, INC.
Inventor: Kang-Yong Kim
IPC: G11C7/22 , G11C11/4076 , H03K5/156 , G11C7/10
CPC classification number: G11C7/222 , G11C7/109 , G11C7/1063 , G11C7/225 , G11C11/4076 , H03K5/1565
Abstract: Apparatuses and methods for setting a duty cycler adjuster for improving clock duty cycle are disclosed. The duty cycle adjuster may be adjusted by different amounts, at least one smaller than another. Determining when to use the smaller adjustment may be based on duty cycle results. A duty cycle monitor may have an offset. A duty cycle code for the duty cycle adjuster may be set to an intermediate value of a duty cycle monitor offset. The duty cycle monitor offset may be determined by identifying duty cycle codes for an upper and for a lower boundary of the duty cycle monitor offset.
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公开(公告)号:US11687407B2
公开(公告)日:2023-06-27
申请号:US17412050
申请日:2021-08-25
Applicant: Micron Technology, Inc.
Inventor: Kang-Yong Kim , Hyun Yoo Lee
IPC: G11C11/00 , G06F11/10 , G11C11/409
CPC classification number: G06F11/1068 , G11C11/409
Abstract: Described apparatuses and methods provide error correction code (ECC) circuitry that is shared between two or more memory banks of a memory, such as a low-power dynamic random-access memory (DRAM). A memory device may include one or more dies, and a die can have multiple memory banks. The ECC circuitry can service at least two memory banks by producing ECC values based on respective data stored in the two memory banks. By sharing the ECC circuitry, instead of including a per-bank ECC engine, a total die area allocated to ECC functionality can be reduced. Thus, the ECC circuitry can be elevated from a one-bit ECC algorithm to a multibit ECC algorithm, which may increase data reliability. In some cases, memory architecture may operate in environments in which a masked-write command or an internal read-modify-write operation is precluded, including with shared ECC circuitry.
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公开(公告)号:US20230154520A1
公开(公告)日:2023-05-18
申请号:US17454963
申请日:2021-11-15
Applicant: MICRON TECHNOLOGY, INC.
Inventor: Atsushi Hatakeyama , Hyun Yoo Lee , Kang-Yong Kim , Akiyoshi Yamamoto
IPC: G11C11/406
CPC classification number: G11C11/40618 , G11C11/40615
Abstract: Disclosed herein is an apparatus that includes a plurality of memory banks and a refresh controller configured to perform a refresh operation on one or more of the plurality of memory banks having a first state without performing the refresh operation on one or more of the plurality of memory banks having a second state responsive to a first refresh command, and perform the refresh operation on a selected one of the plurality of memory banks responsive to a second refresh command. The refresh controller is configured to bring the selected one of the plurality of memory banks into the second state when the refresh operation is performed responsive to the second refresh command.
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公开(公告)号:US20230052489A1
公开(公告)日:2023-02-16
申请号:US17818413
申请日:2022-08-09
Applicant: Micron Technology, Inc.
Inventor: Hyunyoo Lee , Kang-Yong Kim , Yang Lu
IPC: G11C7/10 , H03K19/173 , H03K19/017
Abstract: Methods, systems, and devices for die location detection for grouped memory dies are described. A memory device may include multiple memory die that are coupled with a shared bus. In some examples, each memory die may include a circuit configured to output an identifier associated with a location of the respective memory die. For example, a first memory die may output a first identifier, based on receiving one or more signals, that identifies a location of the first memory die. Identifying the locations of the respective memory dies may allow for the dies to be individually accessed despite being coupled with a shared bus.
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公开(公告)号:US20220406365A1
公开(公告)日:2022-12-22
申请号:US17804422
申请日:2022-05-27
Applicant: Micron Technology, Inc.
Inventor: Kang-Yong Kim , Keun Soo Song , Hyun Yoo Lee
IPC: G11C11/4096 , G11C11/4076 , G11C11/4093 , G11C11/4074
Abstract: This document describes apparatuses and techniques for write timing compensation. In various aspects, a write timing compensator of a memory controller can apply a delay to data signals transmitted to a memory circuit based on various operating parameters, which may include voltage or latency information. In some cases, the memory controller or memory circuit powers components of write timing compensation circuitry using a dynamic power rail that scales with an operating voltage of the memory circuit. By so doing, the write timing compensator or compensation circuits may improve signal integrity of data signals communicated between the memory controller and the memory circuit at different frequencies and voltages.
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公开(公告)号:US20220293147A1
公开(公告)日:2022-09-15
申请号:US17805278
申请日:2022-06-03
Applicant: Micron Technology, Inc.
Inventor: Kang-Yong Kim
Abstract: Multilevel command and address (CA) signals are used to provide commands and memory addresses from a controller to a memory system. Using multilevel signals CA signals may allow for using fewer signals compared to binary signals to represent a same number of commands and/or address space, or using a same number of multilevel CA signals to represent a larger number of commands and/or address space. A number of external command/address terminals may be reduced without reducing a set of commands and/or address space. Alternatively, a number of external terminals may be maintained, but provide for an expanded set of commands and/or address space.
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公开(公告)号:US20220293145A1
公开(公告)日:2022-09-15
申请号:US17805272
申请日:2022-06-03
Applicant: Micron Technology, Inc.
Inventor: Kang-Yong Kim
Abstract: Multilevel command and address (CA) signals are used to provide commands and memory addresses from a controller to a memory system. Using multilevel signals CA signals may allow for using fewer signals compared to binary signals to represent a same number of commands and/or address space, or using a same number of multilevel CA signals to represent a larger number of commands and/or address space. A number of external command/address terminals may be reduced without reducing a set of commands and/or address space. Alternatively, a number of external terminals may be maintained, but provide for an expanded set of commands and/or address space.
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