公开(公告)号：US20240118335A1

公开(公告)日：2024-04-11

申请号：US18485252

申请日：2023-10-11

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Young Heum EOM

IPC: G01R31/26 ,  G01R1/04 ,  H05K1/11

CPC classification number: G01R31/2635 ,  G01R1/0416 ,  H05K1/118 ,  H05K2201/10106

Abstract: Proposed are a test device and a manufacturing method of the test device capable of testing a test object that is provided with an electrode which has a size and/or a pitch distance ranging from 1 to 100 micrometers (μm).

公开(公告)号：US20240094248A1

公开(公告)日：2024-03-21

申请号：US18275217

申请日：2022-01-27

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Chang Hee HONG

IPC: G01R1/067

CPC classification number: G01R1/06716 ,  G01R1/06733

Abstract: An electrically conductive contact pin which prevents a fatigue fracture in a void part by distributing stress concentration in the void part is provided. The electrically conductive contact pin includes: a first surface; a second surface facing the first surface; a lateral surface for connecting the first surface and the second surface; and a void part formed inside the electrically conductive contact pin by passing through the first surface and the second surface along the length direction of the electrically conductive contact pin. The void part includes: a center void part; and an end void part communicating with the center void part and extending toward an end side of the electrically conductive contact pin, wherein the width of the end void part is narrower than the width of the center void part.

公开(公告)号：US20240052516A1

公开(公告)日：2024-02-15

申请号：US18496161

申请日：2023-10-27

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN

IPC: C25D11/12 ,  C25D11/04 ,  C23C16/44

CPC classification number: C25D11/12 ,  C25D11/045 ,  C23C16/4404

Abstract: Proposed are a metal part for a process chamber and a method of forming a thin film layer of the metal part for the process chamber. More particularly, proposed are a metal part for a process chamber and a method of forming a thin film layer of the metal part for the process chamber, wherein the metal part is installed in a process chamber used in a display or semiconductor manufacturing process or constitutes a part of the process chamber, and a large thickness of the thin film layer of the metal part for the process chamber is easily secured, thereby achieving an extended lifespan by preventing cracks of the metal part for the process chamber, while preventing outgassing due to pores.

公开(公告)号：US20240038569A1

公开(公告)日：2024-02-01

申请号：US18037081

申请日：2021-12-08

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Jeong Hyuk LEE

IPC: H01L21/683

CPC classification number: H01L21/6835 ,  H01L2221/68354 ,  H01L2221/68322

Abstract: A micro device, a micro device alignment apparatus, and an alignment method using the same are proposed. In a micro device that has to be aligned with at least any one surface of front and rear surfaces of the micro device when mounted on a substrate and simultaneously be aligned with any one direction of the micro device when mounted on the substrate, there is provided the micro device, the micro device alignment apparatus, and the alignment method using the same so that surface alignment and direction alignment are simultaneously performed for a plurality of micro devices that is not aligned with at least any one surface of the front and rear surfaces and simultaneously is not aligned with any one direction.

公开(公告)号：US20230352229A1

公开(公告)日：2023-11-02

申请号：US18298936

申请日：2023-04-11

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Tae Hwan SONG

IPC: H01F27/28 ,  H01F27/29 ,  H01F41/04

CPC classification number: H01F27/2804 ,  H01F27/29 ,  H01F41/041 ,  H01F2027/2809

Abstract: Proposed are an inductor and a manufacturing method thereof. More particularly, proposed are an inductor capable of mass production by simplifying the manufacturing process while satisfying the needs for miniaturization and low resistance, and a manufacturing method thereof.

公开(公告)号：US20230160926A1

公开(公告)日：2023-05-25

申请号：US17919742

申请日：2021-04-20

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

IPC: G01R1/073

CPC classification number: G01R1/07342 ,  G01R1/07378

Abstract: Proposed is a probe card. The probe card according to the present disclosure includes: a circuit board; a probe head having a guide plate, and through which a plurality of probes pass; and a connection member electrically connecting the circuit board and the probes to each other, wherein an insulating part of the connection member and the guide plate are made of an anodic aluminum oxide film formed by anodizing a metal as a base material.

公开(公告)号：US20230143340A1

公开(公告)日：2023-05-11

申请号：US17919739

申请日：2021-04-20

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

IPC: G01R1/073 ,  G01R1/067

CPC classification number: G01R1/07371 ,  G01R1/06755 ,  G01R1/07342

Abstract: Proposed are a probe head and a probe card having the same. The probe head according to the present disclosure includes a plurality of guide plates each having a guide hole, wherein each of the guide plates has a shape in which a plurality of layers are stacked, and each of the guide plates includes: a first guide layer provided at a lowermost side thereof, and having a first guide hole; and a second guide layer provided at an uppermost side thereof, and having a second guide hole, wherein a side wall of the first guide hole and a side wall of the second guide hole are not provided on the same vertical line.

公开(公告)号：US20230008795A1

公开(公告)日：2023-01-12

申请号：US17779551

申请日：2020-10-19

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

IPC: H01L33/00 ,  H01L25/075

Abstract: Proposed is a method for manufacturing a micro LED display, the method including a step of preparing a plurality of first substrates having a plurality of micro LEDs, respectively, a step of preparing a plurality of second substrates, a segmented region formation step of segmenting each of the first substrates into a plurality of regions, and a step of transferring micro LEDs of one segmented region of each of the first substrates to an associated one of the second substrates, wherein the one second substrate comprises the micro LEDs of the first substrate.

公开(公告)号：US20220165604A1

公开(公告)日：2022-05-26

申请号：US17430206

申请日：2020-02-07

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Sung Hyun BYUN

IPC: H01L21/683 ,  H01L21/67

Abstract: A micro LED vacuum adsorption body configured to vacuum-adsorb micro LEDs is proposed. More particularly, the micro LED adsorption body is capable of preventing micro LED damage when adsorbing the micro LEDs.

公开(公告)号：US20210313491A1

公开(公告)日：2021-10-07

申请号：US17351019

申请日：2021-06-17

Applicant: POINT ENGINEERING CO., LTD.

Inventor： Bum Mo AHN ,  Seung Ho PARK ,  Moon Hyun KIM

IPC: H01L33/48 ,  H01L33/58 ,  H01L33/62 ,  H01L33/64

Abstract: An optical component package includes a main substrate including a plurality of metal bodies, and a vertical insulation part provided between the metal bodies; a cavity provided in an upper surface of the main substrate; a sub-substrate provided in the cavity of the main substrate, the sub-substrate including an insulating body, a plurality of via holes vertically passing through the insulating body and filled with a metal material being electrically connected to each of the metal bodies, and a plurality of metal pads mounted on the insulating body and electrically connected to the plurality of via holes; a plurality of optical components mounted on the plurality of metal pads and electrically connected to the plurality of metal pads; and a light transmitting member provided above the main substrate.