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218 条记录 (耗时 0.035 秒)

    BUFFING APPARATUS FOR PRODUCTION OF RETREADED TIRE
    91.
    发明申请
    BUFFING APPARATUS FOR PRODUCTION OF RETREADED TIRE 有权
    用于生产轮胎的缓冲装置

    公开(公告)号：US20130005226A1

    公开(公告)日：2013-01-03

    申请号：US13575167

    申请日：2010-12-20

    申请人： Tetsuya Watanabe

    发明人： Tetsuya Watanabe

    IPC分类号： B24B55/00

    CPC分类号： B29D30/54 ,  B24B5/366 ,  B29D2030/541

    摘要： A buffing apparatus for production of a retreaded tire. The buffing apparatus can reliably prevent the scatter of buffing swarf and allows smooth transfer of the tire after the buffing operation. The buffing apparatus for production of a retreaded tire includes a grinder facing the tire and buffing its periphery, upper and lower scatter shields disposed about the grinder, spaced apart from each other in the tire radial direction, and coming in contact with the tire, and left and right scatter shields spaced apart from each other in the tire width (axial) direction and coming in contact with the tire. The left and right scatter shields are of such design as to be turnable from predetermined initial positions outward in the axial directions of the tire.

    摘要翻译： 用于生产翻新轮胎的抛光装置。 抛光装置可以可靠地防止抛光切屑的散射，并且可以在抛光操作之后平稳地转移轮胎。 用于生产翻新轮胎的抛光装置包括面向轮胎的研磨机和其周边抛光，设置在研磨机周围的上和下散射屏蔽物，在轮胎径向上彼此间隔开并与轮胎接触，并且 在轮胎宽度（轴向）方向上彼此间隔开并与轮胎接触的左右散射屏蔽。 左右散射屏具有从轮胎的轴向向外的预定初始位置可转动的设计。

    Semiconductor device
    92.
    发明授权
    Semiconductor device 失效
    半导体器件

    公开(公告)号：US08198698B2

    公开(公告)日：2012-06-12

    申请号：US12395202

    申请日：2009-02-27

    申请人： Satoshi Maeda ,  Yasushi Sekine ,  Tetsuya Watanabe

    发明人： Satoshi Maeda ,  Yasushi Sekine ,  Tetsuya Watanabe

    IPC分类号： H01L21/70 ,  H01L21/02

    CPC分类号： H01L28/60 ,  H01L23/5223 ,  H01L27/0207 ,  H01L27/0629 ,  H01L2924/0002 ,  H01L2924/00

    摘要： To improve a performance of a semiconductor device having a capacitance element. An MIM type capacitance element, an electrode of which is formed with comb-shaped metal patterns composed of the wirings, is formed over a semiconductor substrate. A conductor pattern, which is a dummy gate pattern for preventing dishing in a CMP process, and an active region, which is a dummy active region, are disposed below the capacitance element, and these are coupled to shielding metal patterns composed of the wirings and then connected to a fixed potential. Then, the conductor pattern and the active region are disposed so as not to overlap the comb-shaped metal patterns in the wirings in a planar manner.

    摘要翻译： 为了提高具有电容元件的半导体器件的性能。 在半导体衬底上形成MIM型电容元件，其电极形成有由配线构成的梳状金属图案。 作为用于防止CMP工艺中的凹陷的伪栅极图案的导体图案和作为虚拟有源区的有源区域设置在电容元件下方，并且这些导体图案耦合到由布线和 然后连接到固定电位。 然后，导体图案和有源区域被布置为不以平面方式与布线中的梳状金属图案重叠。

    LIGHT EMITTING ELEMENT, METHOD FOR MANUFACTURING THE LIGHT EMITTING ELEMENT, OPTICAL ELEMENT AND METHOD FOR MANUFACTURING THE OPTICAL ELEMENT
    98.
    发明申请
    LIGHT EMITTING ELEMENT, METHOD FOR MANUFACTURING THE LIGHT EMITTING ELEMENT, OPTICAL ELEMENT AND METHOD FOR MANUFACTURING THE OPTICAL ELEMENT 失效
    发光元件，制造发光元件的方法，光学元件和制造光学元件的方法

    公开(公告)号：US20100090236A1

    公开(公告)日：2010-04-15

    申请号：US12529984

    申请日：2007-03-05

    申请人： Yoshihisa Usami ,  Tadasuke Takahashi ,  Tetsuya Watanabe

    发明人： Yoshihisa Usami ,  Tadasuke Takahashi ,  Tetsuya Watanabe

    IPC分类号： H01L33/00

    CPC分类号： H01L33/10 ,  H01L33/54 ,  H01L33/58 ,  H01L2933/0091

    摘要： Fine asperities are simply formed in the surface of a light emission surface to improve an luminous efficiency of a light emitting element. An LED element 10 is prepared as an example of a luminous body, and a thermally deformable heat mode recording material layer 12 is formed in the light emission surface 18 of the LED element 10. The recording material layer 12 is then illuminated with condensed light so that a plurality of recessed portions 15 are formed at a pitch of 0.01-100 times a center wavelength of the light emitted from the LED element 10.

    摘要翻译： 在发光面的表面简单地形成微细的凹凸，以提高发光元件的发光效率。 准备LED元件10作为发光体的实例，并且在LED元件10的发光表面18中形成可热变形的热模式记录材料层12.然后，记录材料层12被聚光照射，因此 多个凹部15以从LED元件10发射的光的中心波长的0.01-100倍的间距形成。