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    Monolithic LCP polymer microelectronic wiring modules
    1.
    发明授权
    Monolithic LCP polymer microelectronic wiring modules 失效
    单片LCP聚合物微电子布线模块

    公开(公告)号：US5719354A

    公开(公告)日：1998-02-17

    申请号：US307958

    申请日：1994-09-16

    申请人： Randy Douglas Jester ,  Edwin Charles Culbertson ,  Detlef M. Frank ,  Sherman Hall Rounsville ,  John Arthur Penoyer ,  Takeichi Tsugaka ,  Minoru Onodera ,  Toshiaki Sato ,  Toru Sanefuji

    发明人： Randy Douglas Jester ,  Edwin Charles Culbertson ,  Detlef M. Frank ,  Sherman Hall Rounsville ,  John Arthur Penoyer ,  Takeichi Tsugaka ,  Minoru Onodera ,  Toshiaki Sato ,  Toru Sanefuji

    IPC分类号： B32B7/02 ,  B32B7/12 ,  C08L67/00 ,  C08L67/04 ,  H05K1/03 ,  H05K3/28 ,  H05K3/38 ,  H05K3/46 ,  H05K1/02

    CPC分类号： H05K3/4632 ,  H05K3/4617 ,  H05K2201/0129 ,  H05K2201/0141 ,  H05K2201/0145 ,  H05K2201/0195 ,  H05K2201/10378 ,  H05K3/28 ,  H05K3/386

    摘要： The invention provides a multilayer microelectronic circuit board including a laminate of a plurality of circuit layers containing conductive vias within the layers or a combination of conductive vias and conductive wiring patterns on a surface of the layers, the layers comprising a first liquid crystal polymer and, interposed between said circuit layers, a layer of second liquid crystal polymer having a melting point of at least about 10.degree. C. lower than the melting point of the first liquid crystal polymer. The boards are produced by stacking a plurality of circuit layer sheets in appropriate electrical alignment such that they are separated by an interposed layer of the second liquid crystal polymer of lower melting point, and heating the stacked polymer sheets under pressure sufficient to bond the sheets or layers into a microelectronic printed circuit board, the temperature of the heating being sufficient to melt the lower melting second polymer but insufficient to melt the polymer present in the circuit layers. The second polymer layer may be interposed as a separate sheet during assembly or may be present as one or two separate surface layers in contact with the higher melting point polymer of the circuit layers.

    摘要翻译： 本发明提供了一种多层微电子电路板，其包括多个电路层的叠层，该多个电路层在层内包含导电通孔，或者在该层的表面上的导电通路和导电布线图案的组合，该层包括第一液晶聚合物， 插入在所述电路层之间，具有比第一液晶聚合物的熔点低至少约10℃的第二液晶聚合物层。 这些板是通过以适当的电气对准层叠多个电路层片而制成的，使得它们被具有较低熔点的第二液晶聚合物的插入层隔开，并且在压力下加热堆叠的聚合物片材足以粘合片材或 层到微电子印刷电路板中，加热的温度足以熔化较低熔点的第二聚合物，但不足以熔化存在于电路层中的聚合物。 第二聚合物层可以在组装期间作为单独的片材插入，或者可以作为与电路层的较高熔点聚合物接触的一个或两个分开的表面层存在。