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140 条记录 (耗时 0.027 秒)

    Water resistant composition
    91.
    发明授权
    Water resistant composition 失效
    防水组合物

    公开(公告)号：US5900463A

    公开(公告)日：1999-05-04

    申请号：US944553

    申请日：1997-10-07

    申请人： Seiji Tanimoto ,  Masato Nakamae ,  Toshiaki Sato

    发明人： Seiji Tanimoto ,  Masato Nakamae ,  Toshiaki Sato

    IPC分类号： C08K3/00 ,  C08K5/00 ,  C09J129/04 ,  C08F8/08 ,  C08F8/28 ,  C08F16/06 ,  C08F8/30

    CPC分类号： C08K5/0025 ,  C08K3/0008 ,  C09J129/04

    摘要： A composition comprising (A) polyvinyl alcohol having an amino group connected to a phenyl group and (B) at least one water resistance-imparting agent selected from polyepoxy compound, aldehyde compound, polyisocyanate compound, and water-soluble oxidizing agent; the composition exhibits outstanding water resistance even when used at room temperature; the composition finds use as a woodworking adhesive, plywood adhesive, and two-part instantaneously curing adhesive which does not require heating for curing.

    摘要翻译： 一种组合物，其包含（A）具有与苯基连接的氨基的聚乙烯醇和（B）至少一种选自聚环氧化合物，醛化合物，多异氰酸酯化合物和水溶性氧化剂的耐水性赋予剂; 该组合物即使在室温下使用也表现出优异的耐水性; 该组合物可用作木工粘合剂，胶合板粘合剂和两部分即时固化粘合剂，其不需要加热固化。

    Monolithic LCP polymer microelectronic wiring modules
    95.
    发明授权
    Monolithic LCP polymer microelectronic wiring modules 失效
    单片LCP聚合物微电子布线模块

    公开(公告)号：US5719354A

    公开(公告)日：1998-02-17

    申请号：US307958

    申请日：1994-09-16

    申请人： Randy Douglas Jester ,  Edwin Charles Culbertson ,  Detlef M. Frank ,  Sherman Hall Rounsville ,  John Arthur Penoyer ,  Takeichi Tsugaka ,  Minoru Onodera ,  Toshiaki Sato ,  Toru Sanefuji

    发明人： Randy Douglas Jester ,  Edwin Charles Culbertson ,  Detlef M. Frank ,  Sherman Hall Rounsville ,  John Arthur Penoyer ,  Takeichi Tsugaka ,  Minoru Onodera ,  Toshiaki Sato ,  Toru Sanefuji

    IPC分类号： B32B7/02 ,  B32B7/12 ,  C08L67/00 ,  C08L67/04 ,  H05K1/03 ,  H05K3/28 ,  H05K3/38 ,  H05K3/46 ,  H05K1/02

    CPC分类号： H05K3/4632 ,  H05K3/4617 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0195 ,  H05K2201/10378 ,  H05K3/28 ,  H05K3/386

    摘要： The invention provides a multilayer microelectronic circuit board including a laminate of a plurality of circuit layers containing conductive vias within the layers or a combination of conductive vias and conductive wiring patterns on a surface of the layers, the layers comprising a first liquid crystal polymer and, interposed between said circuit layers, a layer of second liquid crystal polymer having a melting point of at least about 10.degree. C. lower than the melting point of the first liquid crystal polymer. The boards are produced by stacking a plurality of circuit layer sheets in appropriate electrical alignment such that they are separated by an interposed layer of the second liquid crystal polymer of lower melting point, and heating the stacked polymer sheets under pressure sufficient to bond the sheets or layers into a microelectronic printed circuit board, the temperature of the heating being sufficient to melt the lower melting second polymer but insufficient to melt the polymer present in the circuit layers. The second polymer layer may be interposed as a separate sheet during assembly or may be present as one or two separate surface layers in contact with the higher melting point polymer of the circuit layers.

    摘要翻译： 本发明提供了一种多层微电子电路板，其包括多个电路层的叠层，该多个电路层在层内包含导电通孔，或者在该层的表面上的导电通路和导电布线图案的组合，该层包括第一液晶聚合物， 插入在所述电路层之间，具有比第一液晶聚合物的熔点低至少约10℃的第二液晶聚合物层。 这些板是通过以适当的电气对准层叠多个电路层片而制成的，使得它们被具有较低熔点的第二液晶聚合物的插入层隔开，并且在压力下加热堆叠的聚合物片材足以粘合片材或 层到微电子印刷电路板中，加热的温度足以熔化较低熔点的第二聚合物，但不足以熔化存在于电路层中的聚合物。 第二聚合物层可以在组装期间作为单独的片材插入，或者可以作为与电路层的较高熔点聚合物接触的一个或两个分开的表面层存在。

    Synchronizer ring
    98.
    发明授权
    Synchronizer ring 失效
    同步环

    公开(公告)号：US5370725A

    公开(公告)日：1994-12-06

    申请号：US155699

    申请日：1993-11-23

    申请人： Osamu Kawamura ,  Toshiaki Sato ,  Takao Omiya

    发明人： Osamu Kawamura ,  Toshiaki Sato ,  Takao Omiya

    IPC分类号： F16D23/06 ,  C22C33/02 ,  F16D23/02 ,  C22C29/00

    CPC分类号： C22C33/0278 ,  F16D23/025 ,  B22F2998/00

    摘要： A synchronizer ring having a stabilized friction characteristic relative to a taper cone and having sufficient mechanical strength and anti-abrasion characteristic. The synchronizer ring is made from a ferrous sintered alloy containing 0.2 to 1.0% by weight of carbon, 8.0 to 15.0% by weight of copper, 0.1 to 7.0% by weight of at least one component selected from a group consisting of chromium, manganese, molybdenum, and phosphorus, and balance iron and inevitable impurities. A free copper is precipitated in a matrix of the sintered alloy. Porosity of the sintered alloy is from 3 to 8 vol %.

    摘要翻译： 具有相对于锥形锥体具有稳定的摩擦特性并具有足够的机械强度和抗磨损特性的同步器环。 同步环由含有0.2〜1.0重量％碳，8.0〜15.0重量％的铜，0.1〜7.0重量％的选自铬，锰， 钼和磷，余量为铁和不可避免的杂质。 游离铜沉淀在烧结合金的基质中。 烧结合金的孔隙率为3〜8体积％。

    Process for producing polyvinyl ester having a high degree of polymerization and process for producing polyvinyl alcohol having a high degree of polymerization
    99.
    发明授权
    Process for producing polyvinyl ester having a high degree of polymerization and process for producing polyvinyl alcohol having a high degree of polymerization 失效
    具有高聚合度的聚乙烯酯的制造方法和具有高聚合度的聚乙烯醇的制造方法

    公开(公告)号：US5310790A

    公开(公告)日：1994-05-10

    申请号：US82162

    申请日：1993-06-28

    申请人： Toshiaki Sato ,  Ken Yuki ,  Junnosuke Yamauchi ,  Takuji Okaya

    发明人： Toshiaki Sato ,  Ken Yuki ,  Junnosuke Yamauchi ,  Takuji Okaya

    IPC分类号： C08F2/30 ,  C08F8/12 ,  C08F18/04 ,  C08G63/91

    CPC分类号： C08F18/04 ,  C08F8/12

    摘要： Disclosed herein is a new process for producing polyvinyl ester having a high degree of polymerization having an intrinsic viscosity not less than 1.5 dl/g, preferably not less than 2.2 dl/g, and most preferably higher than 3.2 dl/g, said process comprising subjecting vinyl ester monomer to low-temperature emulsion polymerization under specific conditions.Disclosed also herein is a new process for producing polyvinyl alcohol having a high degree of polymerization having an intrinsic viscosity not less than 1.5 dl/g, preferably not less than 2.2 dl/g, and most preferably higher than 3.2 dl/g, said process comprising saponifying in the usual way the polyvinyl ester obtained by low-temperature emulsion polymerization under specific conditions.

    摘要翻译： 本文公开了一种具有特性粘度不低于1.5dl / g，优选不小于2.2dl / g，最优选高于3.2dl / g的高聚合度的聚乙烯酯的新方法，所述方法包括 使乙烯基酯单体在特定条件下进行低温乳液聚合。 本文还公开了具有特性粘度不低于1.5dl / g，优选不小于2.2dl / g，最优选高于3.2dl / g的高聚合度的聚乙烯醇的新方法，所述方法 包括以通常的方式皂化在特定条件下通过低温乳液聚合获得的聚乙烯酯。

    Multilayered container and package utilizing the same
    100.
    发明授权
    Multilayered container and package utilizing the same 失效
    多层容器和使用该容器的包装

    公开(公告)号：US5221566A

    公开(公告)日：1993-06-22

    申请号：US853795

    申请日：1992-03-19

    申请人： Makio Tokoh ,  Akimasa Aoyama ,  Toshiaki Sato ,  Taichi Negi ,  Hidemasa Oda ,  Satoshi Hirofuji

    发明人： Makio Tokoh ,  Akimasa Aoyama ,  Toshiaki Sato ,  Taichi Negi ,  Hidemasa Oda ,  Satoshi Hirofuji

    IPC分类号： B32B27/08 ,  B65D65/40

    CPC分类号： B32B27/08 ,  Y10T428/1314 ,  Y10T428/1352 ,  Y10T428/259 ,  Y10T428/31913 ,  Y10T428/3192

    摘要： A multilayered container comprising an intermediate layer of a resin composition (A) which comprises 50-95% by weight of a specific EVOH, and 50-5% by weight of an inorganic filler, and inner and outer layers of a moisture resistant thermoplastic resin (B), at least the body wall part of the container comprising multiplicity of regions in which substantially 2-dimensional thin layers of the inorganic filler extend parallel with the wall surface and laminated with each other, said layer of said resin composition (A) having a specific moisture permeability.The multilayered container can readily be prepared by thermoforming from the corresponding multilayered structure.Food packages obtained by filling the multilayered container of the present invention with food, sealing it and then sterilizing the package under a condition where heat and moisture act at the same time as in retorting are resistant against impermeation of oxygen that would deteriorate the food contained therein, thus exhibiting excellent storage capability, and have good container appearance.